SE505723C2 - Förfarande och anordning för strippning av startplåt - Google Patents
Förfarande och anordning för strippning av startplåtInfo
- Publication number
- SE505723C2 SE505723C2 SE9003579A SE9003579A SE505723C2 SE 505723 C2 SE505723 C2 SE 505723C2 SE 9003579 A SE9003579 A SE 9003579A SE 9003579 A SE9003579 A SE 9003579A SE 505723 C2 SE505723 C2 SE 505723C2
- Authority
- SE
- Sweden
- Prior art keywords
- stripping
- motherboard
- rods
- starting plates
- stripped
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000002441 reversible effect Effects 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims 1
- 230000003028 elevating effect Effects 0.000 abstract 2
- 239000007858 starting material Substances 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1291106A JP2796600B2 (ja) | 1989-11-10 | 1989-11-10 | 種板の剥離方法及びその装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| SE9003579D0 SE9003579D0 (sv) | 1990-11-09 |
| SE9003579L SE9003579L (sv) | 1991-05-11 |
| SE505723C2 true SE505723C2 (sv) | 1997-10-06 |
Family
ID=17764531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE9003579A SE505723C2 (sv) | 1989-11-10 | 1990-11-09 | Förfarande och anordning för strippning av startplåt |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5074968A (ja) |
| JP (1) | JP2796600B2 (ja) |
| AU (1) | AU630844B2 (ja) |
| FI (1) | FI93864C (ja) |
| SE (1) | SE505723C2 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI108048B (fi) | 1999-06-10 | 2001-11-15 | Outokumpu Oy | Laite elektrolyyttisessä puhdistuksessa syntyneen saostuman irrottamiseksi |
| JP2002254279A (ja) * | 2001-02-27 | 2002-09-10 | Daito Seiki Kk | H形鋼用面研削装置 |
| KR200458282Y1 (ko) * | 2009-05-27 | 2012-01-31 | 투오 쉔 인터내셔널 코퍼레이션 리미티드 | 선형의 상하운동을 매개로 한 일 방향의 트위스팅을 통해 걸레를 탈수하는 기능을 갖는 자루걸레 |
| JP5565337B2 (ja) * | 2011-02-15 | 2014-08-06 | 住友金属鉱山株式会社 | 電着金属の剥離装置 |
| JP5974966B2 (ja) * | 2013-04-17 | 2016-08-23 | 住友金属鉱山株式会社 | 電着金属の剥離装置及び電着金属の剥離方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS525298B2 (ja) * | 1972-12-07 | 1977-02-12 | ||
| LU82691A1 (fr) * | 1980-08-06 | 1982-05-10 | Metallurgie Hoboken | Procede et installation pour separer un depot electrolytique des deux faces d'une cathode |
| AU594208B2 (en) * | 1986-11-04 | 1990-03-01 | Mount Isa Mines Limited | A method of stripping electrolytically deposited copper from a cathode |
| JPH0723550B2 (ja) * | 1987-03-12 | 1995-03-15 | 同和工営株式会社 | 金属電解用陰極板からの電着物の剥離方法及び装置 |
-
1989
- 1989-11-10 JP JP1291106A patent/JP2796600B2/ja not_active Expired - Lifetime
-
1990
- 1990-10-29 US US07/605,526 patent/US5074968A/en not_active Expired - Fee Related
- 1990-11-07 AU AU65894/90A patent/AU630844B2/en not_active Ceased
- 1990-11-09 SE SE9003579A patent/SE505723C2/sv not_active IP Right Cessation
- 1990-11-09 FI FI905564A patent/FI93864C/fi not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| FI93864C (fi) | 1995-06-12 |
| SE9003579D0 (sv) | 1990-11-09 |
| FI93864B (fi) | 1995-02-28 |
| AU630844B2 (en) | 1992-11-05 |
| JPH03153895A (ja) | 1991-07-01 |
| US5074968A (en) | 1991-12-24 |
| JP2796600B2 (ja) | 1998-09-10 |
| SE9003579L (sv) | 1991-05-11 |
| AU6589490A (en) | 1991-05-16 |
| FI905564A0 (fi) | 1990-11-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NUG | Patent has lapsed |
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