SE521891C2 - Förfarande och medel för exponering av elektriska komponenter i en komponentbärartejp - Google Patents

Förfarande och medel för exponering av elektriska komponenter i en komponentbärartejp

Info

Publication number
SE521891C2
SE521891C2 SE0103001A SE0103001A SE521891C2 SE 521891 C2 SE521891 C2 SE 521891C2 SE 0103001 A SE0103001 A SE 0103001A SE 0103001 A SE0103001 A SE 0103001A SE 521891 C2 SE521891 C2 SE 521891C2
Authority
SE
Sweden
Prior art keywords
tape
cover
carrier tape
exposure
carrier
Prior art date
Application number
SE0103001A
Other languages
English (en)
Swedish (sv)
Other versions
SE0103001L (sv
SE0103001D0 (sv
Inventor
Niclas Yman
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Priority to SE0103001A priority Critical patent/SE521891C2/sv
Publication of SE0103001D0 publication Critical patent/SE0103001D0/xx
Priority to JP2003528085A priority patent/JP4115939B2/ja
Priority to EP02797882A priority patent/EP1423997B1/de
Priority to CNB028170873A priority patent/CN1269393C/zh
Priority to PCT/SE2002/001582 priority patent/WO2003024180A1/en
Priority to DE60238539T priority patent/DE60238539D1/de
Priority to AT02797882T priority patent/ATE491328T1/de
Priority to US10/235,546 priority patent/US6699355B2/en
Publication of SE0103001L publication Critical patent/SE0103001L/xx
Publication of SE521891C2 publication Critical patent/SE521891C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Discharging, Photosensitive Material Shape In Electrophotography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SE0103001A 2001-09-07 2001-09-07 Förfarande och medel för exponering av elektriska komponenter i en komponentbärartejp SE521891C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE0103001A SE521891C2 (sv) 2001-09-07 2001-09-07 Förfarande och medel för exponering av elektriska komponenter i en komponentbärartejp
JP2003528085A JP4115939B2 (ja) 2001-09-07 2002-09-05 搬送テープ内の部品を露出する方法及び装置
EP02797882A EP1423997B1 (de) 2001-09-07 2002-09-05 Verfahren und mittel zum belichten von elektronischen komponenten in einem komponententrägerband
CNB028170873A CN1269393C (zh) 2001-09-07 2002-09-05 元件承载带中的元件的暴露方法和装置
PCT/SE2002/001582 WO2003024180A1 (en) 2001-09-07 2002-09-05 Method and means for exposing components in a component carrier tape
DE60238539T DE60238539D1 (de) 2001-09-07 2002-09-05 Verfahren und mittel zum belichten von elektronischen komponenten in einem komponententrägerband
AT02797882T ATE491328T1 (de) 2001-09-07 2002-09-05 Verfahren und mittel zum belichten von elektronischen komponenten in einem komponententrägerband
US10/235,546 US6699355B2 (en) 2001-09-07 2002-09-06 Method and means for exposing components in a component carrier tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0103001A SE521891C2 (sv) 2001-09-07 2001-09-07 Förfarande och medel för exponering av elektriska komponenter i en komponentbärartejp

Publications (3)

Publication Number Publication Date
SE0103001D0 SE0103001D0 (sv) 2001-09-07
SE0103001L SE0103001L (sv) 2003-03-08
SE521891C2 true SE521891C2 (sv) 2003-12-16

Family

ID=20285279

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0103001A SE521891C2 (sv) 2001-09-07 2001-09-07 Förfarande och medel för exponering av elektriska komponenter i en komponentbärartejp

Country Status (8)

Country Link
US (1) US6699355B2 (de)
EP (1) EP1423997B1 (de)
JP (1) JP4115939B2 (de)
CN (1) CN1269393C (de)
AT (1) ATE491328T1 (de)
DE (1) DE60238539D1 (de)
SE (1) SE521891C2 (de)
WO (1) WO2003024180A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220256746A1 (en) * 2019-07-19 2022-08-11 Fuji Corporation Tape guide, component supply device, and method for using tape guide

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE360980T1 (de) * 2003-11-07 2007-05-15 Mydata Automation Ab Ein verfahren und eine anlage zur aussetzung elektronischer bauteilen
US7378270B2 (en) * 2003-11-10 2008-05-27 Sentec Scientific, Inc. Device for analyte measurement
DE102005002568A1 (de) * 2005-01-19 2006-07-20 Siemens Ag Zuführeinrichtung für elektrische Bauelemente
CN101569251B (zh) * 2006-12-25 2012-05-30 富士机械制造株式会社 带式送料器以及配件保持带设置方法
USD590854S1 (en) * 2007-07-03 2009-04-21 3M Innovative Properties Company Device for accessing a recess of a carrier tape
JP4863956B2 (ja) * 2007-09-18 2012-01-25 富士機械製造株式会社 テープフィーダ
US8353424B2 (en) * 2009-01-27 2013-01-15 Hitachi High-Tech Instruments Co., Ltd. Component feeder
JP5967542B2 (ja) * 2012-10-22 2016-08-10 パナソニックＩｐマネジメント株式会社 キャリアテープのトップテープ剥離装置および剥離方法
CN102942076A (zh) * 2012-11-16 2013-02-27 昆山市力格自动化设备有限公司 料带输送机构
WO2014147799A1 (ja) * 2013-03-21 2014-09-25 富士機械製造株式会社 テープフィーダ
JP6681344B2 (ja) * 2015-01-22 2020-04-15 株式会社Ｆｕｊｉ フィーダ装置
WO2016143041A1 (ja) * 2015-03-09 2016-09-15 富士機械製造株式会社 フィーダ
US10772247B2 (en) * 2015-06-18 2020-09-08 Fuji Corporation Tape cutting processing apparatus and processing method
EP3313160B1 (de) * 2015-06-18 2024-02-28 FUJI Corporation Zuführer
CN108781527B (zh) * 2016-03-30 2020-06-23 雅马哈发动机株式会社 元件供给装置
CN110476494B (zh) * 2017-04-10 2021-04-06 雅马哈发动机株式会社 料带排出引导结构体、元件供应装置及元件安装机
DE112017007808T5 (de) * 2017-08-01 2020-06-10 Yamaha Hatsudoki Kabushiki Kaisha Verarbeitungsverfahren für ein vorderes Ende eines Bands, Vorrichtung zur Verarbeitung eines vorderen Endes eines Bands und Verarbeitungsvorrichtung für ein vorderes Ende eines Bands
JP6831918B2 (ja) * 2017-08-01 2021-02-17 ヤマハ発動機株式会社 部品供給装置及びこれを備えた部品実装機

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2662948B2 (ja) 1986-10-30 1997-10-15 ニツト− システム テクノロジ− インコ−ポレ−テツド チップテープのトップテープ除去装置
JP3670404B2 (ja) * 1996-06-28 2005-07-13 株式会社日立ハイテクインスツルメンツ 部品供給装置
WO1998037746A1 (fr) * 1997-02-20 1998-08-27 Matsushita Electric Industrial Co., Ltd. Dispositif d'alimentation en composants electroniques
EP1381265B1 (de) 1998-12-22 2007-08-01 Mydata Automation AB Bandführungsvorrichtung, Magazin und Systeme für eine Bauteilbestückungsmaschine
US6162007A (en) * 1999-01-14 2000-12-19 Witte; Stefan Apparatus for feeding electronic component tape
US6402452B1 (en) * 1999-04-26 2002-06-11 Hover-Davis, Inc. Carrier tape feeder with cover tape parting
US6619526B1 (en) * 2000-01-26 2003-09-16 Tyco Electronics Logistics Ag High-speed tape feeder for pick and place machines

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220256746A1 (en) * 2019-07-19 2022-08-11 Fuji Corporation Tape guide, component supply device, and method for using tape guide
US12513876B2 (en) * 2019-07-19 2025-12-30 Fuji Corporation Tape guide, component supply device, and method for using tape guide

Also Published As

Publication number Publication date
CN1269393C (zh) 2006-08-09
US20030049109A1 (en) 2003-03-13
US6699355B2 (en) 2004-03-02
EP1423997B1 (de) 2010-12-08
SE0103001L (sv) 2003-03-08
WO2003024180A1 (en) 2003-03-20
EP1423997A1 (de) 2004-06-02
JP2005503031A (ja) 2005-01-27
SE0103001D0 (sv) 2001-09-07
DE60238539D1 (de) 2011-01-20
CN1550126A (zh) 2004-11-24
JP4115939B2 (ja) 2008-07-09
ATE491328T1 (de) 2010-12-15

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