SE522045C2 - Förfarande för montering av ett halvledarchips - Google Patents

Förfarande för montering av ett halvledarchips

Info

Publication number
SE522045C2
SE522045C2 SE9801965A SE9801965A SE522045C2 SE 522045 C2 SE522045 C2 SE 522045C2 SE 9801965 A SE9801965 A SE 9801965A SE 9801965 A SE9801965 A SE 9801965A SE 522045 C2 SE522045 C2 SE 522045C2
Authority
SE
Sweden
Prior art keywords
recess
chip
mounting
tool
semiconductor chip
Prior art date
Application number
SE9801965A
Other languages
English (en)
Swedish (sv)
Other versions
SE9801965D0 (sv
SE9801965L (sv
Inventor
Viktor Anatolievich Iovdalsky
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SE9801965D0 publication Critical patent/SE9801965D0/xx
Publication of SE9801965L publication Critical patent/SE9801965L/xx
Publication of SE522045C2 publication Critical patent/SE522045C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
SE9801965A 1996-10-10 1998-06-03 Förfarande för montering av ett halvledarchips SE522045C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/RU1996/000292 WO1998015974A1 (en) 1996-10-10 1996-10-10 Method for mounting the crystal of semi-conductive device

Publications (3)

Publication Number Publication Date
SE9801965D0 SE9801965D0 (sv) 1998-06-03
SE9801965L SE9801965L (sv) 1998-06-03
SE522045C2 true SE522045C2 (sv) 2004-01-07

Family

ID=20130047

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9801965A SE522045C2 (sv) 1996-10-10 1998-06-03 Förfarande för montering av ett halvledarchips

Country Status (6)

Country Link
US (1) US6261492B1 (ja)
JP (1) JP3667773B2 (ja)
KR (1) KR100431031B1 (ja)
RU (1) RU2136078C1 (ja)
SE (1) SE522045C2 (ja)
WO (1) WO1998015974A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2171520C2 (ru) * 1999-05-25 2001-07-27 Воронежский государственный технический университет Способ сборки полупроводниковых приборов
US6676778B1 (en) * 2000-06-19 2004-01-13 Hitachi Global Storage Technologies Netherlands B.V. Method for bonding slider and suspension together and deciding conditions of laser beam irradiation
FR2819080B1 (fr) * 2000-12-28 2004-02-06 Thomson Csf Procede d'assemblage d'un composant tel qu'un circuit integre sur un substrat
RU2194337C1 (ru) * 2001-06-22 2002-12-10 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Исток" Устройство для монтажа кристалла
US7534320B2 (en) * 2005-11-15 2009-05-19 Northrop Grumman Corporation Lamination press pad
US7790507B2 (en) * 2007-03-24 2010-09-07 Texas Instruments Incorporated Semiconductor die collet and method
RU2387045C2 (ru) * 2008-04-18 2010-04-20 Государственное образовательное учреждение высшего профессионального образования "Воронежский государственный технический университет" Способ сборки полупроводниковых приборов
RU2527661C1 (ru) * 2013-02-11 2014-09-10 Открытое акционерное общество "Концерн радиостроения "Вега" Способ группового монтажа кристаллов при сборке высокоплотных электронных модулей
US11133866B2 (en) 2014-02-25 2021-09-28 Pharmaseq, Inc. All optical identification and sensor system with power on discovery
JP6244060B2 (ja) * 2016-01-06 2017-12-06 新電元工業株式会社 半導体デバイスの載置台及び車載装置
CN107408542B (zh) * 2016-01-06 2019-07-26 新电元工业株式会社 半导体器件的载置台以及车载装置
US10882258B1 (en) * 2016-01-22 2021-01-05 Pharmaseq, Inc. Microchip affixing probe and method of use
DE102018208881B4 (de) * 2018-06-06 2021-04-22 Vitesco Technologies GmbH Verfahren und Vorrichtung zur Bestückung eines Trägers mit einem Bauteil
EP4104317A4 (en) 2020-02-14 2024-03-06 P-Chip Ip Holdings Inc. LIGHT TRIGGERED TRANSPONDER
US12003967B2 (en) 2020-09-17 2024-06-04 P-Chip Ip Holdings Inc. Devices, systems, and methods using microtransponders

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2264632A (en) * 1939-02-14 1941-12-02 Armstrong Cork Co Adhesive applying device
US3963551A (en) * 1974-03-05 1976-06-15 Stromberg-Carlson Corporation Method for bonding semiconductor chips
NL7905518A (nl) * 1978-07-19 1980-01-22 Matsushita Electric Ind Co Ltd Werkwijze voor het monteren van elektronische delen.
US4480983A (en) * 1982-05-13 1984-11-06 Motorola, Inc. Collet and method for dispensing viscous materials
GB2138205B (en) * 1983-04-13 1986-11-05 Philips Electronic Associated Methods of manufacturing a microwave circuit
FR2599893B1 (fr) * 1986-05-23 1996-08-02 Ricoh Kk Procede de montage d'un module electronique sur un substrat et carte a circuit integre
US4749120A (en) * 1986-12-18 1988-06-07 Matsushita Electric Industrial Co., Ltd. Method of connecting a semiconductor device to a wiring board
RU2003207C1 (ru) * 1990-12-26 1993-11-15 Институт точной механики и вычислительной техники им.С.А.Лебедева РАН Способ изготовлени гибридной интегральной схемы
US5433810A (en) * 1992-09-16 1995-07-18 Abrams; Herbert M. Lamination of composite eyeglass lenses

Also Published As

Publication number Publication date
US6261492B1 (en) 2001-07-17
SE9801965D0 (sv) 1998-06-03
KR19990072027A (ko) 1999-09-27
RU2136078C1 (ru) 1999-08-27
WO1998015974A1 (en) 1998-04-16
KR100431031B1 (ko) 2004-07-27
SE9801965L (sv) 1998-06-03
JP2000516042A (ja) 2000-11-28
JP3667773B2 (ja) 2005-07-06

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Legal Events

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