SE7709165L - Gasetsning av aluminium och aluminiumoxid - Google Patents
Gasetsning av aluminium och aluminiumoxidInfo
- Publication number
- SE7709165L SE7709165L SE7709165A SE7709165A SE7709165L SE 7709165 L SE7709165 L SE 7709165L SE 7709165 A SE7709165 A SE 7709165A SE 7709165 A SE7709165 A SE 7709165A SE 7709165 L SE7709165 L SE 7709165L
- Authority
- SE
- Sweden
- Prior art keywords
- aluminum
- gas setting
- aluminum oxide
- oxide
- gas
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/26—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials
- H10P50/264—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means
- H10P50/266—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only
- H10P50/267—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only using plasmas
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
- H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
- H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/71—Etching of wafers, substrates or parts of devices using masks for conductive or resistive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/73—Etching of wafers, substrates or parts of devices using masks for insulating materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA259,126A CA1059882A (fr) | 1976-08-16 | 1976-08-16 | Burinage de l'aluminium et de l'alumine au plasma gazeux |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE7709165L true SE7709165L (sv) | 1978-02-17 |
Family
ID=4106655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7709165A SE7709165L (sv) | 1976-08-16 | 1977-08-12 | Gasetsning av aluminium och aluminiumoxid |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS5322836A (fr) |
| CA (1) | CA1059882A (fr) |
| DE (1) | DE2730156C2 (fr) |
| FR (1) | FR2362216A1 (fr) |
| GB (1) | GB1554335A (fr) |
| NL (1) | NL7706627A (fr) |
| SE (1) | SE7709165L (fr) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54118172A (en) * | 1978-03-06 | 1979-09-13 | Nichiden Varian Kk | Method of dry etching aluminum |
| US4226665A (en) * | 1978-07-31 | 1980-10-07 | Bell Telephone Laboratories, Incorporated | Device fabrication by plasma etching |
| US4208241A (en) * | 1978-07-31 | 1980-06-17 | Bell Telephone Laboratories, Incorporated | Device fabrication by plasma etching |
| US4256534A (en) * | 1978-07-31 | 1981-03-17 | Bell Telephone Laboratories, Incorporated | Device fabrication by plasma etching |
| DE2924475A1 (de) * | 1979-06-18 | 1981-01-15 | Siemens Ag | Verfahren zum herstellen einer metallisierung auf einem halbleiterkristall |
| JPS5623745A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Plasma etching device |
| US4341593A (en) * | 1979-08-17 | 1982-07-27 | Tokuda Seisakusyo, Ltd. | Plasma etching method for aluminum-based films |
| JPS5747876A (en) * | 1980-09-03 | 1982-03-18 | Toshiba Corp | Plasma etching apparatus and method |
| DE3103177A1 (de) * | 1981-01-30 | 1982-08-26 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von polysiliziumstrukturen bis in den 1 (my)m-bereich auf integrierte halbleiterschaltungen enthaltenden substraten durch plasmaaetzen |
| US4426246A (en) * | 1982-07-26 | 1984-01-17 | Bell Telephone Laboratories, Incorporated | Plasma pretreatment with BCl3 to remove passivation formed by fluorine-etch |
| JP2861785B2 (ja) * | 1994-02-15 | 1999-02-24 | 日本電気株式会社 | 半導体装置の配線の形成方法 |
| US9520303B2 (en) * | 2013-11-12 | 2016-12-13 | Applied Materials, Inc. | Aluminum selective etch |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3615956A (en) * | 1969-03-27 | 1971-10-26 | Signetics Corp | Gas plasma vapor etching process |
| US3757733A (en) * | 1971-10-27 | 1973-09-11 | Texas Instruments Inc | Radial flow reactor |
-
1976
- 1976-08-16 CA CA259,126A patent/CA1059882A/fr not_active Expired
-
1977
- 1977-06-13 GB GB24546/77A patent/GB1554335A/en not_active Expired
- 1977-06-16 NL NL7706627A patent/NL7706627A/xx not_active Application Discontinuation
- 1977-07-04 DE DE2730156A patent/DE2730156C2/de not_active Expired
- 1977-08-02 JP JP9230477A patent/JPS5322836A/ja active Granted
- 1977-08-12 SE SE7709165A patent/SE7709165L/xx unknown
- 1977-08-16 FR FR7725071A patent/FR2362216A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| FR2362216A1 (fr) | 1978-03-17 |
| GB1554335A (en) | 1979-10-17 |
| CA1059882A (fr) | 1979-08-07 |
| NL7706627A (nl) | 1978-02-20 |
| DE2730156A1 (de) | 1978-02-23 |
| JPS5322836A (en) | 1978-03-02 |
| DE2730156C2 (de) | 1986-01-16 |
| JPS5745310B2 (fr) | 1982-09-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| NO774380L (no) | Fremgangsmaate for fremstilling av aluminiumblikk | |
| SE405961C (sv) | Anordning for orientering och frammatning av forslutningskapsyler eller dylikt | |
| SE7701465L (sv) | Forfarande for ytbehandling av aluminium och aluminiumlegeringar | |
| SE7511388L (sv) | Forfarande for framstellning av finfordelade oxider av metaller och/eller av kisel | |
| PL204859A1 (pl) | Sposob otrzymywania czystego tlenku glinu | |
| IT1060717B (it) | Particelle d allumina sferoidali e procedimento per fabbricarle | |
| SE7709165L (sv) | Gasetsning av aluminium och aluminiumoxid | |
| SE431746B (sv) | Forfarande for framstellning av d-fenylglycinamid eller d-fenylglycin och l-fenylglycin | |
| PL204858A1 (pl) | Sposob otrzymywania czystego tlenku glinu | |
| SE411100B (sv) | Forfarande framstellning av stabiliserad gamma-aluminiumoxid | |
| SE423410B (sv) | Ferritlegering och anvendning av denna | |
| SE7704074L (sv) | Reduktion av vanadinoxider | |
| SE7607429L (sv) | Anvendning av aluminiumlegering | |
| SE413985B (sv) | Avgasningskolonn och anvendning av densamma | |
| SE416823B (sv) | Elektrisk ledare av aluminiumlegering och forfarande for dess framstellning | |
| NO782209L (no) | Fremgangsmaate og anordning for fremstilling av aluminium | |
| SE7600383L (sv) | Anleggning for kylning och haspling av valstrad | |
| SE7713183L (sv) | Selektiv diffusion av aluminium | |
| SE7704002L (sv) | Bestemning av katekolaminer | |
| NO147035C (no) | Gloedningsseparator paa magnesiumoksydbasis og anvendelse av samme | |
| SE7806719L (sv) | Gelsprengemneskompositioner sensibiliserade med aluminium och aminnitrat | |
| SE7708516L (sv) | Katalytisk utfellning av aluminium | |
| SE421863B (sv) | Dammfritt aluminiumpulver och forfarande for framstellning av detsamma | |
| SE7808528L (sv) | Forfarande for skyddsbeleggning av aluminium och aluminiumlegeringar | |
| SE416962B (sv) | Forfarande for forberedning av aluminium och aluminiumlegeringar for kallformning |