SE7909024L - BELEGGNINGSKOMPOSITION - Google Patents

BELEGGNINGSKOMPOSITION

Info

Publication number
SE7909024L
SE7909024L SE7909024A SE7909024A SE7909024L SE 7909024 L SE7909024 L SE 7909024L SE 7909024 A SE7909024 A SE 7909024A SE 7909024 A SE7909024 A SE 7909024A SE 7909024 L SE7909024 L SE 7909024L
Authority
SE
Sweden
Prior art keywords
reaction product
filler
polymerisable
organic solvent
photopolymerisable
Prior art date
Application number
SE7909024A
Other languages
Swedish (sv)
Other versions
SE445647B (en
Inventor
R W Courtney
S J Parker
A C Threadgold
Original Assignee
Coates Brothers & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coates Brothers & Co filed Critical Coates Brothers & Co
Publication of SE7909024L publication Critical patent/SE7909024L/en
Publication of SE445647B publication Critical patent/SE445647B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/026—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

A coating composition which is suitable for the production of photopolymerisable coatings on contact wafers for solder masks, contains the following: a) an ethylenically unsaturated, polymerisable reaction product of an aromatic polyepoxide and an ethylenically unsaturated carboxylic acid. The product is solid or semisolid. b) An inert, inorganic filler. The filler and the reaction product (a) are present in a weight ratio of from 20 to 65 parts of filler to from 80 to 35 parts of reaction product. c) A photopolymerisation initiator for the polymerisable reaction product, and d) a volatile organic solvent for the polymerisable reaction product. The materials are applied to a substrate, for example to contact wafers. They are allowed to dry by evaporation of the organic solvent in order to give, on the substrate, a photopolymerisable coating which can be treated by actinic radiation, for example through a template pattern. The material treated in this way is insensitive to hot soldering and is accordingly suitable as a solder mask in the production of printed circuits.
SE7909024A 1978-11-01 1979-10-31 SET TO EDUCATE A SAMPLE OF SOLID METAL ON A LAYER OF AN ELECTRICALLY CONDUCTIVE METAL SE445647B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7842748 1978-11-01

Publications (2)

Publication Number Publication Date
SE7909024L true SE7909024L (en) 1980-05-02
SE445647B SE445647B (en) 1986-07-07

Family

ID=10500726

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7909024A SE445647B (en) 1978-11-01 1979-10-31 SET TO EDUCATE A SAMPLE OF SOLID METAL ON A LAYER OF AN ELECTRICALLY CONDUCTIVE METAL

Country Status (10)

Country Link
JP (1) JPS6032360B2 (en)
BR (1) BR7907098A (en)
CH (1) CH645395A5 (en)
DE (1) DE2944097A1 (en)
DK (1) DK460579A (en)
FR (1) FR2440978B1 (en)
HK (1) HK75587A (en)
IT (1) IT1124219B (en)
NO (1) NO159729C (en)
SE (1) SE445647B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR8103183A (en) * 1980-05-27 1982-02-09 Du Pont FINE PHOTO-SENSITIVE LAYER; PHOTO-RESISTOR ELEMENT; SUBSTRATE WITH A FINE LAMINATE PHOTO-SENSITIVE LAYER;
JPS62178542A (en) * 1986-01-30 1987-08-05 Nippon Kayaku Co Ltd (meth)acrylic acid ester and reactive compound for coating or printing ink
EP0281808B1 (en) * 1987-03-12 1994-07-20 Siemens Aktiengesellschaft Radiation cross-linkable polymer system for application as photoresist and dielectric for micro wiring
CA2055833C (en) * 1990-11-20 2001-04-24 Katsue Nishikawa Preparation of unsaturated epoxy ester resin and carboxylated unsaturated epoxy ester resin and photosensitive composition comprising the same
WO2009110503A1 (en) 2008-03-05 2009-09-11 株式会社日本触媒 Polymer, curable resin composition, cured product, and article

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1549956A (en) * 1967-03-02 1968-12-13
US3661576A (en) * 1970-02-09 1972-05-09 Brady Co W H Photopolymerizable compositions and articles
US3876432A (en) * 1972-09-11 1975-04-08 Sun Chemical Corp Fatty ester modified epoxy resin photopolymerizable compositions
DE2326314C2 (en) * 1973-05-23 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Process for the production of relief structures
JPS5017827A (en) * 1973-06-18 1975-02-25
FR2255629B1 (en) * 1973-12-20 1976-10-22 Ibm
US4072592A (en) * 1974-05-20 1978-02-07 Mobil Oil Corporation Radiation curable coating
US4003877A (en) * 1974-05-24 1977-01-18 Dynachem Corporation Photopolymerizable screen printing inks for permanent coatings prepared from aryloxyalkyl compositions
DE2534012C3 (en) * 1975-07-30 1981-05-14 Bayer Ag, 5090 Leverkusen Process for the production of binders
DE2702660C3 (en) * 1976-01-27 1980-07-10 Ppg Industries, Inc., Pittsburgh, Pa. (V.St.A.) Radiation-curable coating compositions and process for their preparation
JPS52117985A (en) * 1976-03-30 1977-10-03 Hitachi Chem Co Ltd Photosensitive polymer composition
CA1116919A (en) * 1976-10-27 1982-01-26 Joseph E. Gervay Flame retardant radiation sensitive element of photopolymerizable composition containing halogen and an acrylonitrile containing polymeric binder

Also Published As

Publication number Publication date
NO159729B (en) 1988-10-24
CH645395A5 (en) 1984-09-28
JPS6032360B2 (en) 1985-07-27
HK75587A (en) 1987-10-23
JPS5562976A (en) 1980-05-12
DE2944097C2 (en) 1988-07-28
SE445647B (en) 1986-07-07
IT1124219B (en) 1986-05-07
FR2440978A1 (en) 1980-06-06
NO793475L (en) 1980-05-05
IT7912796A0 (en) 1979-10-31
DK460579A (en) 1980-05-02
DE2944097A1 (en) 1980-05-14
NO159729C (en) 1989-02-01
BR7907098A (en) 1980-10-07
FR2440978B1 (en) 1985-07-19

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