SG101461A1 - Single wafer type substrate cleaning method and apparatus - Google Patents

Single wafer type substrate cleaning method and apparatus

Info

Publication number
SG101461A1
SG101461A1 SG200105177A SG200105177A SG101461A1 SG 101461 A1 SG101461 A1 SG 101461A1 SG 200105177 A SG200105177 A SG 200105177A SG 200105177 A SG200105177 A SG 200105177A SG 101461 A1 SG101461 A1 SG 101461A1
Authority
SG
Singapore
Prior art keywords
wafer
type substrate
single wafer
supplied
wafer type
Prior art date
Application number
SG200105177A
Other languages
English (en)
Inventor
Ono Yuji
Ohkura Ryoichi
Original Assignee
S E S Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by S E S Company Ltd filed Critical S E S Company Ltd
Publication of SG101461A1 publication Critical patent/SG101461A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
SG200105177A 2000-12-05 2001-08-24 Single wafer type substrate cleaning method and apparatus SG101461A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000370718A JP2002176026A (ja) 2000-12-05 2000-12-05 枚葉式基板洗浄方法および枚葉式基板洗浄装置

Publications (1)

Publication Number Publication Date
SG101461A1 true SG101461A1 (en) 2004-01-30

Family

ID=18840556

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200105177A SG101461A1 (en) 2000-12-05 2001-08-24 Single wafer type substrate cleaning method and apparatus

Country Status (10)

Country Link
US (2) US7029538B2 (de)
EP (1) EP1213746B1 (de)
JP (1) JP2002176026A (de)
KR (1) KR100812482B1 (de)
CN (1) CN1217386C (de)
AT (1) ATE392709T1 (de)
DE (1) DE60133618T2 (de)
IL (1) IL145118A0 (de)
SG (1) SG101461A1 (de)
TW (1) TW518684B (de)

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US8211242B2 (en) 2005-02-07 2012-07-03 Ebara Corporation Substrate processing method, substrate processing apparatus, and control program
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KR101418360B1 (ko) * 2007-03-07 2014-07-09 주식회사 케이씨텍 비접촉식 기판세정장치
JP5153296B2 (ja) * 2007-10-31 2013-02-27 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
KR100897547B1 (ko) * 2007-11-05 2009-05-15 세메스 주식회사 기판 처리 장치 및 방법
CN101673062B (zh) * 2008-09-09 2011-10-26 中芯国际集成电路制造(北京)有限公司 一种全湿法去胶的装置
CN102410711B (zh) * 2010-09-21 2014-02-26 如皋市大昌电子有限公司 一种二极管脱水机
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US9997379B2 (en) * 2010-11-30 2018-06-12 Lam Research Ag Method and apparatus for wafer wet processing
JP5829082B2 (ja) * 2011-09-09 2015-12-09 オリンパス株式会社 洗浄装置
US20130068264A1 (en) * 2011-09-21 2013-03-21 Nanya Technology Corporation Wafer scrubber apparatus
US20130171832A1 (en) * 2011-12-28 2013-07-04 Intermolecular Inc. Enhanced Isolation For Combinatorial Atomic Layer Deposition (ALD)
US20130269612A1 (en) * 2012-04-16 2013-10-17 Hermes-Epitek Corporation Gas Treatment Apparatus with Surrounding Spray Curtains
JP5973299B2 (ja) * 2012-09-25 2016-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR101512560B1 (ko) 2012-08-31 2015-04-15 가부시키가이샤 스크린 홀딩스 기판처리장치
JP6010398B2 (ja) * 2012-08-31 2016-10-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN102915909A (zh) * 2012-10-08 2013-02-06 上海华力微电子有限公司 一种改进酸槽式硅片清洗设备内环境的方法
KR101925581B1 (ko) * 2012-11-23 2018-12-05 주식회사 원익아이피에스 챔버 세정 방법
KR101536718B1 (ko) * 2013-01-31 2015-07-15 세메스 주식회사 지지 유닛, 이송 유닛, 기판 처리 장치, 그리고 기판 처리 장치를 이용한 기판 처리 방법
US10707099B2 (en) 2013-08-12 2020-07-07 Veeco Instruments Inc. Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle
KR101905289B1 (ko) 2014-03-28 2018-10-05 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
CN104438201A (zh) * 2014-11-26 2015-03-25 乐山新天源太阳能科技有限公司 一种硅料清洗工艺及其设备
TWI582886B (zh) * 2016-01-12 2017-05-11 弘塑科技股份有限公司 單晶圓溼式處理裝置
CN106824884A (zh) * 2017-03-31 2017-06-13 贵州大学 一种硅片翻转冲洗装置
TWI797121B (zh) 2017-04-25 2023-04-01 美商維克儀器公司 半導體晶圓製程腔體
JP2019054112A (ja) * 2017-09-15 2019-04-04 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板乾燥装置
JP6442018B2 (ja) * 2017-10-04 2018-12-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP6990602B2 (ja) * 2018-02-27 2022-01-12 東京エレクトロン株式会社 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体
WO2020039849A1 (ja) * 2018-08-22 2020-02-27 東京エレクトロン株式会社 基板処理方法および基板処理装置
CN110148573B (zh) * 2019-04-17 2020-12-04 湖州达立智能设备制造有限公司 一种半导体设备工艺腔的晶圆升降装置
JP7315389B2 (ja) * 2019-06-28 2023-07-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
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US20230415204A1 (en) * 2022-06-23 2023-12-28 Taiwan Semiconductor Manufacturing Company, Ltd. Wet cleaning tool and method
CN115143746B (zh) * 2022-07-25 2023-05-12 广东技术师范大学 一种大功率模组生产堆叠式热烘除湿装置
US12224195B2 (en) * 2022-08-02 2025-02-11 Applied Materials, Inc. Centering wafer for processing chamber
KR102870115B1 (ko) * 2022-12-20 2025-10-16 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

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Also Published As

Publication number Publication date
IL145118A0 (en) 2002-06-30
CN1357907A (zh) 2002-07-10
TW518684B (en) 2003-01-21
US7029538B2 (en) 2006-04-18
US20030047192A1 (en) 2003-03-13
EP1213746B1 (de) 2008-04-16
DE60133618T2 (de) 2008-08-07
EP1213746A2 (de) 2002-06-12
ATE392709T1 (de) 2008-05-15
KR100812482B1 (ko) 2008-03-10
EP1213746A3 (de) 2006-04-05
US6807974B2 (en) 2004-10-26
JP2002176026A (ja) 2002-06-21
KR20020044536A (ko) 2002-06-15
DE60133618D1 (de) 2008-05-29
US20020074020A1 (en) 2002-06-20
CN1217386C (zh) 2005-08-31

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