SG143201A1 - Polishing composition and polishing method - Google Patents

Polishing composition and polishing method

Info

Publication number
SG143201A1
SG143201A1 SG200718000-3A SG2007180003A SG143201A1 SG 143201 A1 SG143201 A1 SG 143201A1 SG 2007180003 A SG2007180003 A SG 2007180003A SG 143201 A1 SG143201 A1 SG 143201A1
Authority
SG
Singapore
Prior art keywords
polishing
polishing composition
composition
polish
ppm
Prior art date
Application number
SG200718000-3A
Other languages
English (en)
Inventor
Masayuki Hattori
Hideyuki Satoh
Atsunori Kawamura
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG143201A1 publication Critical patent/SG143201A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG200718000-3A 2006-11-27 2007-11-22 Polishing composition and polishing method SG143201A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006318670A JP2008135453A (ja) 2006-11-27 2006-11-27 研磨用組成物及び研磨方法

Publications (1)

Publication Number Publication Date
SG143201A1 true SG143201A1 (en) 2008-06-27

Family

ID=39015976

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200718000-3A SG143201A1 (en) 2006-11-27 2007-11-22 Polishing composition and polishing method

Country Status (7)

Country Link
US (1) US20080289261A1 (fr)
EP (1) EP1925648A3 (fr)
JP (1) JP2008135453A (fr)
KR (1) KR101427419B1 (fr)
CN (1) CN101220256A (fr)
SG (1) SG143201A1 (fr)
TW (1) TWI417372B (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010140671A1 (fr) * 2009-06-05 2010-12-09 株式会社Sumco Procédé de polissage de tranche de silicium et tranche de silicium
CN103562337A (zh) * 2011-03-30 2014-02-05 福吉米株式会社 研磨用组合物和研磨方法
US9303191B2 (en) 2012-03-30 2016-04-05 Nitta Haas Incorporated Polishing composition
JP6268069B2 (ja) * 2014-09-12 2018-01-24 信越化学工業株式会社 研磨組成物及び研磨方法
JP2016069535A (ja) * 2014-09-30 2016-05-09 株式会社フジミインコーポレーテッド 研磨用組成物及びその製造方法並びに研磨方法
US10541317B2 (en) 2018-03-01 2020-01-21 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming a metal gate using monolayers
US11075113B2 (en) * 2018-06-29 2021-07-27 Taiwan Semiconductor Manufacturing Co., Ltd. Metal capping layer and methods thereof
US12448544B2 (en) 2022-03-16 2025-10-21 Fujimi Incorporated Chemical mechanical polishing compositions and methods of use thereof

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527423A (en) * 1994-10-06 1996-06-18 Cabot Corporation Chemical mechanical polishing slurry for metal layers
EP0852615B1 (fr) * 1996-07-25 2005-12-14 DuPont Air Products NanoMaterials L.L.C. Composition et procede de polissage mecanique chimique
US6068787A (en) 1996-11-26 2000-05-30 Cabot Corporation Composition and slurry useful for metal CMP
US5958288A (en) * 1996-11-26 1999-09-28 Cabot Corporation Composition and slurry useful for metal CMP
US6001269A (en) * 1997-05-20 1999-12-14 Rodel, Inc. Method for polishing a composite comprising an insulator, a metal, and titanium
US6083419A (en) * 1997-07-28 2000-07-04 Cabot Corporation Polishing composition including an inhibitor of tungsten etching
JP4264781B2 (ja) * 1999-09-20 2009-05-20 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
US6293848B1 (en) * 1999-11-15 2001-09-25 Cabot Microelectronics Corporation Composition and method for planarizing surfaces
US6319096B1 (en) * 1999-11-15 2001-11-20 Cabot Corporation Composition and method for planarizing surfaces
US6299795B1 (en) * 2000-01-18 2001-10-09 Praxair S.T. Technology, Inc. Polishing slurry
US6355075B1 (en) * 2000-02-11 2002-03-12 Fujimi Incorporated Polishing composition
JP4954398B2 (ja) * 2001-08-09 2012-06-13 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
JP2003142435A (ja) * 2001-10-31 2003-05-16 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
KR20040094758A (ko) * 2002-03-04 2004-11-10 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 이를 사용한 배선구조의 형성방법
JP4083528B2 (ja) * 2002-10-01 2008-04-30 株式会社フジミインコーポレーテッド 研磨用組成物
JP2005244123A (ja) * 2004-02-27 2005-09-08 Fujimi Inc 研磨用組成物
JP2005268664A (ja) * 2004-03-19 2005-09-29 Fujimi Inc 研磨用組成物
JP5319887B2 (ja) * 2005-01-05 2013-10-16 ニッタ・ハース株式会社 研磨用スラリー
JP4405427B2 (ja) 2005-05-10 2010-01-27 株式会社東芝 スイッチング素子

Also Published As

Publication number Publication date
TWI417372B (zh) 2013-12-01
CN101220256A (zh) 2008-07-16
JP2008135453A (ja) 2008-06-12
EP1925648A3 (fr) 2009-01-28
EP1925648A2 (fr) 2008-05-28
KR20080047989A (ko) 2008-05-30
US20080289261A1 (en) 2008-11-27
TW200846453A (en) 2008-12-01
KR101427419B1 (ko) 2014-08-08

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