SG181529A1 - Electrolytic hard gold plating solution and plating method using same - Google Patents

Electrolytic hard gold plating solution and plating method using same Download PDF

Info

Publication number: SG181529A1
Authority: SG; Singapore
Prior art keywords: gold; plating solution; salt; plating; electrolytic hard
Prior art date: 2009-12-09

Application number

SG2012041463A

Other languages

English (en)

Inventor

Masato Furukawa

Injoon Son

Original Assignee

Metalor Technologies Japan Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-12-09

Filing date

2010-11-30

Publication date

2012-07-30

2010-11-30 Application filed by Metalor Technologies Japan Corp filed Critical Metalor Technologies Japan Corp

2012-07-30 Publication of SG181529A1 publication Critical patent/SG181529A1/en

Links

239000010931 gold Substances 0.000 title claims abstract description 116
229910052737 gold Inorganic materials 0.000 title claims abstract description 115
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 114
238000007747 plating Methods 0.000 title claims abstract description 96
238000000034 method Methods 0.000 title claims description 11
150000003839 salts Chemical class 0.000 claims abstract description 20
-1 aromatic sulfonic acid compound Chemical class 0.000 claims abstract description 12
QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims abstract description 12
150000001868 cobalt Chemical class 0.000 claims abstract description 10
150000002815 nickel Chemical class 0.000 claims abstract description 10
150000002391 heterocyclic compounds Chemical class 0.000 claims abstract description 9
150000007524 organic acids Chemical class 0.000 claims abstract description 8
239000002253 acid Substances 0.000 claims abstract description 7
IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 claims abstract description 7
WOFVPNPAVMKHCX-UHFFFAOYSA-N N#C[Au](C#N)C#N Chemical class N#C[Au](C#N)C#N WOFVPNPAVMKHCX-UHFFFAOYSA-N 0.000 claims abstract description 4
150000001735 carboxylic acids Chemical class 0.000 claims abstract 2
239000000463 material Substances 0.000 claims description 11
150000001875 compounds Chemical class 0.000 claims description 3
238000005507 spraying Methods 0.000 claims description 3
150000007513 acids Chemical class 0.000 abstract 1
239000010408 film Substances 0.000 description 60
239000000243 solution Substances 0.000 description 52
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 20
229910052759 nickel Inorganic materials 0.000 description 10
230000000694 effects Effects 0.000 description 9
238000005260 corrosion Methods 0.000 description 8
230000007797 corrosion Effects 0.000 description 8
239000007800 oxidant agent Substances 0.000 description 8
238000000151 deposition Methods 0.000 description 7
230000008021 deposition Effects 0.000 description 7
238000012360 testing method Methods 0.000 description 7
KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
239000003795 chemical substances by application Substances 0.000 description 5
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
239000008139 complexing agent Substances 0.000 description 4
229910017604 nitric acid Inorganic materials 0.000 description 4
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
229910052802 copper Inorganic materials 0.000 description 3
239000010949 copper Substances 0.000 description 3
238000002347 injection Methods 0.000 description 3
239000007924 injection Substances 0.000 description 3
HWTDMFJYBAURQR-UHFFFAOYSA-N 80-82-0 Chemical compound OS(=O)(=O)C1=CC=CC=C1[N+]([O-])=O HWTDMFJYBAURQR-UHFFFAOYSA-N 0.000 description 2
QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical class N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
244000248349 Citrus limon Species 0.000 description 2
235000005979 Citrus limon Nutrition 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
POJWUDADGALRAB-UHFFFAOYSA-N allantoin Chemical compound NC(=O)NC1NC(=O)NC1=O POJWUDADGALRAB-UHFFFAOYSA-N 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
229910000361 cobalt sulfate Inorganic materials 0.000 description 2
229940044175 cobalt sulfate Drugs 0.000 description 2
KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 2
230000000052 comparative effect Effects 0.000 description 2
239000013078 crystal Substances 0.000 description 2
125000000623 heterocyclic group Chemical group 0.000 description 2
239000012535 impurity Substances 0.000 description 2
238000011835 investigation Methods 0.000 description 2
JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
230000000873 masking effect Effects 0.000 description 2
BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
239000000203 mixture Substances 0.000 description 2
229910000480 nickel oxide Inorganic materials 0.000 description 2
KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 2
230000003647 oxidation Effects 0.000 description 2
238000007254 oxidation reaction Methods 0.000 description 2
GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
239000001508 potassium citrate Substances 0.000 description 2
229960002635 potassium citrate Drugs 0.000 description 2
QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 2
235000011082 potassium citrates Nutrition 0.000 description 2
WFIZEGIEIOHZCP-UHFFFAOYSA-M potassium formate Chemical compound [K+].[O-]C=O WFIZEGIEIOHZCP-UHFFFAOYSA-M 0.000 description 2
FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
230000001629 suppression Effects 0.000 description 2
239000010409 thin film Substances 0.000 description 2
LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
SPXOTSHWBDUUMT-UHFFFAOYSA-N 138-42-1 Chemical compound OS(=O)(=O)C1=CC=C([N+]([O-])=O)C=C1 SPXOTSHWBDUUMT-UHFFFAOYSA-N 0.000 description 1
GWGBNENHEGYJSN-UHFFFAOYSA-N 2,4-dinitrobenzenesulfonic acid;hydrate Chemical compound O.OS(=O)(=O)C1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O GWGBNENHEGYJSN-UHFFFAOYSA-N 0.000 description 1
LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
HVBSAKJJOYLTQU-UHFFFAOYSA-N 4-aminobenzenesulfonic acid Chemical compound NC1=CC=C(S(O)(=O)=O)C=C1 HVBSAKJJOYLTQU-UHFFFAOYSA-N 0.000 description 1
YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 description 1
ODHCTXKNWHHXJC-UHFFFAOYSA-N 5-oxoproline Chemical compound OC(=O)C1CCC(=O)N1 ODHCTXKNWHHXJC-UHFFFAOYSA-N 0.000 description 1
POJWUDADGALRAB-PVQJCKRUSA-N Allantoin Natural products NC(=O)N[C@@H]1NC(=O)NC1=O POJWUDADGALRAB-PVQJCKRUSA-N 0.000 description 1
VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 1
229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
238000005299 abrasion Methods 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
229910052783 alkali metal Inorganic materials 0.000 description 1
229910052784 alkaline earth metal Inorganic materials 0.000 description 1
229960000458 allantoin Drugs 0.000 description 1
BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
150000001412 amines Chemical class 0.000 description 1
229910021529 ammonia Inorganic materials 0.000 description 1
239000000908 ammonium hydroxide Substances 0.000 description 1
LJJNEPKMBSUEND-UHFFFAOYSA-O azanium;gold;cyanide Chemical compound [NH4+].[Au].N#[C-] LJJNEPKMBSUEND-UHFFFAOYSA-O 0.000 description 1
239000002585 base Substances 0.000 description 1
KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
159000000007 calcium salts Chemical class 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
UFMZWBIQTDUYBN-UHFFFAOYSA-N cobalt dinitrate Chemical compound [Co+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O UFMZWBIQTDUYBN-UHFFFAOYSA-N 0.000 description 1
229910001981 cobalt nitrate Inorganic materials 0.000 description 1
OBWXQDHWLMJOOD-UHFFFAOYSA-H cobalt(2+);dicarbonate;dihydroxide;hydrate Chemical compound O.[OH-].[OH-].[Co+2].[Co+2].[Co+2].[O-]C([O-])=O.[O-]C([O-])=O OBWXQDHWLMJOOD-UHFFFAOYSA-H 0.000 description 1
238000013329 compounding Methods 0.000 description 1
150000001879 copper Chemical class 0.000 description 1
CVOQYKPWIVSMDC-UHFFFAOYSA-L dipotassium;butanedioate Chemical compound [K+].[K+].[O-]C(=O)CCC([O-])=O CVOQYKPWIVSMDC-UHFFFAOYSA-L 0.000 description 1
238000004070 electrodeposition Methods 0.000 description 1
238000011156 evaluation Methods 0.000 description 1
235000019253 formic acid Nutrition 0.000 description 1
238000009472 formulation Methods 0.000 description 1
WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
229940091173 hydantoin Drugs 0.000 description 1
MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
230000001771 impaired effect Effects 0.000 description 1
239000004310 lactic acid Substances 0.000 description 1
235000014655 lactic acid Nutrition 0.000 description 1
239000003446 ligand Substances 0.000 description 1
239000001630 malic acid Substances 0.000 description 1
235000011090 malic acid Nutrition 0.000 description 1
238000005259 measurement Methods 0.000 description 1
QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
LONQOCRNVIZRSA-UHFFFAOYSA-L nickel(2+);sulfite Chemical compound [Ni+2].[O-]S([O-])=O LONQOCRNVIZRSA-UHFFFAOYSA-L 0.000 description 1
229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
150000002825 nitriles Chemical class 0.000 description 1
125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
230000033116 oxidation-reduction process Effects 0.000 description 1
239000003002 pH adjusting agent Substances 0.000 description 1
229910052697 platinum Inorganic materials 0.000 description 1
XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
239000004323 potassium nitrate Substances 0.000 description 1
235000010333 potassium nitrate Nutrition 0.000 description 1
229940093928 potassium nitrate Drugs 0.000 description 1
229910000160 potassium phosphate Inorganic materials 0.000 description 1
229940093916 potassium phosphate Drugs 0.000 description 1
235000011009 potassium phosphates Nutrition 0.000 description 1
NRTDAKURTMLAFN-UHFFFAOYSA-N potassium;gold(3+);tetracyanide Chemical compound [K+].[Au+3].N#[C-].N#[C-].N#[C-].N#[C-] NRTDAKURTMLAFN-UHFFFAOYSA-N 0.000 description 1
HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
159000000000 sodium salts Chemical class 0.000 description 1
VMDSWYDTKFSTQH-UHFFFAOYSA-N sodium;gold(1+);dicyanide Chemical compound [Na+].[Au+].N#[C-].N#[C-] VMDSWYDTKFSTQH-UHFFFAOYSA-N 0.000 description 1
239000000126 substance Substances 0.000 description 1
125000001424 substituent group Chemical group 0.000 description 1
KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 1
229960002317 succinimide Drugs 0.000 description 1
229950000244 sulfanilic acid Drugs 0.000 description 1
239000011975 tartaric acid Substances 0.000 description 1
235000002906 tartaric acid Nutrition 0.000 description 1
238000010998 test method Methods 0.000 description 1
239000002699 waste material Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)

SG2012041463A 2009-12-09 2010-11-30 Electrolytic hard gold plating solution and plating method using same SG181529A1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2009279409A JP2011122192A (ja)	2009-12-09	2009-12-09	電解硬質金めっき液及びこれを用いるめっき方法
PCT/JP2010/071304 WO2011070933A1 (ja)	2009-12-09	2010-11-30	電解硬質金めっき液及びこれを用いるめっき方法

Publications (1)

Publication Number	Publication Date
SG181529A1 true SG181529A1 (en)	2012-07-30

Family

ID=44145478

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SG2012041463A SG181529A1 (en)	2009-12-09	2010-11-30	Electrolytic hard gold plating solution and plating method using same

Country Status (7)

Country	Link
EP (1)	EP2511400A4 (de)
JP (1)	JP2011122192A (de)
KR (1)	KR20120120134A (de)
CN (1)	CN102695819A (de)
SG (1)	SG181529A1 (de)
TW (1)	TW201137184A (de)
WO (1)	WO2011070933A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5025815B1 (ja) *	2011-08-10	2012-09-12	小島化学薬品株式会社	硬質金めっき液
JP5758361B2 (ja) *	2012-08-31	2015-08-05	日本エレクトロプレイテイング・エンジニヤース株式会社	ノンシアン系金‐パラジウム合金めっき液及びめっき方法
JP5152943B1 (ja) *	2012-09-19	2013-02-27	小島化学薬品株式会社	低遊離シアン金塩の製造方法
JP7219120B2 (ja) *	2019-03-04	2023-02-07	Ｅｅｊａ株式会社	電解金めっき液及びその製造方法、並びに金めっき方法及び金錯体
CN118352327B (zh) *	2024-01-10	2025-07-18	深圳市联合蓝海应用材料科技股份有限公司	替代纯金凸块封装倒装芯片的金银合金凸块及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2355581C3 (de) *	1973-11-07	1979-07-12	Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt	Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
GB8501245D0 (en) *	1985-01-18	1985-02-20	Engelhard Corp	Gold electroplating bath
JPS637390A (ja) *	1986-06-26	1988-01-13	Nippon Engeruharudo Kk	金−コバルト合金めつき液
DE50013952D1 (de) *	1999-06-17	2007-02-22	Degussa Galvanotechnik Gmbh	Saures bad zur galvanischen abscheidung von glänzenden gold- und goldlegierungsschichten und glanzzusatz hierfür
FR2828889B1 (fr) *	2001-08-24	2004-05-07	Engelhard Clal Sas	Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
US7128822B2 (en) *	2003-06-04	2006-10-31	Shipley Company, L.L.C.	Leveler compounds
JP4320606B2 (ja) *	2004-03-15	2009-08-26	上村工業株式会社	金めっき浴
SG127854A1 (en) *	2005-06-02	2006-12-29	Rohm & Haas Elect Mat	Improved gold electrolytes
JP5559455B2 (ja) *	2007-06-29	2014-07-23	日本高純度化学株式会社	電解金めっき液及びそれを用いて得られた金皮膜
JP2009165730A (ja)	2008-01-18	2009-07-30	Kozo Motoki	洗浄用ブラシ
JP5216633B2 (ja) *	2008-03-19	2013-06-19	ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー．	バックグラウンドめっきを抑制する方法
CN101550571A (zh) *	2008-03-31	2009-10-07	恩伊凯慕凯特股份有限公司	用于部分电镀的含有金的电镀液
WO2009150915A1 (ja) *	2008-06-11	2009-12-17	日本高純度化学株式会社	電解金めっき液及びそれを用いて得られた金皮膜

2009
- 2009-12-09 JP JP2009279409A patent/JP2011122192A/ja not_active Ceased
2010
- 2010-11-30 EP EP10835855.7A patent/EP2511400A4/de not_active Withdrawn
- 2010-11-30 SG SG2012041463A patent/SG181529A1/en unknown
- 2010-11-30 WO PCT/JP2010/071304 patent/WO2011070933A1/ja not_active Ceased
- 2010-11-30 KR KR1020127012784A patent/KR20120120134A/ko not_active Withdrawn
- 2010-11-30 CN CN2010800528667A patent/CN102695819A/zh active Pending
- 2010-12-08 TW TW099142808A patent/TW201137184A/zh unknown

Also Published As

Publication number	Publication date
EP2511400A1 (de)	2012-10-17
EP2511400A4 (de)	2013-07-24
JP2011122192A (ja)	2011-06-23
TW201137184A (en)	2011-11-01
CN102695819A (zh)	2012-09-26
KR20120120134A (ko)	2012-11-01
WO2011070933A1 (ja)	2011-06-16

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