TW201137184A - Electrolytic hard gold plating liquid and plating method using the same - Google Patents

Electrolytic hard gold plating liquid and plating method using the same Download PDF

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Publication number
TW201137184A
TW201137184A TW099142808A TW99142808A TW201137184A TW 201137184 A TW201137184 A TW 201137184A TW 099142808 A TW099142808 A TW 099142808A TW 99142808 A TW99142808 A TW 99142808A TW 201137184 A TW201137184 A TW 201137184A
Authority
TW
Taiwan
Prior art keywords
gold
salt
acid
film
plating solution
Prior art date
Application number
TW099142808A
Other languages
English (en)
Chinese (zh)
Inventor
Masato Furukawa
In-Joon Son
Original Assignee
Metalor Technologies Japan Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metalor Technologies Japan Corp filed Critical Metalor Technologies Japan Corp
Publication of TW201137184A publication Critical patent/TW201137184A/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW099142808A 2009-12-09 2010-12-08 Electrolytic hard gold plating liquid and plating method using the same TW201137184A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009279409A JP2011122192A (ja) 2009-12-09 2009-12-09 電解硬質金めっき液及びこれを用いるめっき方法

Publications (1)

Publication Number Publication Date
TW201137184A true TW201137184A (en) 2011-11-01

Family

ID=44145478

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099142808A TW201137184A (en) 2009-12-09 2010-12-08 Electrolytic hard gold plating liquid and plating method using the same

Country Status (7)

Country Link
EP (1) EP2511400A4 (de)
JP (1) JP2011122192A (de)
KR (1) KR20120120134A (de)
CN (1) CN102695819A (de)
SG (1) SG181529A1 (de)
TW (1) TW201137184A (de)
WO (1) WO2011070933A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558858B (zh) * 2012-08-31 2016-11-21 Electroplating Eng 非氰系金-鈀合金鍍覆液及鍍覆方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5025815B1 (ja) * 2011-08-10 2012-09-12 小島化学薬品株式会社 硬質金めっき液
JP5152943B1 (ja) * 2012-09-19 2013-02-27 小島化学薬品株式会社 低遊離シアン金塩の製造方法
JP7219120B2 (ja) * 2019-03-04 2023-02-07 Eeja株式会社 電解金めっき液及びその製造方法、並びに金めっき方法及び金錯体
CN118352327B (zh) * 2024-01-10 2025-07-18 深圳市联合蓝海应用材料科技股份有限公司 替代纯金凸块封装倒装芯片的金银合金凸块及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2355581C3 (de) * 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
GB8501245D0 (en) * 1985-01-18 1985-02-20 Engelhard Corp Gold electroplating bath
JPS637390A (ja) * 1986-06-26 1988-01-13 Nippon Engeruharudo Kk 金−コバルト合金めつき液
DE50013952D1 (de) * 1999-06-17 2007-02-22 Degussa Galvanotechnik Gmbh Saures bad zur galvanischen abscheidung von glänzenden gold- und goldlegierungsschichten und glanzzusatz hierfür
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
JP4320606B2 (ja) * 2004-03-15 2009-08-26 上村工業株式会社 金めっき浴
SG127854A1 (en) * 2005-06-02 2006-12-29 Rohm & Haas Elect Mat Improved gold electrolytes
JP5559455B2 (ja) * 2007-06-29 2014-07-23 日本高純度化学株式会社 電解金めっき液及びそれを用いて得られた金皮膜
JP2009165730A (ja) 2008-01-18 2009-07-30 Kozo Motoki 洗浄用ブラシ
JP5216633B2 (ja) * 2008-03-19 2013-06-19 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. バックグラウンドめっきを抑制する方法
CN101550571A (zh) * 2008-03-31 2009-10-07 恩伊凯慕凯特股份有限公司 用于部分电镀的含有金的电镀液
WO2009150915A1 (ja) * 2008-06-11 2009-12-17 日本高純度化学株式会社 電解金めっき液及びそれを用いて得られた金皮膜

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558858B (zh) * 2012-08-31 2016-11-21 Electroplating Eng 非氰系金-鈀合金鍍覆液及鍍覆方法

Also Published As

Publication number Publication date
EP2511400A1 (de) 2012-10-17
EP2511400A4 (de) 2013-07-24
JP2011122192A (ja) 2011-06-23
CN102695819A (zh) 2012-09-26
KR20120120134A (ko) 2012-11-01
SG181529A1 (en) 2012-07-30
WO2011070933A1 (ja) 2011-06-16

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