SG42386G - Accelerating solution and its use in a process for treating polymeric substrates prior to plating - Google Patents

Accelerating solution and its use in a process for treating polymeric substrates prior to plating

Info

Publication number
SG42386G
SG42386G SG423/86A SG42386A SG42386G SG 42386 G SG42386 G SG 42386G SG 423/86 A SG423/86 A SG 423/86A SG 42386 A SG42386 A SG 42386A SG 42386 G SG42386 G SG 42386G
Authority
SG
Singapore
Prior art keywords
plating
polymeric substrates
substrates prior
accelerating solution
treating polymeric
Prior art date
Application number
SG423/86A
Other languages
English (en)
Original Assignee
Omi Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omi Int Corp filed Critical Omi Int Corp
Publication of SG42386G publication Critical patent/SG42386G/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
SG423/86A 1978-10-20 1986-05-12 Accelerating solution and its use in a process for treating polymeric substrates prior to plating SG42386G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/953,153 US4204013A (en) 1978-10-20 1978-10-20 Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine

Publications (1)

Publication Number Publication Date
SG42386G true SG42386G (en) 1987-03-27

Family

ID=25493642

Family Applications (1)

Application Number Title Priority Date Filing Date
SG423/86A SG42386G (en) 1978-10-20 1986-05-12 Accelerating solution and its use in a process for treating polymeric substrates prior to plating

Country Status (13)

Country Link
US (1) US4204013A (fr)
JP (1) JPS6049717B2 (fr)
AU (1) AU528226B2 (fr)
BR (1) BR7906754A (fr)
CA (1) CA1144432A (fr)
DE (1) DE2941997C2 (fr)
ES (1) ES485223A1 (fr)
FR (1) FR2439214A1 (fr)
GB (1) GB2036755B (fr)
HK (1) HK67986A (fr)
IT (1) IT1164737B (fr)
MX (1) MX152328A (fr)
SG (1) SG42386G (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3172414D1 (en) * 1981-06-02 1985-10-31 Asahi Glass Co Ltd Process for preparing nickel layer
US4448811A (en) * 1981-12-30 1984-05-15 Omi International Corporation Oxidizing agent for acidic accelerator in electroless metal plating process
US4863758A (en) * 1982-05-26 1989-09-05 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
JPS59500870A (ja) * 1982-05-26 1984-05-17 マツクダ−ミツド　インコ−ポレ−テツド 非伝導性基板活性化触媒溶液および無電解メツキ方法
US4450191A (en) * 1982-09-02 1984-05-22 Omi International Corporation Ammonium ions used as electroless copper plating rate controller
US4610895A (en) * 1984-02-01 1986-09-09 Shipley Company Inc. Process for metallizing plastics
US4592929A (en) * 1984-02-01 1986-06-03 Shipley Company Inc. Process for metallizing plastics
JPS60218477A (ja) * 1984-04-11 1985-11-01 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 無電解付着のための触媒化処理法
JPS6230509U (fr) * 1985-08-09 1987-02-24
JPH0765154B2 (ja) * 1985-09-02 1995-07-12 ポリプラスチックス株式会社 表面金属処理した樹脂成形品
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
DE3743743A1 (de) * 1987-12-23 1989-07-06 Basf Ag Polymere konditionierungsmittel zur vorbehandlung von nichtmetallischen oberflaechen fuer eine chemische metallisierung
US5053280A (en) * 1988-09-20 1991-10-01 Hitachi-Chemical Co., Ltd. Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent
US5965211A (en) * 1989-12-29 1999-10-12 Nippondenso Co., Ltd. Electroless copper plating solution and process for formation of copper film
US5843538A (en) * 1996-12-09 1998-12-01 John L. Raymond Method for electroless nickel plating of metal substrates
US6361712B1 (en) * 1999-10-15 2002-03-26 Arch Specialty Chemicals, Inc. Composition for selective etching of oxides over metals
DE10054544A1 (de) * 2000-11-01 2002-05-08 Atotech Deutschland Gmbh Verfahren zum chemischen Metallisieren von Oberflächen
US6638326B2 (en) * 2001-09-25 2003-10-28 Ekc Technology, Inc. Compositions for chemical mechanical planarization of tantalum and tantalum nitride
US6783690B2 (en) * 2002-03-25 2004-08-31 Donna M. Kologe Method of stripping silver from a printed circuit board
JP2006514713A (ja) * 2002-09-20 2006-05-11 ノーブル ファイバ テクノロジーズ，インク． 改良された銀メッキ方法及びその方法により形成された物品
DE10259187B4 (de) * 2002-12-18 2008-06-19 Enthone Inc., West Haven Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren
EP2233608B1 (fr) * 2009-03-23 2016-03-23 ATOTECH Deutschland GmbH Processus de prétraitement de placage de nickel anélectrolytique
EP3024900B1 (fr) 2013-07-24 2019-10-09 National Research Council of Canada Procédé de dépôt de métal sur un substrat
US10174250B2 (en) * 2014-04-01 2019-01-08 Atotech Deutschland Gmbh Composition and process for metallizing nonconductive plastic surfaces
US11047052B2 (en) * 2014-07-10 2021-06-29 Okuno Chemical Industries Co., Ltd. Resin plating method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3532518A (en) * 1967-06-28 1970-10-06 Macdermid Inc Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions
US3620804A (en) * 1969-01-22 1971-11-16 Borg Warner Metal plating of thermoplastics
US3622370A (en) * 1969-04-07 1971-11-23 Macdermid Inc Method of and solution for accelerating activation of plastic substrates in electroless metal plating system
US3962497A (en) * 1975-03-11 1976-06-08 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating
DE2659680C2 (de) * 1976-12-30 1985-01-31 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zum Aktivieren von Oberflächen

Also Published As

Publication number Publication date
IT1164737B (it) 1987-04-15
ES485223A1 (es) 1980-07-01
DE2941997A1 (de) 1980-04-30
GB2036755A (en) 1980-07-02
MX152328A (es) 1985-06-27
AU528226B2 (en) 1983-04-21
HK67986A (en) 1986-09-18
US4204013A (en) 1980-05-20
IT7950601A0 (it) 1979-10-18
CA1144432A (fr) 1983-04-12
FR2439214B1 (fr) 1983-07-01
JPS5556137A (en) 1980-04-24
BR7906754A (pt) 1980-06-17
FR2439214A1 (fr) 1980-05-16
GB2036755B (en) 1983-05-11
DE2941997C2 (de) 1982-12-23
JPS6049717B2 (ja) 1985-11-05
AU5116679A (en) 1980-04-24

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