SG42780A1 - Epoxy resin molding material for sealing electronic parts and sealed semiconductor device usin the same - Google Patents

Epoxy resin molding material for sealing electronic parts and sealed semiconductor device usin the same

Info

Publication number
SG42780A1
SG42780A1 SG1995001501A SG1995001501A SG42780A1 SG 42780 A1 SG42780 A1 SG 42780A1 SG 1995001501 A SG1995001501 A SG 1995001501A SG 1995001501 A SG1995001501 A SG 1995001501A SG 42780 A1 SG42780 A1 SG 42780A1
Authority
SG
Singapore
Prior art keywords
usin
semiconductor device
epoxy resin
same
molding material
Prior art date
Application number
SG1995001501A
Other languages
English (en)
Inventor
Bernard Deubzer
Hiroki Sashima
Hiroyuki Saitoh
Michael Geck
Peter Huber
Shinsuke Hagiwara
Original Assignee
Hitachi Chemical Co Ltd
Wacker Chemie Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Wacker Chemie Gmbh filed Critical Hitachi Chemical Co Ltd
Publication of SG42780A1 publication Critical patent/SG42780A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/902—Core-shell
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG1995001501A 1994-10-07 1995-10-06 Epoxy resin molding material for sealing electronic parts and sealed semiconductor device usin the same SG42780A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24406994A JP3288185B2 (ja) 1994-10-07 1994-10-07 電子部品封止用エポキシ樹脂成形材料及びそれを用いた半導体装置

Publications (1)

Publication Number Publication Date
SG42780A1 true SG42780A1 (en) 1997-10-17

Family

ID=17113278

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1995001501A SG42780A1 (en) 1994-10-07 1995-10-06 Epoxy resin molding material for sealing electronic parts and sealed semiconductor device usin the same

Country Status (9)

Country Link
US (2) US5739217A (fr)
EP (1) EP0707042B1 (fr)
JP (1) JP3288185B2 (fr)
KR (1) KR0169828B1 (fr)
CN (1) CN1065259C (fr)
DE (1) DE69501771T2 (fr)
MY (2) MY113317A (fr)
SG (1) SG42780A1 (fr)
TW (1) TW376402B (fr)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0780435A1 (fr) * 1995-12-21 1997-06-25 National Starch and Chemical Investment Holding Corporation Adhésive epog, flexible ayant une tendance de migration faible
TW452584B (en) * 1997-10-03 2001-09-01 Hitachi Chemical Co Ltd Epoxy resin composition and semiconductor devices using it as encapsulant
KR100307509B1 (ko) * 1998-07-21 2001-11-30 김충섭 세라믹 함유 탄소/탄소 복합재료 및 그의 제조 방법
TW415952B (en) * 1998-12-14 2000-12-21 Chung Shan Inst Of Science A modifier and a method for improving the flexibility of a cured epoxy resin
JP2000248182A (ja) * 1999-03-02 2000-09-12 Dow Corning Toray Silicone Co Ltd 樹脂用添加剤、硬化性樹脂組成物、および硬化樹脂
WO2001046290A1 (fr) 1999-12-20 2001-06-28 3M Innovative Properties Company Adhesif epoxyde durcissable, a un composant, stable a temperature ambiante
DE10051051A1 (de) * 2000-10-14 2002-04-18 Bosch Gmbh Robert Silikonmodifizierte Einkomponentenvergußmasse
US20020167804A1 (en) * 2001-05-14 2002-11-14 Intel Corporation Polymeric encapsulation material with fibrous filler for use in microelectronic circuit packaging
US6565976B1 (en) 2001-08-06 2003-05-20 Georgia-Pacific Resins, Inc. High strength pultrusion resin
DE10204890A1 (de) * 2002-02-06 2003-08-14 Roehm Gmbh Schlagzähe Formmasse und Formkörper
CN1327278C (zh) * 2002-11-01 2007-07-18 三井化学株式会社 液晶密封剂组合物及使用它的液晶显示面板的制造方法
EP1661174A1 (fr) 2003-08-08 2006-05-31 Dow Corning Corporation Procede de fabrication de composants electroniques faisant appel a un moulage par injection de liquide
US7846998B2 (en) * 2004-03-03 2010-12-07 Hitachi Chemical Co., Ltd. Sealant epoxy-resin molding material, and electronic component device
JP5027509B2 (ja) * 2004-08-18 2012-09-19 株式会社カネカ 半導体封止剤用エポキシ樹脂組成物およびエポキシ樹脂成形材料
JP4682796B2 (ja) * 2005-04-19 2011-05-11 日立化成工業株式会社 封止用シート
KR100708993B1 (ko) * 2005-06-07 2007-04-18 주식회사 엘지화학 다층구조의 고분자 활제 및 그의 제조방법
JP2007146148A (ja) * 2005-10-27 2007-06-14 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及びそれを用いた電子部品装置
JP2007146150A (ja) * 2005-11-02 2007-06-14 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及びそれを用いた電子部品装置
JP5504550B2 (ja) * 2006-01-23 2014-05-28 日立化成株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5374818B2 (ja) * 2006-12-20 2013-12-25 日立化成株式会社 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
WO2008102853A1 (fr) * 2007-02-23 2008-08-28 Panasonic Electric Works Co., Ltd. Composition de résine époxy, préimprégné, stratifiés et planches de câblage imprimé
JP2010530017A (ja) * 2007-06-14 2010-09-02 ビーエーエスエフ ソシエタス・ヨーロピア 難燃剤組成物
WO2008153125A1 (fr) * 2007-06-15 2008-12-18 Sekisui Chemical Co., Ltd. Agent d'étanchéité pour élément semi-conducteur optique et élément semi-conducteur optique
JP2009073933A (ja) * 2007-09-20 2009-04-09 Toto Kasei Co Ltd 耐熱劣化性を有するエポキシ樹脂組成物
EP2352065A1 (fr) * 2008-11-07 2011-08-03 Sumitomo Bakelite Co., Ltd. Composition de résine photosensible, film adhésif photosensible et dispositif de réception de lumière
JP2012532963A (ja) 2009-07-10 2012-12-20 ダウ グローバル テクノロジーズ エルエルシー 電気用積層板組成物における使用のためのコア／シェルゴム
US8768628B2 (en) * 2010-10-20 2014-07-01 Shawket Ghedan Rise in core wettability characterization method
US9067484B2 (en) * 2013-10-23 2015-06-30 Dezhou David Zhao Electric vehicle control systems
WO2015090469A1 (fr) * 2013-12-20 2015-06-25 Basf Coatings Gmbh Procédé de production d'une pâte pigmentaire, peinture aqueuse pour électrodéposition, son utilisation, procédé de peinture par électrodéposition cataphorétique et objet revêtu
JP6264250B2 (ja) * 2014-09-30 2018-01-24 信越化学工業株式会社 合成樹脂組成物に配合するシリコーンゴム粒子の製造方法
JP6571585B2 (ja) * 2015-06-08 2019-09-04 信越化学工業株式会社 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法
WO2018078873A1 (fr) * 2016-10-31 2018-05-03 日立化成株式会社 Composition de résine pour couche intermédiaire, matériau sous forme de film pour couche intermédiaire, et procédé de fabrication de verre feuilleté
BR112020012847A2 (pt) 2018-01-03 2020-12-29 Sika Technology Ag Composição de resina epóxi para fins de revestimento
CN117089005B (zh) * 2023-08-21 2024-06-21 天津大学 一种超低介电共聚物及其制备方法和应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61185527A (ja) 1985-02-13 1986-08-19 Toray Silicone Co Ltd 硬化性エポキシ樹脂組成物
JPS6293962A (ja) * 1985-10-18 1987-04-30 Nitto Electric Ind Co Ltd 半導体装置
JPS62147749A (ja) 1985-12-20 1987-07-01 Nitto Electric Ind Co Ltd 半導体装置
JPS62214650A (ja) * 1986-03-14 1987-09-21 Nitto Electric Ind Co Ltd 半導体装置
JPH06841B2 (ja) 1988-04-25 1994-01-05 日立化成工業株式会社 電子部品封止用エポキシ樹脂成形材料
US5147947A (en) * 1988-10-31 1992-09-15 Japan Synthetic Rubber Co., Ltd. Polyorganosiloxane series thermoplastic resin and composition thereof
US4962165A (en) * 1989-01-12 1990-10-09 Rohm And Haas Company Process for making silicone particles
CA2010331A1 (fr) * 1989-03-02 1990-09-02 James O. Peterson Compositions d'encapsulation epoxy a faible contrainte
JPH0597970A (ja) * 1991-10-07 1993-04-20 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
JPH05175369A (ja) 1991-12-24 1993-07-13 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料
US5319005A (en) * 1992-01-27 1994-06-07 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing of electronic component
JP2669247B2 (ja) * 1992-02-13 1997-10-27 信越化学工業株式会社 熱硬化性樹脂組成物

Also Published As

Publication number Publication date
CN1065259C (zh) 2001-05-02
TW376402B (en) 1999-12-11
MY113317A (en) 2002-01-31
JP3288185B2 (ja) 2002-06-04
EP0707042B1 (fr) 1998-03-11
US5962139A (en) 1999-10-05
DE69501771D1 (de) 1998-04-16
DE69501771T2 (de) 1998-07-02
MY115938A (en) 2003-09-30
US5739217A (en) 1998-04-14
JPH08134179A (ja) 1996-05-28
EP0707042A1 (fr) 1996-04-17
KR0169828B1 (ko) 1999-03-20
KR960014242A (ko) 1996-05-22
CN1120051A (zh) 1996-04-10

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