SG52875A1 - Plastic packaging for a surface mounted integrated circuit - Google Patents

Plastic packaging for a surface mounted integrated circuit

Info

Publication number: SG52875A1
Authority: SG; Singapore
Prior art keywords: integrated circuit; plastic packaging; surface mounted; mounted integrated; packaging
Prior art date: 1995-12-19

Application number

SG1996011856A

Other languages

English (en)

Inventor

John H Abbott

Navinchandra Kalidas

Raymond W Thompson

Original Assignee

Texas Instruments Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-12-19

Filing date

1996-12-19

Publication date

1998-09-28

1996-12-19 Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc

1998-09-28 Publication of SG52875A1 publication Critical patent/SG52875A1/en

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

SG1996011856A 1995-12-19 1996-12-19 Plastic packaging for a surface mounted integrated circuit SG52875A1 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US889995P	1995-12-19	1995-12-19

Publications (1)

Publication Number	Publication Date
SG52875A1 true SG52875A1 (en)	1998-09-28

Family

ID=21734333

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SG1996011856A SG52875A1 (en)	1995-12-19	1996-12-19	Plastic packaging for a surface mounted integrated circuit

Country Status (6)

Country	Link
US (2)	US5777382A (de)
EP (1)	EP0780896A3 (de)
JP (1)	JPH09191060A (de)
MY (1)	MY128748A (de)
SG (1)	SG52875A1 (de)
TW (1)	TW463276B (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5677566A (en) *	1995-05-08	1997-10-14	Micron Technology, Inc.	Semiconductor chip package
JP3793628B2 (ja) *	1997-01-20	2006-07-05	沖電気工業株式会社	樹脂封止型半導体装置
JPH10294418A (ja) *	1997-04-21	1998-11-04	Oki Electric Ind Co Ltd	半導体装置
JP3210881B2 (ja) *	1997-06-05	2001-09-25	ソニーケミカル株式会社	Ｂｇａパッケージ基板
US5929522A (en) *	1998-04-17	1999-07-27	Hestia Technologies, Inc.	Semiconductor non-laminate package and method
US6635957B2 (en) *	1998-06-10	2003-10-21	Asat Ltd.	Leadless plastic chip carrier with etch back pad singulation and die attach pad array
US6933594B2 (en) *	1998-06-10	2005-08-23	Asat Ltd.	Leadless plastic chip carrier with etch back pad singulation
US7270867B1 (en)	1998-06-10	2007-09-18	Asat Ltd.	Leadless plastic chip carrier
US6229200B1 (en)	1998-06-10	2001-05-08	Asat Limited	Saw-singulated leadless plastic chip carrier
US7271032B1 (en)	1998-06-10	2007-09-18	Asat Ltd.	Leadless plastic chip carrier with etch back pad singulation
US6989294B1 (en)	1998-06-10	2006-01-24	Asat, Ltd.	Leadless plastic chip carrier with etch back pad singulation
US6872661B1 (en)	1998-06-10	2005-03-29	Asat Ltd.	Leadless plastic chip carrier with etch back pad singulation and die attach pad array
US7226811B1 (en)	1998-06-10	2007-06-05	Asat Ltd.	Process for fabricating a leadless plastic chip carrier
US8330270B1 (en)	1998-06-10	2012-12-11	Utac Hong Kong Limited	Integrated circuit package having a plurality of spaced apart pad portions
US7247526B1 (en)	1998-06-10	2007-07-24	Asat Ltd.	Process for fabricating an integrated circuit package
KR20000028360A (ko) *	1998-10-31	2000-05-25	김규현	반도체 장치
KR100960739B1 (ko) *	1999-02-26	2010-06-01	텍사스 인스트루먼츠 인코포레이티드	열적으로 향상된 반도체 볼 그리드 어레이 디바이스 및 그제조 방법
US6052045A (en) *	1999-03-12	2000-04-18	Kearney-National, Inc.	Electromechanical switching device package with controlled impedance environment
US6916683B2 (en) *	2000-05-11	2005-07-12	Micron Technology, Inc.	Methods of fabricating a molded ball grid array
USRE38381E1 (en)	2000-07-21	2004-01-13	Kearney-National Inc.	Inverted board mounted electromechanical device
US6391687B1 (en) *	2000-10-31	2002-05-21	Fairchild Semiconductor Corporation	Column ball grid array package
WO2003077269A2 (en) *	2002-03-08	2003-09-18	Kearney-National, Inc.	Surface mount molded relay package and method of manufacturing same
US7732914B1 (en)	2002-09-03	2010-06-08	Mclellan Neil	Cavity-type integrated circuit package
US7009286B1 (en)	2004-01-15	2006-03-07	Asat Ltd.	Thin leadless plastic chip carrier
US7091581B1 (en)	2004-06-14	2006-08-15	Asat Limited	Integrated circuit package and process for fabricating the same
US7411289B1 (en)	2004-06-14	2008-08-12	Asat Ltd.	Integrated circuit package with partially exposed contact pads and process for fabricating the same
US7595225B1 (en)	2004-10-05	2009-09-29	Chun Ho Fan	Leadless plastic chip carrier with contact standoff
US7358119B2 (en) *	2005-01-12	2008-04-15	Asat Ltd.	Thin array plastic package without die attach pad and process for fabricating the same
US7348663B1 (en)	2005-07-15	2008-03-25	Asat Ltd.	Integrated circuit package and method for fabricating same
US7410830B1 (en)	2005-09-26	2008-08-12	Asat Ltd	Leadless plastic chip carrier and method of fabricating same
US7256481B2 (en) *	2005-11-30	2007-08-14	Texas Instruments Incorporated	Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS61174752A (ja) *	1985-01-30	1986-08-06	Seiko Epson Corp	半導体装置
JPS6332955A (ja) *	1986-07-25	1988-02-12	Nec Corp	半導体集積回路装置
US5200362A (en) *	1989-09-06	1993-04-06	Motorola, Inc.	Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
US5293072A (en) *	1990-06-25	1994-03-08	Fujitsu Limited	Semiconductor device having spherical terminals attached to the lead frame embedded within the package body
JPH0462865A (ja) *	1990-06-25	1992-02-27	Fujitsu Ltd	半導体装置及びその製造方法
KR940002444B1 (ko) *	1990-11-13	1994-03-24	금성일렉트론 주식회사	반도체 소자의 패키지 어셈블리 방법
US5157480A (en) *	1991-02-06	1992-10-20	Motorola, Inc.	Semiconductor device having dual electrical contact sites
JPH0563109A (ja) *	1991-08-29	1993-03-12	New Japan Radio Co Ltd	モールド型ｉｃパツケージ
JPH05144995A (ja) *	1991-11-18	1993-06-11	Matsushita Electric Works Ltd	半導体パツケージ
JPH06268101A (ja) *	1993-03-17	1994-09-22	Hitachi Ltd	半導体装置及びその製造方法、電子装置、リ−ドフレ−ム並びに実装基板
EP0683517B1 (de) *	1994-05-09	2002-07-24	Nec Corporation	Halbleiteranordnung bestehend aus einem Halbleiterchip, der mittels Kontakthöckern auf der Leiterplatte verbunden ist und Montageverfahren
TW359880B (en) *	1995-08-30	1999-06-01	Samsung Electronics Co Ltd	Method of manufacturing semiconductor chip package
US5736432A (en) *	1996-09-20	1998-04-07	National Semiconductor Corporation	Lead frame with lead finger locking feature and method for making same

1996
- 1996-12-16 MY MYPI96005285A patent/MY128748A/en unknown
- 1996-12-18 EP EP96309224A patent/EP0780896A3/de not_active Withdrawn
- 1996-12-19 JP JP8339174A patent/JPH09191060A/ja active Pending
- 1996-12-19 US US08/769,917 patent/US5777382A/en not_active Expired - Lifetime
- 1996-12-19 SG SG1996011856A patent/SG52875A1/en unknown
1997
- 1997-02-19 TW TW086101926A patent/TW463276B/zh not_active IP Right Cessation
- 1997-08-26 US US08/918,404 patent/US5976914A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
US5777382A (en)	1998-07-07
EP0780896A2 (de)	1997-06-25
EP0780896A3 (de)	1999-04-14
MY128748A (en)	2007-02-28
US5976914A (en)	1999-11-02
JPH09191060A (ja)	1997-07-22
TW463276B (en)	2001-11-11

Publication	Publication Date	Title
SG52875A1 (en)	1998-09-28	Plastic packaging for a surface mounted integrated circuit
AU5506098A (en)	1998-07-15	A packaging structure for integrated circuits
GB2306775B (en)	2000-09-20	Integrated circuit package
HUP9800973A3 (en)	1999-05-28	Packaging machine
ZA9610699B (en)	1997-06-26	Packaging machine
GB9500652D0 (en)	1995-03-08	Packaging machine
AU1349492A (en)	1992-10-06	A package for integrated circuits
GB2312091B (en)	2000-08-23	A packaging assembly for a circuit assembly
HUP0100181A3 (en)	2001-06-28	A packaging machine
GB2303608B (en)	1998-09-02	Packaging machine
GB9620362D0 (en)	1996-11-13	A semi-conductor integrated circuit
GB2289256B (en)	1996-08-21	Packages For Mounting On a Bottle
GB2316935B (en)	2001-04-04	A packaging element
GB2313362B (en)	1998-04-08	A packaging article
GB2289011B (en)	1998-04-01	Mold for a semiconductor package
GB9720873D0 (en)	1997-12-03	Packaging machine with a stripping device
GB9425310D0 (en)	1995-02-15	A package tray
GB9506535D0 (en)	1995-05-17	A carton
GB2299891B (en)	1999-06-16	Integrated circuit packages
GB9826149D0 (en)	1999-01-20	A packaging device
GB9523456D0 (en)	1996-01-17	Electronic component packaging
AU123126S (en)	1995-04-03	A module for a container
AU5284096A (en)	1996-10-30	Integrated circuit packages
AU123157S (en)	1995-04-06	A packaging tray
SG55253A1 (en)	1998-12-21	A mould for integrated circuit encapsulation