SG87790G - Method of manufacturing an electronic microcircuit provided with contact elevations - Google Patents

Method of manufacturing an electronic microcircuit provided with contact elevations

Info

Publication number
SG87790G
SG87790G SG877/90A SG87790A SG87790G SG 87790 G SG87790 G SG 87790G SG 877/90 A SG877/90 A SG 877/90A SG 87790 A SG87790 A SG 87790A SG 87790 G SG87790 G SG 87790G
Authority
SG
Singapore
Prior art keywords
manufacturing
electronic microcircuit
contact elevations
microcircuit provided
elevations
Prior art date
Application number
SG877/90A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of SG87790G publication Critical patent/SG87790G/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
SG877/90A 1984-05-21 1990-10-25 Method of manufacturing an electronic microcircuit provided with contact elevations SG87790G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8401619A NL8401619A (nl) 1984-05-21 1984-05-21 Elektronisch microcircuit voorzien van kontaktverhogingen.

Publications (1)

Publication Number Publication Date
SG87790G true SG87790G (en) 1990-12-21

Family

ID=19843977

Family Applications (1)

Application Number Title Priority Date Filing Date
SG877/90A SG87790G (en) 1984-05-21 1990-10-25 Method of manufacturing an electronic microcircuit provided with contact elevations

Country Status (7)

Country Link
EP (1) EP0165626B1 (fr)
JP (1) JPS60254739A (fr)
KR (1) KR850008042A (fr)
DE (1) DE3574526D1 (fr)
HK (1) HK87691A (fr)
NL (1) NL8401619A (fr)
SG (1) SG87790G (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5776824A (en) 1995-12-22 1998-07-07 Micron Technology, Inc. Method for producing laminated film/metal structures for known good die ("KG") applications

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3978517A (en) * 1975-04-04 1976-08-31 Motorola, Inc. Titanium-silver-palladium metallization system and process therefor
DE8122540U1 (de) * 1981-07-31 1983-01-13 Philips Patentverwaltung Gmbh, 2000 Hamburg "informationskarte mit integriertem baustein"

Also Published As

Publication number Publication date
DE3574526D1 (de) 1990-01-04
EP0165626B1 (fr) 1989-11-29
NL8401619A (nl) 1985-12-16
HK87691A (en) 1991-11-15
KR850008042A (ko) 1985-12-11
EP0165626A1 (fr) 1985-12-27
JPS60254739A (ja) 1985-12-16
JPH0476497B2 (fr) 1992-12-03

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