NL8401619A - Elektronisch microcircuit voorzien van kontaktverhogingen. - Google Patents

Elektronisch microcircuit voorzien van kontaktverhogingen. Download PDF

Info

Publication number
NL8401619A
NL8401619A NL8401619A NL8401619A NL8401619A NL 8401619 A NL8401619 A NL 8401619A NL 8401619 A NL8401619 A NL 8401619A NL 8401619 A NL8401619 A NL 8401619A NL 8401619 A NL8401619 A NL 8401619A
Authority
NL
Netherlands
Prior art keywords
contact
elevations
paladium
contact elevations
electronic microcircuit
Prior art date
Application number
NL8401619A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8401619A priority Critical patent/NL8401619A/nl
Priority to EP85200739A priority patent/EP0165626B1/fr
Priority to DE8585200739T priority patent/DE3574526D1/de
Priority to KR1019850003274A priority patent/KR850008042A/ko
Priority to JP60108074A priority patent/JPS60254739A/ja
Publication of NL8401619A publication Critical patent/NL8401619A/nl
Priority to SG877/90A priority patent/SG87790G/en
Priority to HK876/91A priority patent/HK87691A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

Landscapes

  • Wire Bonding (AREA)
NL8401619A 1984-05-21 1984-05-21 Elektronisch microcircuit voorzien van kontaktverhogingen. NL8401619A (nl)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL8401619A NL8401619A (nl) 1984-05-21 1984-05-21 Elektronisch microcircuit voorzien van kontaktverhogingen.
EP85200739A EP0165626B1 (fr) 1984-05-21 1985-05-10 Procédé de fabrication d'un microcircuit électronique pourvu de contacts à protubérance
DE8585200739T DE3574526D1 (de) 1984-05-21 1985-05-10 Verfahren zur herstellung von elektronischen mikroschaltungen mit hoeckerfoermigen kontakten.
KR1019850003274A KR850008042A (ko) 1984-05-21 1985-05-14 돌출접점을 가진 전자 마이크로회로
JP60108074A JPS60254739A (ja) 1984-05-21 1985-05-20 接触突起を有する超小型電子回路
SG877/90A SG87790G (en) 1984-05-21 1990-10-25 Method of manufacturing an electronic microcircuit provided with contact elevations
HK876/91A HK87691A (en) 1984-05-21 1991-11-07 Method of manufacturing an electronic microcircuit provided with contact elevations

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8401619A NL8401619A (nl) 1984-05-21 1984-05-21 Elektronisch microcircuit voorzien van kontaktverhogingen.
NL8401619 1984-05-21

Publications (1)

Publication Number Publication Date
NL8401619A true NL8401619A (nl) 1985-12-16

Family

ID=19843977

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8401619A NL8401619A (nl) 1984-05-21 1984-05-21 Elektronisch microcircuit voorzien van kontaktverhogingen.

Country Status (7)

Country Link
EP (1) EP0165626B1 (fr)
JP (1) JPS60254739A (fr)
KR (1) KR850008042A (fr)
DE (1) DE3574526D1 (fr)
HK (1) HK87691A (fr)
NL (1) NL8401619A (fr)
SG (1) SG87790G (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5776824A (en) 1995-12-22 1998-07-07 Micron Technology, Inc. Method for producing laminated film/metal structures for known good die ("KG") applications

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3978517A (en) * 1975-04-04 1976-08-31 Motorola, Inc. Titanium-silver-palladium metallization system and process therefor
DE8122540U1 (de) * 1981-07-31 1983-01-13 Philips Patentverwaltung Gmbh, 2000 Hamburg "informationskarte mit integriertem baustein"

Also Published As

Publication number Publication date
DE3574526D1 (de) 1990-01-04
EP0165626B1 (fr) 1989-11-29
SG87790G (en) 1990-12-21
HK87691A (en) 1991-11-15
KR850008042A (ko) 1985-12-11
EP0165626A1 (fr) 1985-12-27
JPS60254739A (ja) 1985-12-16
JPH0476497B2 (fr) 1992-12-03

Similar Documents

Publication Publication Date Title
US4717066A (en) Method of bonding conductors to semiconductor devices
US3672047A (en) Method for bonding a conductive wire to a metal electrode
JP4056424B2 (ja) 半導体装置の製造方法
SE456874B (sv) Integrerat kretsorgan med ett flertal elektriska komponenter bildade i ett integrerat kretschip och ett saett foer dess framstaellning
JPH09326416A (ja) 半導体素子の実装方法およびその製品
NL8401619A (nl) Elektronisch microcircuit voorzien van kontaktverhogingen.
JP2917595B2 (ja) 金属ボールの形成方法
JP3524221B2 (ja) 半導体装置の製造方法
JPH0291944A (ja) 金バンプ用金合金細線
JPH0817870A (ja) 半導体装置
JPH09129779A (ja) 超微細電導極を有する半導体パッケージ
JPH0766235A (ja) 半導体素子用複合ボンディングワイヤおよび半導体装置
JPH05326817A (ja) マルチチップパッケージ
JP2789910B2 (ja) Ｉｃチップの接続構造およびその方法
JPH09252026A (ja) 超伝導装置
JP3459277B2 (ja) 固体電解コンデンサー
JP2979880B2 (ja) 複合リードフレームおよびその製造方法
JPH0855856A (ja) 半導体装置とその製造方法
JP2737137B2 (ja) 半導体素子ボンディング用絶縁被覆金または金合金極細線
JP2728216B2 (ja) 半導体素子のボンディング用金線
JP2690786B2 (ja) バンプ付フィルムキャリア
JPH1116946A (ja) 半導体装置の実装方法
JPH05211274A (ja) リードフレーム及び半導体装置
JP3109883B2 (ja) 電子部品及びそのボンディング方法
JP3086126B2 (ja) バンプ用微小金ボール

Legal Events

Date Code Title Description
A1B A search report has been drawn up
BV The patent application has lapsed