TH1279A3 - Lead-free high temperature solder - Google Patents
Lead-free high temperature solderInfo
- Publication number
- TH1279A3 TH1279A3 TH303001237U TH0303001237U TH1279A3 TH 1279 A3 TH1279 A3 TH 1279A3 TH 303001237 U TH303001237 U TH 303001237U TH 0303001237 U TH0303001237 U TH 0303001237U TH 1279 A3 TH1279 A3 TH 1279A3
- Authority
- TH
- Thailand
- Prior art keywords
- lead
- high temperature
- free high
- temperature solder
- weight
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract 2
- 239000011574 phosphorus Substances 0.000 claims abstract 2
- 229910052709 silver Inorganic materials 0.000 claims abstract 2
- 239000004332 silver Substances 0.000 claims abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Abstract
โลหะบัดกรีอุณหภูมิสูงชนิดไร้สารตะกั่วผสม ซึ่งมีส่วนประกอบของโลหะต่างๆ อยู่ในเนื้อ ของโลหะบัดกรีและที่ใช้เป็นส่วนประกอบในขั้นตอนกระบวนการประดิษฐ์ ผลิตภัณฑ์ ประกอบด้วย ฟอสฟอรัส 0.001 - 5.0 % โดยน้ำหนัก เงิน 0.05 - 50.0 % โดยน้ำหนัก และค่าสมดุล จะเป็นดีบุก Lead-free high temperature solder Which contains various metal components in the body of solder and used as a component in the fabrication process. Products contain phosphorus 0.001 - 5.0% with silver weight 0.05 - 50.0% by weight and the balance is tin.
Claims (1)
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TH1279A3 true TH1279A3 (en) | 2004-03-10 |
| TH1279C3 TH1279C3 (en) | 2004-03-10 |
Family
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