TH18258A3 - "Method for recovering empty semiconductor chips from plastic-packed modules" - Google Patents

Abstract

Removing the plastic packaging is imperative. truly in the electronics industry especially for creating and damage analysis of semiconductor chips compressed in modules. packed using plastic The purpose of the method turned out to be to bring the chip. Empty semiconductor removed without damage. The problem is particularly severe when the resin used for the etching-resistant plastic cladding. is used as a compressed object This method of invention is particularly relevant to the module. a container using a type of plastic (10) to which the chip's contact area (11) is connected by Fixing the wire to the connector conductor (12) and where the chip is extruded in a thermoplastic resin such bite How to open a new design Includes step a) Aligning the top of the module (10) to remove the top of the resin plastic cladding (13) until the leads (12) of the mounting bracket are exposed. b) Removing the bracket. c) Coarse sanding of the back of the module to remove The bottom part of the plastic cladding resin (13) is removed until the surface The passive form of the silicon chip (11) appears d) the resulting module immersion. in a hot smoked nitric acid bath to a temperature of approximately 120 °C and for approximately 8 minutes; and e) the resulting module was immediately cooled by blowing compressed air at ambient temperature on it To produce a thermal shock, all the residuals of the plastic cladding resin (13) were removed, leaving the desired blank silicon chip without any damage.

Claims (5)

1. Method for recovering the bare, undamaged semiconductor chip (11) from a type of plastic-loaded module (10) first, the contact area (19) of the chip is connected by a metal wire. (15) semiconductor fasteners (12) of plate to plate And where the chip is extruded in a plastic-covered resin (13) which is resistant to nitric acid smoke, such opening method includes step a) sanding the top of the module. T Until the conductors of The plate appears. B) Remove the plate c) Polishing the top of the rough module until the passive surface of the silicon chip. Turns out approximately d) heating per the resulting module Until the temperature is about 50 ํ C without affecting the damage. Ability to do Chip function E) Immediate cooling of the resulting module to cause thermal shock. Where all the remainder of the plastic cladding resin is removed, leaving the required bare silicon chips. 2. Procedures for claim 1 also include a procedure f) conducting the wire near the contact area. Of the said chip out 3. Method of claim No. 1 or 2, where the procedure for giving The heat to the module obtained in step d) is composed of d1) chamber chamber Nitric acid is a hot smoke at a high temperature. That is between about 80 and about 150 ํ C is one that is between about 4 and about 10 minutes. 4. Method of claim No. 1 or 2 or 3 where the procedure This 2) process consists of d1) blowing compressed air at ambient temperature. 5. One of the above claim methods where step f) consists of immersing the chips in a turbulent mercury bath for approximately 45 minutes.