TW200533728A - Wax for temporarily bonding material to be etched - Google Patents

Wax for temporarily bonding material to be etched Download PDF

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Publication number
TW200533728A
TW200533728A TW93139841A TW93139841A TW200533728A TW 200533728 A TW200533728 A TW 200533728A TW 93139841 A TW93139841 A TW 93139841A TW 93139841 A TW93139841 A TW 93139841A TW 200533728 A TW200533728 A TW 200533728A
Authority
TW
Taiwan
Prior art keywords
wax
viscosity
etched
rosin
etching
Prior art date
Application number
TW93139841A
Other languages
English (en)
Chinese (zh)
Other versions
TWI292429B (da
Inventor
Hiroshi Tanaka
Hiroshi Nishida
Original Assignee
Sumitomo Precision Prod Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Prod Co filed Critical Sumitomo Precision Prod Co
Publication of TW200533728A publication Critical patent/TW200533728A/zh
Application granted granted Critical
Publication of TWI292429B publication Critical patent/TWI292429B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
    • C08L93/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Drying Of Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW93139841A 2003-12-26 2004-12-21 Wax for temporarily bonding material to be etched TW200533728A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003433300A JP4617080B2 (ja) 2003-12-26 2003-12-26 被エッチング材の仮接着用ワックス

Publications (2)

Publication Number Publication Date
TW200533728A true TW200533728A (en) 2005-10-16
TWI292429B TWI292429B (da) 2008-01-11

Family

ID=34736510

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93139841A TW200533728A (en) 2003-12-26 2004-12-21 Wax for temporarily bonding material to be etched

Country Status (3)

Country Link
JP (1) JP4617080B2 (da)
TW (1) TW200533728A (da)
WO (1) WO2005063915A1 (da)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114634793A (zh) * 2022-03-23 2022-06-17 福州硕榕光电有限公司 一种光学上盘蜡及其制备方法与应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54123148A (en) * 1978-03-17 1979-09-25 Nippon Telegr & Teleph Corp <Ntt> Bonding method of specimen to be polished
JPH0726087B2 (ja) * 1989-12-29 1995-03-22 日化精工株式会社 ウエハーの仮着用接着剤およびその洗浄剤
JP2741362B2 (ja) * 1995-12-05 1998-04-15 日化精工株式会社 ウエハ−の仮着用接着剤
JPH11293224A (ja) * 1998-04-07 1999-10-26 The Inctec Inc シリコンウエハー用仮着接着剤及びその精製方法
JP2000087004A (ja) * 1998-09-17 2000-03-28 Nitta Ind Corp 被加工物用保持剤およびそれを用いた被加工物の脱着方法

Also Published As

Publication number Publication date
WO2005063915A1 (ja) 2005-07-14
JP4617080B2 (ja) 2011-01-19
TWI292429B (da) 2008-01-11
JP2005187740A (ja) 2005-07-14

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MM4A Annulment or lapse of patent due to non-payment of fees