TW200636726A - Non-volatile semiconductor memory device - Google Patents
Non-volatile semiconductor memory deviceInfo
- Publication number
- TW200636726A TW200636726A TW095102650A TW95102650A TW200636726A TW 200636726 A TW200636726 A TW 200636726A TW 095102650 A TW095102650 A TW 095102650A TW 95102650 A TW95102650 A TW 95102650A TW 200636726 A TW200636726 A TW 200636726A
- Authority
- TW
- Taiwan
- Prior art keywords
- current
- terminal element
- voltage
- memory cells
- variable resistor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 230000002457 bidirectional effect Effects 0.000 abstract 1
- 230000003071 parasitic effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
- G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0007—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/003—Cell access
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
- G11C2013/009—Write using potential difference applied between cell electrodes
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/10—Resistive cells; Technology aspects
- G11C2213/15—Current-voltage curve
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/30—Resistive cell, memory material aspects
- G11C2213/31—Material having complex metal oxide, e.g. perovskite structure
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/30—Resistive cell, memory material aspects
- G11C2213/32—Material having simple binary metal oxide structure
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/30—Resistive cell, memory material aspects
- G11C2213/34—Material includes an oxide or a nitride
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/72—Array wherein the access device being a diode
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/76—Array using an access device for each cell which being not a transistor and not a diode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8836—Complex metal oxides, e.g. perovskites, spinels
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005015108A JP2006203098A (ja) | 2005-01-24 | 2005-01-24 | 不揮発性半導体記憶装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200636726A true TW200636726A (en) | 2006-10-16 |
| TWI307098B TWI307098B (zh) | 2009-03-01 |
Family
ID=36692137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095102650A TW200636726A (en) | 2005-01-24 | 2006-01-24 | Non-volatile semiconductor memory device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20090052225A1 (zh) |
| JP (1) | JP2006203098A (zh) |
| TW (1) | TW200636726A (zh) |
| WO (1) | WO2006077747A1 (zh) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9601192B2 (en) | 2011-03-23 | 2017-03-21 | Kabushiki Kaisha Toshiba | Resistance-change memory having on-state, off-state, and intermediate state |
| TWI612698B (zh) * | 2013-10-09 | 2018-01-21 | 財團法人工業技術研究院 | 多位元儲存之非揮發性記憶體晶胞及非揮發性記憶體 |
| US10892300B2 (en) | 2019-03-08 | 2021-01-12 | Toshiba Memory Corporation | Storage device |
| TWI793846B (zh) * | 2021-03-11 | 2023-02-21 | 日商鎧俠股份有限公司 | 儲存裝置 |
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| JP4054347B2 (ja) | 2005-12-16 | 2008-02-27 | シャープ株式会社 | 不揮発性半導体記憶装置 |
| KR100855855B1 (ko) | 2006-10-04 | 2008-09-01 | 주식회사 하이닉스반도체 | 비휘발성 메모리 소자 및 그 제조방법 |
| WO2008059701A1 (ja) * | 2006-11-17 | 2008-05-22 | Panasonic Corporation | 不揮発性記憶素子、不揮発性記憶装置、不揮発性半導体装置、および不揮発性記憶素子の製造方法 |
| JP4167298B2 (ja) | 2006-11-20 | 2008-10-15 | 松下電器産業株式会社 | 不揮発性半導体記憶装置およびその製造方法 |
| WO2008062734A1 (en) * | 2006-11-20 | 2008-05-29 | Panasonic Corporation | Nonvolatile storage element, nonvolatile storage element array and its fabrication process |
| JP4088323B1 (ja) | 2006-12-06 | 2008-05-21 | シャープ株式会社 | 不揮発性半導体記憶装置 |
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| US7382647B1 (en) | 2007-02-27 | 2008-06-03 | International Business Machines Corporation | Rectifying element for a crosspoint based memory array architecture |
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| US20090095985A1 (en) * | 2007-10-10 | 2009-04-16 | Samsung Electronics Co., Ltd. | Multi-layer electrode, cross point memory array and method of manufacturing the same |
| CN101828262B (zh) * | 2007-10-15 | 2012-06-06 | 松下电器产业株式会社 | 非易失性存储元件和使用该非易失性存储元件的非易失性半导体装置 |
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| JPH0660635A (ja) * | 1992-08-06 | 1994-03-04 | Olympus Optical Co Ltd | 強誘電体メモリ装置 |
| US5894447A (en) * | 1996-09-26 | 1999-04-13 | Kabushiki Kaisha Toshiba | Semiconductor memory device including a particular memory cell block structure |
| US6204139B1 (en) * | 1998-08-25 | 2001-03-20 | University Of Houston | Method for switching the properties of perovskite materials used in thin film resistors |
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| JP2002056666A (ja) * | 2000-08-10 | 2002-02-22 | Canon Inc | 磁性薄膜メモリ、記録方法および再生方法 |
| US6839269B2 (en) * | 2001-12-28 | 2005-01-04 | Kabushiki Kaisha Toshiba | Magnetic random access memory |
| US6917539B2 (en) * | 2002-08-02 | 2005-07-12 | Unity Semiconductor Corporation | High-density NVRAM |
| US6753561B1 (en) * | 2002-08-02 | 2004-06-22 | Unity Semiconductor Corporation | Cross point memory array using multiple thin films |
| KR100515053B1 (ko) * | 2002-10-02 | 2005-09-14 | 삼성전자주식회사 | 비트라인 클램핑 전압 레벨에 대해 안정적인 독출 동작이가능한 마그네틱 메모리 장치 |
| JP2004273656A (ja) * | 2003-03-07 | 2004-09-30 | Taiyo Yuden Co Ltd | Epir素子及びそれを利用した半導体装置 |
| JP2004319587A (ja) * | 2003-04-11 | 2004-11-11 | Sharp Corp | メモリセル、メモリ装置及びメモリセル製造方法 |
| JP2005032401A (ja) * | 2003-06-17 | 2005-02-03 | Sharp Corp | 不揮発性半導体記憶装置及びその書き込み方法と消去方法 |
| DE102004006254A1 (de) * | 2004-02-09 | 2005-09-01 | Infineon Technologies Ag | Schaltungsanordnung zur Erzeugung eines Rücksetzsignals nach einem Absinken und Wiederansteigen einer Versorgungsspannung |
| JP4054347B2 (ja) * | 2005-12-16 | 2008-02-27 | シャープ株式会社 | 不揮発性半導体記憶装置 |
| JP4594878B2 (ja) * | 2006-02-23 | 2010-12-08 | シャープ株式会社 | 可変抵抗素子の抵抗制御方法及び不揮発性半導体記憶装置 |
-
2005
- 2005-01-24 JP JP2005015108A patent/JP2006203098A/ja active Pending
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2006
- 2006-01-05 WO PCT/JP2006/300040 patent/WO2006077747A1/ja not_active Ceased
- 2006-01-05 US US11/795,820 patent/US20090052225A1/en not_active Abandoned
- 2006-01-24 TW TW095102650A patent/TW200636726A/zh not_active IP Right Cessation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9601192B2 (en) | 2011-03-23 | 2017-03-21 | Kabushiki Kaisha Toshiba | Resistance-change memory having on-state, off-state, and intermediate state |
| US9928908B2 (en) | 2011-03-23 | 2018-03-27 | Toshiba Memory Corporation | Resistance-change memory operating with read pulses of opposite polarity |
| TWI612698B (zh) * | 2013-10-09 | 2018-01-21 | 財團法人工業技術研究院 | 多位元儲存之非揮發性記憶體晶胞及非揮發性記憶體 |
| US10892300B2 (en) | 2019-03-08 | 2021-01-12 | Toshiba Memory Corporation | Storage device |
| TWI720554B (zh) * | 2019-03-08 | 2021-03-01 | 日商東芝記憶體股份有限公司 | 記憶裝置 |
| TWI793846B (zh) * | 2021-03-11 | 2023-02-21 | 日商鎧俠股份有限公司 | 儲存裝置 |
| US11676661B2 (en) | 2021-03-11 | 2023-06-13 | Kioxia Corporation | Storage device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI307098B (zh) | 2009-03-01 |
| WO2006077747A1 (ja) | 2006-07-27 |
| US20090052225A1 (en) | 2009-02-26 |
| JP2006203098A (ja) | 2006-08-03 |
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