TW200707622A - Translating/turning 2-degree-of-freedom stage device and 3-degree-of-freedom stage device using the same - Google Patents

Translating/turning 2-degree-of-freedom stage device and 3-degree-of-freedom stage device using the same

Info

Publication number
TW200707622A
TW200707622A TW095123411A TW95123411A TW200707622A TW 200707622 A TW200707622 A TW 200707622A TW 095123411 A TW095123411 A TW 095123411A TW 95123411 A TW95123411 A TW 95123411A TW 200707622 A TW200707622 A TW 200707622A
Authority
TW
Taiwan
Prior art keywords
translating
turning
degree
stage device
freedom
Prior art date
Application number
TW095123411A
Other languages
English (en)
Chinese (zh)
Other versions
TWI302723B (2
Inventor
Takehiko Komiya
Toshiyuki Osuga
Original Assignee
Yaskawa Denki Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Denki Seisakusho Kk filed Critical Yaskawa Denki Seisakusho Kk
Publication of TW200707622A publication Critical patent/TW200707622A/zh
Application granted granted Critical
Publication of TWI302723B publication Critical patent/TWI302723B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Machine Tool Units (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Machine Tool Positioning Apparatuses (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW095123411A 2005-06-30 2006-06-28 Translating/turning 2-degree-of-freedom stage device and 3-degree-of-freedom stage device using the same TW200707622A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005192131 2005-06-30

Publications (2)

Publication Number Publication Date
TW200707622A true TW200707622A (en) 2007-02-16
TWI302723B TWI302723B (2) 2008-11-01

Family

ID=37604286

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123411A TW200707622A (en) 2005-06-30 2006-06-28 Translating/turning 2-degree-of-freedom stage device and 3-degree-of-freedom stage device using the same

Country Status (5)

Country Link
JP (1) JP4826584B2 (2)
KR (1) KR20080002864A (2)
CN (1) CN101203354A (2)
TW (1) TW200707622A (2)
WO (1) WO2007004413A1 (2)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010006466A1 (zh) * 2008-07-16 2010-01-21 北京航空航天大学 非对称直线驱动的平动加转动进给功能部件
CN101770166B (zh) * 2010-01-06 2011-12-28 天津大学 一种用于纳米压印光刻系统的两平动精密定位工作台
CN101750885B (zh) * 2010-01-06 2011-12-14 天津大学 二自由度精密定位工作台
CN102998899B (zh) * 2012-12-05 2014-09-17 天津大学 二自由度纳米定位平台
US10016818B2 (en) * 2015-12-11 2018-07-10 The Boeing Company Multi-axis adjustment apparatus for machining a workpiece and associated method
KR102052135B1 (ko) * 2018-04-09 2019-12-04 주식회사 에이치비테크놀러지 사이드 듀얼 그립퍼 구동방식의 θ축 얼라인 조정이 가능한 AOI 검사 장비
CN112193371A (zh) * 2020-10-09 2021-01-08 九江精密测试技术研究所 一种船用三自由度位移平台
CN112517724A (zh) * 2020-11-28 2021-03-19 武汉重型机床集团有限公司 一种加工范围可调旋轮座

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06294B2 (ja) * 1986-09-03 1994-01-05 新明和工業株式会社 位置決め装置
JP2675307B2 (ja) * 1987-08-28 1997-11-12 株式会社日立製作所 プリアライナー装置
JPH02202031A (ja) * 1989-01-31 1990-08-10 Nippon Seiko Kk 回動テーブル装置
JP2523978B2 (ja) * 1990-10-04 1996-08-14 松下電器産業株式会社 位置決めテ―ブル
JP3607449B2 (ja) * 1997-03-14 2005-01-05 株式会社東芝 画像処理アライメント装置
JPH11245128A (ja) * 1998-02-26 1999-09-14 Thk Co Ltd ２軸平行・１軸旋回運動案内機構およびこれを用いた２軸平行・１軸旋回テーブル装置
JPH11300558A (ja) * 1998-04-15 1999-11-02 Thk Co Ltd 移動テーブル装置
JP3733808B2 (ja) * 1999-10-26 2006-01-11 松下電器産業株式会社 ＸＹθ３軸移動テーブル
JP2002228411A (ja) * 2001-02-05 2002-08-14 Hitachi Kokusai Electric Inc 二次元測定装置

Also Published As

Publication number Publication date
JPWO2007004413A1 (ja) 2009-01-22
WO2007004413A1 (ja) 2007-01-11
TWI302723B (2) 2008-11-01
CN101203354A (zh) 2008-06-18
JP4826584B2 (ja) 2011-11-30
KR20080002864A (ko) 2008-01-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees