TW200737393A - Heat treatment unit - Google Patents

Heat treatment unit

Info

Publication number
TW200737393A
TW200737393A TW095145644A TW95145644A TW200737393A TW 200737393 A TW200737393 A TW 200737393A TW 095145644 A TW095145644 A TW 095145644A TW 95145644 A TW95145644 A TW 95145644A TW 200737393 A TW200737393 A TW 200737393A
Authority
TW
Taiwan
Prior art keywords
heat treatment
treatment unit
monotonous
heater
substrate
Prior art date
Application number
TW095145644A
Other languages
English (en)
Other versions
TWI339872B (en
Inventor
Yasutaka Souma
Norio Wada
Shunichi Yahiro
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200737393A publication Critical patent/TW200737393A/zh
Application granted granted Critical
Publication of TWI339872B publication Critical patent/TWI339872B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Resistance Heating (AREA)
  • Resistance Heating (AREA)
  • Tunnel Furnaces (AREA)
TW095145644A 2005-12-08 2006-12-07 Heat treatment unit TWI339872B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005355183A JP4531690B2 (ja) 2005-12-08 2005-12-08 加熱処理装置

Publications (2)

Publication Number Publication Date
TW200737393A true TW200737393A (en) 2007-10-01
TWI339872B TWI339872B (en) 2011-04-01

Family

ID=38130875

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095145644A TWI339872B (en) 2005-12-08 2006-12-07 Heat treatment unit

Country Status (4)

Country Link
JP (1) JP4531690B2 (zh)
KR (1) KR101269748B1 (zh)
CN (1) CN100474507C (zh)
TW (1) TWI339872B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101055862B1 (ko) * 2009-03-23 2011-08-09 주식회사 테라세미콘 인라인 열처리 장치
JP4936567B2 (ja) * 2009-09-18 2012-05-23 東京エレクトロン株式会社 熱処理装置
JP2011216572A (ja) * 2010-03-31 2011-10-27 Dainippon Screen Mfg Co Ltd 基板処理装置
JP5226037B2 (ja) * 2010-06-04 2013-07-03 東京エレクトロン株式会社 熱処理装置及び熱処理方法
JP5165731B2 (ja) 2010-06-30 2013-03-21 東京エレクトロン株式会社 局所露光装置及び局所露光方法
JP5470236B2 (ja) 2010-12-22 2014-04-16 東京エレクトロン株式会社 局所露光方法及び局所露光装置
JP5369128B2 (ja) * 2011-03-01 2013-12-18 東京エレクトロン株式会社 浮上式塗布装置
JP5451798B2 (ja) 2011-03-15 2014-03-26 東京エレクトロン株式会社 局所露光方法及び局所露光装置
JP5773815B2 (ja) * 2011-09-12 2015-09-02 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
US11476167B2 (en) 2017-03-03 2022-10-18 SCREEN Holdings Co., Ltd. Heat treatment method and heat treatment apparatus of light irradiation type
JP7265314B2 (ja) * 2017-03-03 2023-04-26 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
JP7232593B2 (ja) 2018-08-30 2023-03-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7232596B2 (ja) * 2018-08-30 2023-03-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7186605B2 (ja) 2018-12-27 2022-12-09 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7142566B2 (ja) 2018-12-27 2022-09-27 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR102220853B1 (ko) * 2019-05-27 2021-02-26 주식회사 선코리아 열처리장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62252989A (ja) * 1986-04-25 1987-11-04 日本電気株式会社 印刷配線板の製造方法
JPH0193121A (ja) * 1987-10-05 1989-04-12 Kawasaki Steel Corp 半導体ウェハベーキング装置
JPH0270426A (ja) * 1988-09-06 1990-03-09 Kawasaki Steel Corp 制振性を備えた複合鋼板
JPH04243119A (ja) * 1991-01-17 1992-08-31 Sharp Corp レジスト加熱装置
JPH0531223U (ja) * 1991-09-30 1993-04-23 日本電気株式会社 液晶デイスプレイアクテイブ素子製造用現像装置
JP3438790B2 (ja) * 1994-07-28 2003-08-18 富士通株式会社 ベーキング装置
JPH0953881A (ja) * 1995-08-11 1997-02-25 Fuji Photo Film Co Ltd 硬基板のベーク装置
JPH09310198A (ja) * 1996-05-20 1997-12-02 Dainippon Printing Co Ltd 電着レジスト乾燥装置
JPH1147668A (ja) * 1997-06-06 1999-02-23 Kansai Denshi Kk 基板乾燥装置
JP2005123284A (ja) * 2003-10-15 2005-05-12 Renesas Technology Corp 半導体製造装置

Also Published As

Publication number Publication date
KR101269748B1 (ko) 2013-05-30
JP4531690B2 (ja) 2010-08-25
JP2007158253A (ja) 2007-06-21
CN1979765A (zh) 2007-06-13
KR20070061418A (ko) 2007-06-13
TWI339872B (en) 2011-04-01
CN100474507C (zh) 2009-04-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees