TW200745308A - Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method - Google Patents

Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method

Info

Publication number
TW200745308A
TW200745308A TW096112733A TW96112733A TW200745308A TW 200745308 A TW200745308 A TW 200745308A TW 096112733 A TW096112733 A TW 096112733A TW 96112733 A TW96112733 A TW 96112733A TW 200745308 A TW200745308 A TW 200745308A
Authority
TW
Taiwan
Prior art keywords
circuit
circuit member
member connecting
adhesive layer
adhesive film
Prior art date
Application number
TW096112733A
Other languages
English (en)
Chinese (zh)
Other versions
TWI367930B (fr
Inventor
Yukihisa Hirosawa
Tadamitsu Iimura
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200745308A publication Critical patent/TW200745308A/zh
Application granted granted Critical
Publication of TWI367930B publication Critical patent/TWI367930B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
TW096112733A 2006-04-12 2007-04-11 Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method TW200745308A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006109690 2006-04-12
JP2006213444 2006-08-04

Publications (2)

Publication Number Publication Date
TW200745308A true TW200745308A (en) 2007-12-16
TWI367930B TWI367930B (fr) 2012-07-11

Family

ID=38624909

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096112733A TW200745308A (en) 2006-04-12 2007-04-11 Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method

Country Status (5)

Country Link
JP (1) JP4775377B2 (fr)
KR (2) KR101090561B1 (fr)
CN (3) CN101421886B (fr)
TW (1) TW200745308A (fr)
WO (1) WO2007123003A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464228B (zh) * 2010-12-23 2014-12-11 Cheil Ind Inc 異向性導電膜及包含其之裝置
TWI491663B (zh) * 2009-07-01 2015-07-11 Nippon Kayaku Kk A liquid crystal sealant for liquid crystal dropping, and a liquid crystal display unit using the sealant
TWI557208B (zh) * 2012-09-18 2016-11-11 迪睿合股份有限公司 An anisotropic conductive film, an anisotropic conductive film manufacturing method, a method for manufacturing a connecting body, and a connecting method
TWI666657B (zh) * 2015-05-28 2019-07-21 日商拓自達電線股份有限公司 安裝用導電性糊
TWI741973B (zh) * 2015-12-22 2021-10-11 美商英特爾股份有限公司 層積體之製造方法，層積體及多層電路基板

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5186157B2 (ja) * 2007-08-24 2013-04-17 デクセリアルズ株式会社 異方性導電フィルム及びそれを用いた接続構造体の製造方法
JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
JP2010241993A (ja) * 2009-04-08 2010-10-28 Canon Chemicals Inc 導電性接着剤
KR20120076187A (ko) * 2010-12-29 2012-07-09 제일모직주식회사 이방 도전성 필름
CN103596379A (zh) * 2013-10-26 2014-02-19 溧阳市东大技术转移中心有限公司 一种双层柔性电路板的制造方法
JP6408759B2 (ja) * 2013-11-08 2018-10-17 デクセリアルズ株式会社 接着剤組成物、及びフィルム巻装体
JP6988482B2 (ja) * 2016-01-29 2022-01-05 昭和電工マテリアルズ株式会社 接着剤フィルム及びその製造方法、接着剤テープ、並びに接着剤フィルム用リール
CN108040425B (zh) * 2017-12-14 2019-09-20 广东长盈精密技术有限公司 电子设备及其电路板
KR102729383B1 (ko) * 2018-06-06 2024-11-12 데쿠세리아루즈 가부시키가이샤 필러 함유 필름
KR102254467B1 (ko) * 2018-07-12 2021-05-21 에이치엔에스하이텍(주) 이방도전성 접착필름의 제조방법
KR102254470B1 (ko) * 2018-07-12 2021-05-21 에이치엔에스하이텍(주) 도전입자의 이격거리가 제어된 이방도전성 접착필름의 제조방법
CN110875101A (zh) * 2018-08-31 2020-03-10 玮锋科技股份有限公司 异方性导电膜结构及其制作方法
JP7889048B2 (ja) * 2022-05-02 2026-07-14 株式会社レゾナック フィルム状接着剤、及び、回路接続構造体の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61195179A (ja) * 1985-02-25 1986-08-29 Matsushita Electric Ind Co Ltd 異方導電性接着シ−ト
JPH01236588A (ja) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd 異方導電性接着体
JPH0636327B2 (ja) * 1988-07-06 1994-05-11 日東電工株式会社 導電性接着テープ
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
JPH03107888A (ja) * 1989-09-21 1991-05-08 Sharp Corp 回路基板の接続構造
JPH04366630A (ja) * 1991-06-13 1992-12-18 Sharp Corp 異方性導電接着テープ
US5401913A (en) * 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
JPH07230840A (ja) * 1994-02-17 1995-08-29 Hitachi Chem Co Ltd 接続部材及びこれを用いた電極の接続構造
JP3656768B2 (ja) * 1995-02-07 2005-06-08 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
US5718789A (en) * 1995-06-07 1998-02-17 The Dexter Corporation Method for making a debossed conductive film composite
JP3914606B2 (ja) * 1997-04-25 2007-05-16 松下電器産業株式会社 接着層の製造装置、両面基板の製造装置および多層基板の製造装置
JPH11135567A (ja) 1997-10-30 1999-05-21 Toshiba Corp 異方性導電膜、半導体装置の製造方法
EP1045437A3 (fr) * 1999-04-13 2004-09-01 Matsushita Electric Industrial Co., Ltd. Structure de montage pour un dispositif électronique, son procédé de fabrication, et adhésif conducteur utilisé à cet effet
JP2002076607A (ja) * 2000-08-25 2002-03-15 Sekisui Chem Co Ltd 微粒子の転写・配置方法、微粒子配置フィルム、導電接続フィルム、及び、導電接続構造体
KR100559937B1 (ko) * 2003-01-08 2006-03-13 엘에스전선 주식회사 미세회로의 접속방법 및 그에 의한 접속 구조체

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI491663B (zh) * 2009-07-01 2015-07-11 Nippon Kayaku Kk A liquid crystal sealant for liquid crystal dropping, and a liquid crystal display unit using the sealant
TWI464228B (zh) * 2010-12-23 2014-12-11 Cheil Ind Inc 異向性導電膜及包含其之裝置
TWI557208B (zh) * 2012-09-18 2016-11-11 迪睿合股份有限公司 An anisotropic conductive film, an anisotropic conductive film manufacturing method, a method for manufacturing a connecting body, and a connecting method
TWI666657B (zh) * 2015-05-28 2019-07-21 日商拓自達電線股份有限公司 安裝用導電性糊
TWI741973B (zh) * 2015-12-22 2021-10-11 美商英特爾股份有限公司 層積體之製造方法，層積體及多層電路基板

Also Published As

Publication number Publication date
CN101901971B (zh) 2012-07-04
CN101901972A (zh) 2010-12-01
KR101150116B1 (ko) 2012-06-08
CN101421886A (zh) 2009-04-29
CN101901971A (zh) 2010-12-01
JP4775377B2 (ja) 2011-09-21
JPWO2007123003A1 (ja) 2009-09-03
WO2007123003A1 (fr) 2007-11-01
CN101421886B (zh) 2010-12-15
KR20110063586A (ko) 2011-06-10
KR20080108615A (ko) 2008-12-15
KR101090561B1 (ko) 2011-12-08
CN101901972B (zh) 2012-07-04
TWI367930B (fr) 2012-07-11

Similar Documents

Publication Publication Date Title
FI20041525L (fi) Elektroniikkamoduuli ja menetelmä sen valmistamiseksi
TWI229284B (en) Input device
WO2009078409A1 (fr) Matériau de connexion de circuit et structure pour connecter un élément de circuit
JP2008242499A5 (fr)
DE602007012890D1 (de) Kontaktierung von elektrochromen anordnungen
TW200629490A (en) Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same
WO2008139934A1 (fr) Carte multicouche et son procédé de fabrication
TW200612440A (en) Polymer-matrix conductive film and method for fabricating the same
TW200944072A (en) Method for manufacturing a substrate having embedded component therein
TW200513650A (en) Micro-electromechanical probe circuit film, method for making the same and applications thereof
WO2009108800A3 (fr) Procédé et dispositif pour la fabrication de substrats composites pour dispositifs électro-optiques à film mince
US20140327842A1 (en) Touch screen and manufacturing method of the same
WO2009044698A1 (fr) Dispositif semi-conducteur émettant de la lumière et procédé de fabrication d'un dispositif semi-conducteur émettant de la lumière
TW200726334A (en) Circuit board structure having capacitance array and embedded electronic component and method for fabricating the same
TW200740334A (en) Multilayer printed wiring board and its manufacturing method
TW200618304A (en) Thin film semiconductor device and method of manufacturing the same, electro-optical device, and electronic apparatus
TW200731898A (en) Circuit board structure and method for fabricating the same
WO2009038033A1 (fr) Dispositif d'affichage électrochromique et son procédé de fabrication
TW200951538A (en) Flexible display module and method of manufacturing the same
TW200630007A (en) Circuitized substrate utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same
TW200717744A (en) Stack structure of semiconductor component embedded in supporting board and method for fabricating the same
TW200726335A (en) Substrate structure with capacitance component embedded therein and method for fabricating the same
CN116113285A (zh) 一种显示面板及其制备方法、显示模组
TW200727438A (en) Multi-layered anisotropic conductive film
TW200739612A (en) Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees