TW200842014A - Apparatus and method for separating and transporting substrates - Google Patents
Apparatus and method for separating and transporting substrates Download PDFInfo
- Publication number
- TW200842014A TW200842014A TW096148137A TW96148137A TW200842014A TW 200842014 A TW200842014 A TW 200842014A TW 096148137 A TW096148137 A TW 096148137A TW 96148137 A TW96148137 A TW 96148137A TW 200842014 A TW200842014 A TW 200842014A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- gripper
- stack
- isolated
- fluid
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 341
- 238000000034 method Methods 0.000 title claims description 35
- 239000012530 fluid Substances 0.000 claims abstract description 77
- 238000013461 design Methods 0.000 claims abstract description 5
- 238000003825 pressing Methods 0.000 claims description 27
- 239000011159 matrix material Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 6
- 230000035939 shock Effects 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 1
- 238000000926 separation method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 description 19
- 238000012545 processing Methods 0.000 description 17
- 238000002955 isolation Methods 0.000 description 16
- 230000008901 benefit Effects 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 230000006378 damage Effects 0.000 description 5
- 238000013016 damping Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000002002 slurry Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000009347 mechanical transmission Effects 0.000 description 1
- UNASZPQZIFZUSI-UHFFFAOYSA-N methylidyneniobium Chemical compound [Nb]#C UNASZPQZIFZUSI-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06026054A EP1935599B1 (de) | 2006-12-15 | 2006-12-15 | Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200842014A true TW200842014A (en) | 2008-11-01 |
Family
ID=37946339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096148137A TW200842014A (en) | 2006-12-15 | 2007-12-14 | Apparatus and method for separating and transporting substrates |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1935599B1 (de) |
| AT (1) | ATE404341T1 (de) |
| DE (1) | DE502006001352D1 (de) |
| ES (1) | ES2313535T3 (de) |
| PL (1) | PL1935599T3 (de) |
| TW (1) | TW200842014A (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2122676B1 (de) * | 2006-12-19 | 2013-02-27 | REC Wafer Pte. Ltd. | Verfahren und einrichtung zur trennung von siliziumwafern |
| DE102010052987A1 (de) * | 2009-11-30 | 2011-06-01 | Amb Apparate + Maschinenbau Gmbh | Vereinzelungsvorrichtung |
| DE102012221452A1 (de) | 2012-07-20 | 2014-01-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zum Separieren von Wafern |
| CN115626488B (zh) * | 2022-09-08 | 2024-11-29 | 安徽兰迪节能玻璃有限公司 | 一种真空玻璃生产线取片装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5950643A (en) * | 1995-09-06 | 1999-09-14 | Miyazaki; Takeshiro | Wafer processing system |
| DE19900671C2 (de) * | 1999-01-11 | 2002-04-25 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung |
| DE19904834A1 (de) * | 1999-02-07 | 2000-08-10 | Acr Automation In Cleanroom | Vorrichtung zum Ablösen, Vereinzeln und Einlagern von dünnen, bruchempfindlichen scheibenförmigen Substraten |
| DE19950068B4 (de) * | 1999-10-16 | 2006-03-02 | Schmid Technology Systems Gmbh | Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben |
| DE102005045583A1 (de) * | 2005-05-20 | 2006-11-23 | Brain, Bernhard | Verfahren zur Vereinzelung von gestapelten, scheibenförmigen Elementen und Vereinzelungsvorrichtung |
-
2006
- 2006-12-15 PL PL06026054T patent/PL1935599T3/pl unknown
- 2006-12-15 ES ES06026054T patent/ES2313535T3/es active Active
- 2006-12-15 AT AT06026054T patent/ATE404341T1/de not_active IP Right Cessation
- 2006-12-15 EP EP06026054A patent/EP1935599B1/de not_active Not-in-force
- 2006-12-15 DE DE502006001352T patent/DE502006001352D1/de not_active Expired - Fee Related
-
2007
- 2007-12-14 TW TW096148137A patent/TW200842014A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| PL1935599T3 (pl) | 2009-01-30 |
| EP1935599A1 (de) | 2008-06-25 |
| ES2313535T3 (es) | 2009-03-01 |
| DE502006001352D1 (de) | 2008-09-25 |
| ATE404341T1 (de) | 2008-08-15 |
| EP1935599B1 (de) | 2008-08-13 |
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