PL1935599T3 - Urządzenie i sposób separacji i transportu substratów - Google Patents

Urządzenie i sposób separacji i transportu substratów

Info

Publication number
PL1935599T3
PL1935599T3 PL06026054T PL06026054T PL1935599T3 PL 1935599 T3 PL1935599 T3 PL 1935599T3 PL 06026054 T PL06026054 T PL 06026054T PL 06026054 T PL06026054 T PL 06026054T PL 1935599 T3 PL1935599 T3 PL 1935599T3
Authority
PL
Poland
Prior art keywords
substrate
substrates
support device
separating
fluid
Prior art date
Application number
PL06026054T
Other languages
English (en)
Polish (pl)
Inventor
Richard Herter
Konrad Kaltenbach
Original Assignee
Rena Sondermaschinen Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rena Sondermaschinen Gmbh filed Critical Rena Sondermaschinen Gmbh
Publication of PL1935599T3 publication Critical patent/PL1935599T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
PL06026054T 2006-12-15 2006-12-15 Urządzenie i sposób separacji i transportu substratów PL1935599T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06026054A EP1935599B1 (de) 2006-12-15 2006-12-15 Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten

Publications (1)

Publication Number Publication Date
PL1935599T3 true PL1935599T3 (pl) 2009-01-30

Family

ID=37946339

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06026054T PL1935599T3 (pl) 2006-12-15 2006-12-15 Urządzenie i sposób separacji i transportu substratów

Country Status (6)

Country Link
EP (1) EP1935599B1 (de)
AT (1) ATE404341T1 (de)
DE (1) DE502006001352D1 (de)
ES (1) ES2313535T3 (de)
PL (1) PL1935599T3 (de)
TW (1) TW200842014A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2122676B1 (de) * 2006-12-19 2013-02-27 REC Wafer Pte. Ltd. Verfahren und einrichtung zur trennung von siliziumwafern
DE102010052987A1 (de) * 2009-11-30 2011-06-01 Amb Apparate + Maschinenbau Gmbh Vereinzelungsvorrichtung
DE102012221452A1 (de) 2012-07-20 2014-01-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zum Separieren von Wafern
CN115626488B (zh) * 2022-09-08 2024-11-29 安徽兰迪节能玻璃有限公司 一种真空玻璃生产线取片装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5950643A (en) * 1995-09-06 1999-09-14 Miyazaki; Takeshiro Wafer processing system
DE19900671C2 (de) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung
DE19904834A1 (de) * 1999-02-07 2000-08-10 Acr Automation In Cleanroom Vorrichtung zum Ablösen, Vereinzeln und Einlagern von dünnen, bruchempfindlichen scheibenförmigen Substraten
DE19950068B4 (de) * 1999-10-16 2006-03-02 Schmid Technology Systems Gmbh Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben
DE102005045583A1 (de) * 2005-05-20 2006-11-23 Brain, Bernhard Verfahren zur Vereinzelung von gestapelten, scheibenförmigen Elementen und Vereinzelungsvorrichtung

Also Published As

Publication number Publication date
TW200842014A (en) 2008-11-01
EP1935599A1 (de) 2008-06-25
ES2313535T3 (es) 2009-03-01
DE502006001352D1 (de) 2008-09-25
ATE404341T1 (de) 2008-08-15
EP1935599B1 (de) 2008-08-13

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