TW201005129A - Modified copper-tin electrolyte and process for the deposition of bronze layers - Google Patents

Modified copper-tin electrolyte and process for the deposition of bronze layers Download PDF

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Publication number
TW201005129A
TW201005129A TW098112181A TW98112181A TW201005129A TW 201005129 A TW201005129 A TW 201005129A TW 098112181 A TW098112181 A TW 098112181A TW 98112181 A TW98112181 A TW 98112181A TW 201005129 A TW201005129 A TW 201005129A
Authority
TW
Taiwan
Prior art keywords
electrolyte
tin
copper
range
group
Prior art date
Application number
TW098112181A
Other languages
English (en)
Chinese (zh)
Inventor
Bernd Weyhmueller
Klaus Bronder
Frank Oberst
Sascha Berger
Uwe Manz
Original Assignee
Umicore Galvanotechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik Gmbh filed Critical Umicore Galvanotechnik Gmbh
Publication of TW201005129A publication Critical patent/TW201005129A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Electrolytic Production Of Metals (AREA)
TW098112181A 2008-05-08 2009-04-13 Modified copper-tin electrolyte and process for the deposition of bronze layers TW201005129A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP08008637A EP2116634B1 (de) 2008-05-08 2008-05-08 Modifizierter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten

Publications (1)

Publication Number Publication Date
TW201005129A true TW201005129A (en) 2010-02-01

Family

ID=39639007

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098112181A TW201005129A (en) 2008-05-08 2009-04-13 Modified copper-tin electrolyte and process for the deposition of bronze layers

Country Status (11)

Country Link
US (1) US20110089043A1 (de)
EP (1) EP2116634B1 (de)
JP (1) JP2011520037A (de)
KR (1) KR20110011613A (de)
CN (1) CN102016130B (de)
AT (1) ATE486157T1 (de)
DE (1) DE502008001647D1 (de)
MX (1) MX2010012041A (de)
PL (1) PL2116634T3 (de)
TW (1) TW201005129A (de)
WO (1) WO2009135572A2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5569718B2 (ja) * 2009-08-21 2014-08-13 キザイ株式会社 シアンフリー光沢銅−スズ合金めっき浴
KR101236165B1 (ko) * 2011-02-15 2013-02-22 (주)지오데코 친환경 3원 합금 도금액 및 이를 이용한 금속 표면 처리방법
DE102011121798B4 (de) 2011-12-21 2013-08-29 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle
DE102011121799B4 (de) * 2011-12-21 2013-08-29 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle
JP5952093B2 (ja) * 2012-05-31 2016-07-13 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法
JP6093143B2 (ja) * 2012-10-19 2017-03-08 株式会社シミズ 非シアン銅‐錫合金めっき浴
CN105189831A (zh) * 2013-03-21 2015-12-23 安美特德国有限公司 用于在工件上电解沉积金属层的装置和方法
AR100422A1 (es) * 2014-05-15 2016-10-05 Nippon Steel & Sumitomo Metal Corp Solución para deposición para conexión roscada para un caño o tubo y método de producción de la conexión roscada para un caño o tubo
CN104152955A (zh) * 2014-07-17 2014-11-19 广东致卓精密金属科技有限公司 碱性溶液电镀光亮白铜锡电镀液及工艺
CN111276725B (zh) * 2017-11-19 2021-10-08 湖南辰砾新材料有限公司 一种阴离子交换膜燃料电池
BE1027099B1 (nl) * 2019-03-08 2020-10-05 Umicore Nv Werkwijze voor elektrolytische koperwinning
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2198365A (en) * 1938-06-29 1940-04-23 Special Chemicals Corp Electroplating
US3227638A (en) * 1961-06-16 1966-01-04 Robert H Burnson Alkali cyanide bath and process for electroplating therewith
DE3346721A1 (de) * 1983-12-23 1985-06-27 Fa. Karl-Wilh. Hen, 5820 Gevelsberg Alkalisches bad zum aufbringen eines hochglaenzenden galvanischen ueberzugs auf einen traeger
JPH02175894A (ja) * 1988-12-28 1990-07-09 Kosaku:Kk スズ、スズ合金電気めっき方法及び同電気めっき装置
US5194140A (en) * 1991-11-27 1993-03-16 Macdermid, Incorporated Electroplating composition and process
DE4324995C2 (de) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
JP3674887B2 (ja) * 1996-09-30 2005-07-27 日本ニュークローム株式会社 銅−スズ合金メッキ用ピロリン酸浴
SG68083A1 (en) * 1997-10-30 1999-10-19 Sung Soo Moon Tin alloy plating compositions
US6508927B2 (en) * 1998-11-05 2003-01-21 C. Uyemura & Co., Ltd. Tin-copper alloy electroplating bath
JP2001181889A (ja) * 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
JP3455712B2 (ja) * 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
DE10046600C2 (de) 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
JP4249438B2 (ja) * 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
ES2531163T3 (es) 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces

Also Published As

Publication number Publication date
JP2011520037A (ja) 2011-07-14
WO2009135572A2 (en) 2009-11-12
DE502008001647D1 (de) 2010-12-09
ATE486157T1 (de) 2010-11-15
KR20110011613A (ko) 2011-02-08
HK1152352A1 (en) 2012-02-24
US20110089043A1 (en) 2011-04-21
PL2116634T3 (pl) 2011-04-29
WO2009135572A3 (en) 2009-12-30
MX2010012041A (es) 2011-03-04
CN102016130A (zh) 2011-04-13
CN102016130B (zh) 2013-03-13
EP2116634B1 (de) 2010-10-27
EP2116634A1 (de) 2009-11-11

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