TW201029060A - Acoustic assisted single wafer wet clean for semiconductor wafer process - Google Patents

Acoustic assisted single wafer wet clean for semiconductor wafer process Download PDF

Info

Publication number
TW201029060A
TW201029060A TW098135953A TW98135953A TW201029060A TW 201029060 A TW201029060 A TW 201029060A TW 098135953 A TW098135953 A TW 098135953A TW 98135953 A TW98135953 A TW 98135953A TW 201029060 A TW201029060 A TW 201029060A
Authority
TW
Taiwan
Prior art keywords
substrate
liquid medium
cleaning
liquid
acoustic energy
Prior art date
Application number
TW098135953A
Other languages
English (en)
Chinese (zh)
Inventor
Grant Peng
David Mui
Shih-Chung Kon
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of TW201029060A publication Critical patent/TW201029060A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW098135953A 2008-10-30 2009-10-23 Acoustic assisted single wafer wet clean for semiconductor wafer process TW201029060A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/262,094 US8585825B2 (en) 2008-10-30 2008-10-30 Acoustic assisted single wafer wet clean for semiconductor wafer process

Publications (1)

Publication Number Publication Date
TW201029060A true TW201029060A (en) 2010-08-01

Family

ID=42129948

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098135953A TW201029060A (en) 2008-10-30 2009-10-23 Acoustic assisted single wafer wet clean for semiconductor wafer process

Country Status (6)

Country Link
US (2) US8585825B2 (2)
JP (1) JP2012507858A (2)
KR (1) KR20110079830A (2)
CN (1) CN102197462B (2)
TW (1) TW201029060A (2)
WO (1) WO2010096041A1 (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651770B (zh) * 2013-09-18 2019-02-21 美商北方華創艾可隆公司 利用聲能處理基板的系統、裝置和方法

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US8171877B2 (en) * 2007-03-14 2012-05-08 Lam Research Corporation Backside mounted electrode carriers and assemblies incorporating the same
US8075701B2 (en) * 2008-06-30 2011-12-13 Lam Research Corporation Processes for reconditioning multi-component electrodes
US8276604B2 (en) * 2008-06-30 2012-10-02 Lam Research Corporation Peripherally engaging electrode carriers and assemblies incorporating the same
US8957564B1 (en) * 2010-06-29 2015-02-17 Silicon Light Machines Corporation Microelectromechanical system megasonic transducer
US8926762B2 (en) 2011-09-06 2015-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for movable megasonic wafer probe
US9117760B2 (en) * 2013-01-30 2015-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for energized and pressurized liquids for cleaning/etching applications in semiconductor manufacturing
US10343193B2 (en) * 2014-02-24 2019-07-09 The Boeing Company System and method for surface cleaning
US10688536B2 (en) * 2014-02-24 2020-06-23 The Boeing Company System and method for surface cleaning
US11141762B2 (en) 2015-05-15 2021-10-12 Acm Research (Shanghai), Inc. System for cleaning semiconductor wafers
US10507498B2 (en) * 2016-06-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus for particle cleaning
KR102517663B1 (ko) * 2017-11-15 2023-04-05 에이씨엠 리서치 (상하이), 인코포레이티드 반도체 웨이퍼를 세정하는 방법
JP7230037B2 (ja) * 2018-01-23 2023-02-28 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 基板の洗浄方法及び洗浄装置
JP6709010B2 (ja) * 2019-04-16 2020-06-10 株式会社ホロン 被洗浄体の異物除去装置およびその異物除去方法
KR102395972B1 (ko) * 2020-07-29 2022-05-09 가천대학교 산학협력단 초고주파 진동을 이용한 고종횡비 나노채널의 세정 또는 에칭방법
CN118649930A (zh) * 2024-05-29 2024-09-17 苏州元脑智能科技有限公司 芯片处理方法、系统、装置、设备及存储介质

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US550785A (en) * 1895-12-03 J e friend
US4715392A (en) 1983-11-10 1987-12-29 Nippon Kogaku K. K. Automatic photomask or reticle washing and cleaning system
US5505785A (en) 1994-07-18 1996-04-09 Ferrell; Gary W. Method and apparatus for cleaning integrated circuit wafers
JPH1133506A (ja) 1997-07-24 1999-02-09 Tadahiro Omi 流体処理装置及び洗浄処理システム
US7520284B2 (en) * 2000-06-30 2009-04-21 Lam Research Corporation Apparatus for developing photoresist and method for operating the same
CN1193410C (zh) * 2000-09-01 2005-03-16 株式会社德山 残渣洗涤液
JP2002093765A (ja) * 2000-09-20 2002-03-29 Kaijo Corp 基板洗浄方法および基板洗浄装置
US7810513B1 (en) 2002-09-30 2010-10-12 Lam Research Corporation Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the same
US7240679B2 (en) 2002-09-30 2007-07-10 Lam Research Corporation System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
US7696141B2 (en) * 2003-06-27 2010-04-13 Lam Research Corporation Cleaning compound and method and system for using the cleaning compound
US7111632B2 (en) 2003-09-22 2006-09-26 Seagate Technology Llc Ultrasonic cleaning device for removing undesirable particles from an object
JP2006005246A (ja) * 2004-06-18 2006-01-05 Fujimi Inc リンス用組成物及びそれを用いたリンス方法
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651770B (zh) * 2013-09-18 2019-02-21 美商北方華創艾可隆公司 利用聲能處理基板的系統、裝置和方法

Also Published As

Publication number Publication date
CN102197462A (zh) 2011-09-21
CN102197462B (zh) 2013-12-18
US20100108093A1 (en) 2010-05-06
WO2010096041A1 (en) 2010-08-26
KR20110079830A (ko) 2011-07-08
US8585825B2 (en) 2013-11-19
US20140034096A1 (en) 2014-02-06
JP2012507858A (ja) 2012-03-29

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