JP2012507858A - 半導体ウエハ処理のための音響を用いた枚葉式ウエハ湿式洗浄 - Google Patents

半導体ウエハ処理のための音響を用いた枚葉式ウエハ湿式洗浄 Download PDF

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Publication number
JP2012507858A
JP2012507858A JP2011534486A JP2011534486A JP2012507858A JP 2012507858 A JP2012507858 A JP 2012507858A JP 2011534486 A JP2011534486 A JP 2011534486A JP 2011534486 A JP2011534486 A JP 2011534486A JP 2012507858 A JP2012507858 A JP 2012507858A
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JP
Japan
Prior art keywords
substrate
liquid medium
acoustic energy
rinse
transducer
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JP2011534486A
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English (en)
Japanese (ja)
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JP2012507858A5 (2
Inventor
ペン・グラント
ムイ・デビッド
コン・シン−チャン
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Lam Research Corp
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Lam Research Corp
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Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2012507858A publication Critical patent/JP2012507858A/ja
Publication of JP2012507858A5 publication Critical patent/JP2012507858A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2011534486A 2008-10-30 2009-10-14 半導体ウエハ処理のための音響を用いた枚葉式ウエハ湿式洗浄 Withdrawn JP2012507858A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/262,094 US8585825B2 (en) 2008-10-30 2008-10-30 Acoustic assisted single wafer wet clean for semiconductor wafer process
US12/262,094 2008-10-30
PCT/US2009/005638 WO2010096041A1 (en) 2008-10-30 2009-10-14 Acoustic assisted single wafer wet clean for semiconductor wafer process

Publications (2)

Publication Number Publication Date
JP2012507858A true JP2012507858A (ja) 2012-03-29
JP2012507858A5 JP2012507858A5 (2) 2012-11-29

Family

ID=42129948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011534486A Withdrawn JP2012507858A (ja) 2008-10-30 2009-10-14 半導体ウエハ処理のための音響を用いた枚葉式ウエハ湿式洗浄

Country Status (6)

Country Link
US (2) US8585825B2 (2)
JP (1) JP2012507858A (2)
KR (1) KR20110079830A (2)
CN (1) CN102197462B (2)
TW (1) TW201029060A (2)
WO (1) WO2010096041A1 (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019117952A (ja) * 2019-04-16 2019-07-18 株式会社ホロン 被洗浄体の異物除去装置およびその異物除去方法
KR20200078656A (ko) * 2017-11-15 2020-07-01 에이씨엠 리서치 (상하이) 인코포레이티드 반도체 웨이퍼를 세정하는 방법
US11752529B2 (en) 2015-05-15 2023-09-12 Acm Research (Shanghai) Inc. Method for cleaning semiconductor wafers

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8171877B2 (en) * 2007-03-14 2012-05-08 Lam Research Corporation Backside mounted electrode carriers and assemblies incorporating the same
US8075701B2 (en) * 2008-06-30 2011-12-13 Lam Research Corporation Processes for reconditioning multi-component electrodes
US8276604B2 (en) * 2008-06-30 2012-10-02 Lam Research Corporation Peripherally engaging electrode carriers and assemblies incorporating the same
US8957564B1 (en) * 2010-06-29 2015-02-17 Silicon Light Machines Corporation Microelectromechanical system megasonic transducer
US8926762B2 (en) 2011-09-06 2015-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for movable megasonic wafer probe
US9117760B2 (en) * 2013-01-30 2015-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for energized and pressurized liquids for cleaning/etching applications in semiconductor manufacturing
US10079164B2 (en) 2013-09-18 2018-09-18 Naura Akrion Inc. System, apparatus, and method for processing substrates using acoustic energy
US10343193B2 (en) * 2014-02-24 2019-07-09 The Boeing Company System and method for surface cleaning
US10688536B2 (en) * 2014-02-24 2020-06-23 The Boeing Company System and method for surface cleaning
US10507498B2 (en) * 2016-06-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus for particle cleaning
JP7230037B2 (ja) * 2018-01-23 2023-02-28 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 基板の洗浄方法及び洗浄装置
KR102395972B1 (ko) * 2020-07-29 2022-05-09 가천대학교 산학협력단 초고주파 진동을 이용한 고종횡비 나노채널의 세정 또는 에칭방법
CN118649930A (zh) * 2024-05-29 2024-09-17 苏州元脑智能科技有限公司 芯片处理方法、系统、装置、设备及存储介质

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US550785A (en) * 1895-12-03 J e friend
US4715392A (en) 1983-11-10 1987-12-29 Nippon Kogaku K. K. Automatic photomask or reticle washing and cleaning system
US5505785A (en) 1994-07-18 1996-04-09 Ferrell; Gary W. Method and apparatus for cleaning integrated circuit wafers
JPH1133506A (ja) 1997-07-24 1999-02-09 Tadahiro Omi 流体処理装置及び洗浄処理システム
US7520284B2 (en) * 2000-06-30 2009-04-21 Lam Research Corporation Apparatus for developing photoresist and method for operating the same
CN1193410C (zh) * 2000-09-01 2005-03-16 株式会社德山 残渣洗涤液
JP2002093765A (ja) * 2000-09-20 2002-03-29 Kaijo Corp 基板洗浄方法および基板洗浄装置
US7810513B1 (en) 2002-09-30 2010-10-12 Lam Research Corporation Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the same
US7240679B2 (en) 2002-09-30 2007-07-10 Lam Research Corporation System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
US7696141B2 (en) * 2003-06-27 2010-04-13 Lam Research Corporation Cleaning compound and method and system for using the cleaning compound
US7111632B2 (en) 2003-09-22 2006-09-26 Seagate Technology Llc Ultrasonic cleaning device for removing undesirable particles from an object
JP2006005246A (ja) * 2004-06-18 2006-01-05 Fujimi Inc リンス用組成物及びそれを用いたリンス方法
US7560384B2 (en) * 2005-02-23 2009-07-14 Jsr Corporation Chemical mechanical polishing method
KR101369197B1 (ko) 2006-01-20 2014-03-27 아크리온 테크놀로지즈 인코포레이티드 평평한 물품을 처리하는 음향 에너지 시스템, 방법 및 장치

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11752529B2 (en) 2015-05-15 2023-09-12 Acm Research (Shanghai) Inc. Method for cleaning semiconductor wafers
KR20200078656A (ko) * 2017-11-15 2020-07-01 에이씨엠 리서치 (상하이) 인코포레이티드 반도체 웨이퍼를 세정하는 방법
JP2021510008A (ja) * 2017-11-15 2021-04-08 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体ウェハの洗浄方法
JP2022180654A (ja) * 2017-11-15 2022-12-06 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体ウェハの洗浄方法
KR102517663B1 (ko) 2017-11-15 2023-04-05 에이씨엠 리서치 (상하이), 인코포레이티드 반도체 웨이퍼를 세정하는 방법
JP7455743B2 (ja) 2017-11-15 2024-03-26 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体ウェハの洗浄方法
JP7495461B2 (ja) 2017-11-15 2024-06-04 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体ウェハの洗浄方法
JP2019117952A (ja) * 2019-04-16 2019-07-18 株式会社ホロン 被洗浄体の異物除去装置およびその異物除去方法

Also Published As

Publication number Publication date
CN102197462A (zh) 2011-09-21
CN102197462B (zh) 2013-12-18
US20100108093A1 (en) 2010-05-06
WO2010096041A1 (en) 2010-08-26
TW201029060A (en) 2010-08-01
KR20110079830A (ko) 2011-07-08
US8585825B2 (en) 2013-11-19
US20140034096A1 (en) 2014-02-06

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