TW201105517A - Screen printing screen - Google Patents
Screen printing screen Download PDFInfo
- Publication number
- TW201105517A TW201105517A TW99118770A TW99118770A TW201105517A TW 201105517 A TW201105517 A TW 201105517A TW 99118770 A TW99118770 A TW 99118770A TW 99118770 A TW99118770 A TW 99118770A TW 201105517 A TW201105517 A TW 201105517A
- Authority
- TW
- Taiwan
- Prior art keywords
- screen
- screen printing
- stencil
- metal layer
- notch
- Prior art date
Links
- 238000007650 screen-printing Methods 0.000 title claims abstract description 87
- 238000007639 printing Methods 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000007373 indentation Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 3
- 229910052707 ruthenium Inorganic materials 0.000 claims 2
- 230000007547 defect Effects 0.000 claims 1
- 230000000873 masking effect Effects 0.000 abstract 4
- 239000011888 foil Substances 0.000 abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 241001123946 Gaga Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920000131 polyvinylidene Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Plates And Materials Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200910024874 DE102009024874A1 (de) | 2009-06-09 | 2009-06-09 | Siebdruckform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201105517A true TW201105517A (en) | 2011-02-16 |
Family
ID=42675482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99118770A TW201105517A (en) | 2009-06-09 | 2010-06-09 | Screen printing screen |
Country Status (4)
| Country | Link |
|---|---|
| CN (2) | CN201824659U (de) |
| DE (2) | DE102009024874A1 (de) |
| TW (1) | TW201105517A (de) |
| WO (1) | WO2010142271A2 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI485755B (zh) * | 2012-11-05 | 2015-05-21 | Inventec Solar Energy Corp | 一種多層結構網版與相關方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202008012829U1 (de) * | 2008-09-26 | 2008-12-04 | Nb Technologies Gmbh | Siebdruckform |
| DE102009024874A1 (de) * | 2009-06-09 | 2010-12-16 | Nb Technologies Gmbh | Siebdruckform |
| DE102011003287A1 (de) * | 2011-01-27 | 2012-08-02 | Christian Koenen Gmbh | Druckschablone zum Aufbringen eines Druckmusters auf ein Substrat und Verfahren zum Herstellen einer Druckschablone |
| CN108511899B (zh) * | 2018-04-02 | 2020-02-14 | Oppo广东移动通信有限公司 | 印刷天线组件的制作方法、印刷天线组件及电子设备 |
| CN110126439B (zh) * | 2019-06-04 | 2020-09-29 | 沃苏特电子科技(苏州)有限公司 | 一种互补式网版的制作方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1192452A (en) * | 1967-07-25 | 1970-05-20 | Gestetner Ltd | Thermographic Stencil |
| DE1960723A1 (de) * | 1969-12-03 | 1971-06-09 | Siemens Ag | Siebdruckschablonen und Verfahren zu ihrer Herstellung |
| TW289901B (de) * | 1994-12-28 | 1996-11-01 | Ricoh Microelectronics Kk | |
| US6095041A (en) * | 1999-07-22 | 2000-08-01 | International Business Corporation | Stencil mask with channels including depressions |
| DE10231698A1 (de) * | 2002-03-26 | 2003-10-23 | Fraunhofer Ges Forschung | Verfahren zur Verbesserung des Transfers von Zusatzmaterial mittels einer Schablone auf einen Träger sowie zugehörige Schablone |
| US6998539B2 (en) * | 2003-05-27 | 2006-02-14 | Xerox Corporation | Standoff/mask structure for electrical interconnect |
| JP4375232B2 (ja) * | 2005-01-06 | 2009-12-02 | セイコーエプソン株式会社 | マスク成膜方法 |
| TWI458648B (zh) * | 2006-04-07 | 2014-11-01 | Mitsubishi Paper Mills Ltd | A method for manufacturing a photographic mask for printing a resin, and a screen printing mask for resin |
| DE102009024874A1 (de) * | 2009-06-09 | 2010-12-16 | Nb Technologies Gmbh | Siebdruckform |
-
2009
- 2009-06-09 DE DE200910024874 patent/DE102009024874A1/de not_active Ceased
-
2010
- 2010-06-09 DE DE202010007771U patent/DE202010007771U1/de not_active Expired - Lifetime
- 2010-06-09 CN CN2010202199873U patent/CN201824659U/zh not_active Expired - Fee Related
- 2010-06-09 WO PCT/DE2010/000637 patent/WO2010142271A2/de not_active Ceased
- 2010-06-09 CN CN2010800253096A patent/CN102458856A/zh active Pending
- 2010-06-09 TW TW99118770A patent/TW201105517A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI485755B (zh) * | 2012-11-05 | 2015-05-21 | Inventec Solar Energy Corp | 一種多層結構網版與相關方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102009024874A1 (de) | 2010-12-16 |
| CN102458856A (zh) | 2012-05-16 |
| DE202010007771U1 (de) | 2010-09-02 |
| WO2010142271A3 (de) | 2011-07-21 |
| WO2010142271A2 (de) | 2010-12-16 |
| CN201824659U (zh) | 2011-05-11 |
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