TW201105517A - Screen printing screen - Google Patents

Screen printing screen Download PDF

Info

Publication number
TW201105517A
TW201105517A TW99118770A TW99118770A TW201105517A TW 201105517 A TW201105517 A TW 201105517A TW 99118770 A TW99118770 A TW 99118770A TW 99118770 A TW99118770 A TW 99118770A TW 201105517 A TW201105517 A TW 201105517A
Authority
TW
Taiwan
Prior art keywords
screen
screen printing
stencil
metal layer
notch
Prior art date
Application number
TW99118770A
Other languages
English (en)
Chinese (zh)
Inventor
Mike Becker
Dietmar Lutke-Notarp
Original Assignee
Nb Technologies Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nb Technologies Gmbh filed Critical Nb Technologies Gmbh
Publication of TW201105517A publication Critical patent/TW201105517A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)
TW99118770A 2009-06-09 2010-06-09 Screen printing screen TW201105517A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200910024874 DE102009024874A1 (de) 2009-06-09 2009-06-09 Siebdruckform

Publications (1)

Publication Number Publication Date
TW201105517A true TW201105517A (en) 2011-02-16

Family

ID=42675482

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99118770A TW201105517A (en) 2009-06-09 2010-06-09 Screen printing screen

Country Status (4)

Country Link
CN (2) CN201824659U (de)
DE (2) DE102009024874A1 (de)
TW (1) TW201105517A (de)
WO (1) WO2010142271A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI485755B (zh) * 2012-11-05 2015-05-21 Inventec Solar Energy Corp 一種多層結構網版與相關方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008012829U1 (de) * 2008-09-26 2008-12-04 Nb Technologies Gmbh Siebdruckform
DE102009024874A1 (de) * 2009-06-09 2010-12-16 Nb Technologies Gmbh Siebdruckform
DE102011003287A1 (de) * 2011-01-27 2012-08-02 Christian Koenen Gmbh Druckschablone zum Aufbringen eines Druckmusters auf ein Substrat und Verfahren zum Herstellen einer Druckschablone
CN108511899B (zh) * 2018-04-02 2020-02-14 Oppo广东移动通信有限公司 印刷天线组件的制作方法、印刷天线组件及电子设备
CN110126439B (zh) * 2019-06-04 2020-09-29 沃苏特电子科技(苏州)有限公司 一种互补式网版的制作方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1192452A (en) * 1967-07-25 1970-05-20 Gestetner Ltd Thermographic Stencil
DE1960723A1 (de) * 1969-12-03 1971-06-09 Siemens Ag Siebdruckschablonen und Verfahren zu ihrer Herstellung
TW289901B (de) * 1994-12-28 1996-11-01 Ricoh Microelectronics Kk
US6095041A (en) * 1999-07-22 2000-08-01 International Business Corporation Stencil mask with channels including depressions
DE10231698A1 (de) * 2002-03-26 2003-10-23 Fraunhofer Ges Forschung Verfahren zur Verbesserung des Transfers von Zusatzmaterial mittels einer Schablone auf einen Träger sowie zugehörige Schablone
US6998539B2 (en) * 2003-05-27 2006-02-14 Xerox Corporation Standoff/mask structure for electrical interconnect
JP4375232B2 (ja) * 2005-01-06 2009-12-02 セイコーエプソン株式会社 マスク成膜方法
TWI458648B (zh) * 2006-04-07 2014-11-01 Mitsubishi Paper Mills Ltd A method for manufacturing a photographic mask for printing a resin, and a screen printing mask for resin
DE102009024874A1 (de) * 2009-06-09 2010-12-16 Nb Technologies Gmbh Siebdruckform

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI485755B (zh) * 2012-11-05 2015-05-21 Inventec Solar Energy Corp 一種多層結構網版與相關方法

Also Published As

Publication number Publication date
DE102009024874A1 (de) 2010-12-16
CN102458856A (zh) 2012-05-16
DE202010007771U1 (de) 2010-09-02
WO2010142271A3 (de) 2011-07-21
WO2010142271A2 (de) 2010-12-16
CN201824659U (zh) 2011-05-11

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