CN201824659U - 丝网印版 - Google Patents

丝网印版 Download PDF

Info

Publication number
CN201824659U
CN201824659U CN2010202199873U CN201020219987U CN201824659U CN 201824659 U CN201824659 U CN 201824659U CN 2010202199873 U CN2010202199873 U CN 2010202199873U CN 201020219987 U CN201020219987 U CN 201020219987U CN 201824659 U CN201824659 U CN 201824659U
Authority
CN
China
Prior art keywords
screen printing
breach
printing stencil
projection
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010202199873U
Other languages
English (en)
Chinese (zh)
Inventor
迈克·贝克
迪特马尔·洛克-诺大浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NB TECHNOLOGIES GmbH
Original Assignee
NB TECHNOLOGIES GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NB TECHNOLOGIES GmbH filed Critical NB TECHNOLOGIES GmbH
Application granted granted Critical
Publication of CN201824659U publication Critical patent/CN201824659U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)
CN2010202199873U 2009-06-09 2010-06-09 丝网印版 Expired - Fee Related CN201824659U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200910024874 DE102009024874A1 (de) 2009-06-09 2009-06-09 Siebdruckform
DE102009024874.9 2009-06-09

Publications (1)

Publication Number Publication Date
CN201824659U true CN201824659U (zh) 2011-05-11

Family

ID=42675482

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2010202199873U Expired - Fee Related CN201824659U (zh) 2009-06-09 2010-06-09 丝网印版
CN2010800253096A Pending CN102458856A (zh) 2009-06-09 2010-06-09 丝网印版

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2010800253096A Pending CN102458856A (zh) 2009-06-09 2010-06-09 丝网印版

Country Status (4)

Country Link
CN (2) CN201824659U (de)
DE (2) DE102009024874A1 (de)
TW (1) TW201105517A (de)
WO (1) WO2010142271A2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102458856A (zh) * 2009-06-09 2012-05-16 Nb科技股份有限公司 丝网印版
CN108511899A (zh) * 2018-04-02 2018-09-07 Oppo广东移动通信有限公司 印刷天线组件的制作方法、印刷天线组件及电子设备

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008012829U1 (de) * 2008-09-26 2008-12-04 Nb Technologies Gmbh Siebdruckform
DE102011003287A1 (de) * 2011-01-27 2012-08-02 Christian Koenen Gmbh Druckschablone zum Aufbringen eines Druckmusters auf ein Substrat und Verfahren zum Herstellen einer Druckschablone
TWI485755B (zh) * 2012-11-05 2015-05-21 Inventec Solar Energy Corp 一種多層結構網版與相關方法
CN110126439B (zh) * 2019-06-04 2020-09-29 沃苏特电子科技（苏州）有限公司 一种互补式网版的制作方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1192452A (en) * 1967-07-25 1970-05-20 Gestetner Ltd Thermographic Stencil
DE1960723A1 (de) * 1969-12-03 1971-06-09 Siemens Ag Siebdruckschablonen und Verfahren zu ihrer Herstellung
TW289901B (de) * 1994-12-28 1996-11-01 Ricoh Microelectronics Kk
US6095041A (en) * 1999-07-22 2000-08-01 International Business Corporation Stencil mask with channels including depressions
DE10231698A1 (de) * 2002-03-26 2003-10-23 Fraunhofer Ges Forschung Verfahren zur Verbesserung des Transfers von Zusatzmaterial mittels einer Schablone auf einen Träger sowie zugehörige Schablone
US6998539B2 (en) * 2003-05-27 2006-02-14 Xerox Corporation Standoff/mask structure for electrical interconnect
JP4375232B2 (ja) * 2005-01-06 2009-12-02 セイコーエプソン株式会社 マスク成膜方法
TWI458648B (zh) * 2006-04-07 2014-11-01 Mitsubishi Paper Mills Ltd A method for manufacturing a photographic mask for printing a resin, and a screen printing mask for resin
DE102009024874A1 (de) * 2009-06-09 2010-12-16 Nb Technologies Gmbh Siebdruckform

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102458856A (zh) * 2009-06-09 2012-05-16 Nb科技股份有限公司 丝网印版
CN108511899A (zh) * 2018-04-02 2018-09-07 Oppo广东移动通信有限公司 印刷天线组件的制作方法、印刷天线组件及电子设备

Also Published As

Publication number Publication date
DE102009024874A1 (de) 2010-12-16
WO2010142271A3 (de) 2011-07-21
DE202010007771U1 (de) 2010-09-02
WO2010142271A2 (de) 2010-12-16
TW201105517A (en) 2011-02-16
CN102458856A (zh) 2012-05-16

Similar Documents

Publication Publication Date Title
CN201824659U (zh) 丝网印版
US20110259218A1 (en) Screen printing screen
US20100215788A1 (en) Mold and method for producing the same
EP2584408A3 (de) Druckverfahren und Druckvorrichtung
WO2009119251A1 (ja) 目封止ハニカム構造体の製造装置、及びその製造方法
CN201703016U (zh) 多层式金属印刷模板
CN103223768B (zh) 一次印刷形成不同膜厚的金属印刷模板
ATE522001T1 (de) Festoxid-brennstoffzelle in dünnschichttechnik (sofc) und verfahren zu ihrer herstellung
JPH08183151A (ja) メッシュ一体型メタルマスクの製造方法
US7225536B2 (en) Precasting multi-layer PCB process
JP2007118589A (ja) メタルマスクスクリーン版およびその製造方法
JP4671255B2 (ja) 電鋳製メタルマスクの製造方法
CN113594293A (zh) 一种太阳能电池片电极制作方法及太阳能电池
JP4247931B2 (ja) 転写ピン
JP2010221467A (ja) スクリーンマスク、印刷方法、および配線基板の製造方法
US20100075179A1 (en) Master disk for transfer and manufacturing method of the same
JPH027491A (ja) 立体成形印刷回路基板の製造方法および、成形型用メッキ形成膜の製造方法
CN209382435U (zh) 标签的贴标装置
JP2010077476A (ja) スタンパの製造方法
US7824584B2 (en) Method of manufacturing stamper, method of manufacturing resin molded article, and stamper
JP2007307717A (ja) スクリーン印刷版およびその製造方法
CN222394814U (zh) 一种接合结构
EP1975703A3 (de) Formstruktur, Druckverfahren damit, magnetisches Aufzeichnungsmedium und Herstellungsverfahren dafür
JP5024245B2 (ja) スクリーン印刷用メタルマスク及びその製造方法
JP4239926B2 (ja) グラビアロール、グラビア印刷機および積層セラミック電子部品の製造方法

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110511

Termination date: 20130609