TW201241919A - Interposer and semiconductor module using same - Google Patents

Interposer and semiconductor module using same Download PDF

Info

Publication number
TW201241919A
TW201241919A TW100149435A TW100149435A TW201241919A TW 201241919 A TW201241919 A TW 201241919A TW 100149435 A TW100149435 A TW 100149435A TW 100149435 A TW100149435 A TW 100149435A TW 201241919 A TW201241919 A TW 201241919A
Authority
TW
Taiwan
Prior art keywords
heat
interposer
semiconductor element
semiconductor
wall
Prior art date
Application number
TW100149435A
Other languages
English (en)
Chinese (zh)
Other versions
TWI560773B (2
Inventor
Manabu Bonkohara
Original Assignee
Zycube Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zycube Co Ltd filed Critical Zycube Co Ltd
Publication of TW201241919A publication Critical patent/TW201241919A/zh
Application granted granted Critical
Publication of TWI560773B publication Critical patent/TWI560773B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/823—Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/22—Configurations of stacked chips the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/231—Configurations of stacked chips the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW100149435A 2010-12-30 2011-12-28 Interposer and semiconductor module using same TW201241919A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010294618A JP5807220B2 (ja) 2010-12-30 2010-12-30 インターポーザ及びそれを用いた半導体モジュール

Publications (2)

Publication Number Publication Date
TW201241919A true TW201241919A (en) 2012-10-16
TWI560773B TWI560773B (2) 2016-12-01

Family

ID=46383227

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100149435A TW201241919A (en) 2010-12-30 2011-12-28 Interposer and semiconductor module using same

Country Status (4)

Country Link
US (1) US9386685B2 (2)
JP (1) JP5807220B2 (2)
TW (1) TW201241919A (2)
WO (1) WO2012091140A1 (2)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8837159B1 (en) * 2009-10-28 2014-09-16 Amazon Technologies, Inc. Low-profile circuit board assembly
JP6295571B2 (ja) * 2013-09-30 2018-03-20 セイコーエプソン株式会社 電子デバイス、量子干渉装置、原子発振器、電子機器および移動体
JP2016021493A (ja) * 2014-07-14 2016-02-04 富士通株式会社 光伝送装置および製造方法
EP3048643A1 (en) * 2015-01-23 2016-07-27 Alcatel Lucent Device and method
TWM519879U (zh) * 2015-08-03 2016-04-01 道登電子材料股份有限公司 電子裝置之改良散熱結構
JP6531603B2 (ja) * 2015-10-01 2019-06-19 富士通株式会社 電子部品、電子装置及び電子装置の製造方法
KR20170001989U (ko) * 2015-11-30 2017-06-08 다우톤 일렉트로닉 머티리얼스 코. 컴퍼니 리미티드 전자장치의 개량 냉각구조
NL2018389A (en) * 2016-03-07 2017-09-12 Asml Netherlands Bv Multilayer Reflector, Method of Manufacturing a Multilayer Reflector and Lithographic Apparatus
US9646916B1 (en) * 2016-06-29 2017-05-09 International Business Machines Corporation Method and apparatus to facilitate direct surface cooling of a chip within a 3D stack of chips using optical interconnect
US10921536B2 (en) * 2017-05-18 2021-02-16 Arista Networks, Inc. Heat sink for optical transceiver
FR3074011B1 (fr) * 2017-11-21 2019-12-20 Safran Electronics & Defense Module electrique de puissance
US11127716B2 (en) * 2018-04-12 2021-09-21 Analog Devices International Unlimited Company Mounting structures for integrated device packages
US12002735B2 (en) * 2018-12-18 2024-06-04 Tien-Chien Cheng Semiconductor package
WO2021152658A1 (ja) 2020-01-27 2021-08-05 オリンパス株式会社 撮像装置、および、内視鏡
US11546991B2 (en) 2020-03-11 2023-01-03 Peter C. Salmon Densely packed electronic systems
US12302497B2 (en) 2020-03-11 2025-05-13 Peter C. Salmon Densely packed electronic systems
US11393807B2 (en) 2020-03-11 2022-07-19 Peter C. Salmon Densely packed electronic systems
US10966338B1 (en) * 2020-03-11 2021-03-30 Peter C. Salmon Densely packed electronic systems
EP4060725B1 (en) * 2021-03-19 2023-07-26 Hitachi Energy Switzerland AG A cooling assembly for at least one semiconductor module, a power module and a method for manufacturing a power module
US12376254B2 (en) 2022-02-25 2025-07-29 Peter C. Salmon Water cooled server
US11523543B1 (en) 2022-02-25 2022-12-06 Peter C. Salmon Water cooled server
US11445640B1 (en) 2022-02-25 2022-09-13 Peter C. Salmon Water cooled server
US12136576B1 (en) 2023-06-22 2024-11-05 Peter C. Salmon Microelectronic module
US12469754B2 (en) 2023-09-07 2025-11-11 Peter C. Salmon Hermetic microelectronic module using a sheath
US12255122B1 (en) 2023-12-13 2025-03-18 Peter C. Salmon Water-cooled electronic system
US20250338447A1 (en) * 2024-04-25 2025-10-30 Nxp B.V. Heatsink device

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821095A (ja) * 1981-07-31 1983-02-07 株式会社日立製作所 断熱配管ユニツト
JPS61119893A (ja) * 1984-11-15 1986-06-07 いすゞ自動車株式会社 内燃機関の断熱構造
JPH09270524A (ja) * 1996-03-29 1997-10-14 Mitsubishi Heavy Ind Ltd 赤外線アレイ素子
JP2003100989A (ja) * 2001-09-27 2003-04-04 Hitachi Ltd 高周波モジュール
US6819559B1 (en) * 2002-05-06 2004-11-16 Apple Computer, Inc. Method and apparatus for controlling the temperature of electronic device enclosures
JP3621938B2 (ja) * 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
JP3838369B2 (ja) * 2004-06-01 2006-10-25 松下電器産業株式会社 半導体装置
US7168152B1 (en) * 2004-10-18 2007-01-30 Lockheed Martin Corporation Method for making an integrated active antenna element
JP2006339352A (ja) 2005-06-01 2006-12-14 Toyota Industries Corp 半導体装置
JP4284625B2 (ja) * 2005-06-22 2009-06-24 株式会社デンソー 三相インバータ装置
JP4492534B2 (ja) * 2005-12-28 2010-06-30 カシオ計算機株式会社 反応装置および反応装置の製造方法
US8044412B2 (en) * 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
US8125788B2 (en) * 2006-03-29 2012-02-28 Kyocera Corporation Circuit module and radio communications equipment, and method for manufacturing circuit module
JP2007281043A (ja) 2006-04-04 2007-10-25 Matsushita Electric Ind Co Ltd 半導体装置
JP2008016599A (ja) * 2006-07-05 2008-01-24 Nikon Corp 半導体素子用パッケージ及びマルチチップモジュール
DE502006003331D1 (de) * 2006-08-30 2009-05-14 Siemens Ag Baugruppe für ein Automatisierungsgerät
US8106505B2 (en) * 2007-10-31 2012-01-31 International Business Machines Corporation Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
EP2073280A1 (de) * 2007-12-20 2009-06-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Reflektive Sekundäroptik und Halbleiterbaugruppe sowie Verfahren zu dessen Herstellung
JP2010051660A (ja) * 2008-08-29 2010-03-11 Toto Ltd 暖房便座装置
JP2010183324A (ja) * 2009-02-05 2010-08-19 Epson Toyocom Corp 恒温型圧電発振器
US8619427B2 (en) * 2011-03-21 2013-12-31 Eldon Technology Limited Media content device chassis with internal extension members

Also Published As

Publication number Publication date
JP2012142458A (ja) 2012-07-26
TWI560773B (2) 2016-12-01
US20140016270A1 (en) 2014-01-16
US9386685B2 (en) 2016-07-05
JP5807220B2 (ja) 2015-11-10
WO2012091140A1 (ja) 2012-07-05

Similar Documents

Publication Publication Date Title
TW201241919A (en) Interposer and semiconductor module using same
US11594462B2 (en) Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
WO2012091044A1 (ja) 半導体デバイス・電子部品の実装構造
TW202404430A (zh) 半導體核心組件
JPWO2023091485A5 (2)
TW201721828A (zh) 半導體裝置及其製造方法
JP2017525150A (ja) 高効率熱経路を有する積層半導体ダイアセンブリおよび関連システム
WO2012165559A1 (ja) インターポーザを用いた積層モジュールの実装構造
JP4034173B2 (ja) 半導体集積回路装置及びその半導体集積回路チップ
TW200839978A (en) Semiconductor device
JP2010251427A (ja) 半導体モジュール
US8664759B2 (en) Integrated circuit with heat conducting structures for localized thermal control
JP4997954B2 (ja) 回路基板、その製造方法及び半導体装置
TWI604578B (zh) Stacking module and interposer used therefor
WO2012165598A1 (ja) 積層モジュール及びそれに用いるインターポーザ
TW201034143A (en) Integrated circuit micro-module

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees