TW422821B - Glass plate cutting device - Google Patents

Glass plate cutting device Download PDF

Info

Publication number: TW422821B
Authority: TW; Taiwan
Prior art keywords: holding; glass; groove; plate; board
Prior art date: 1995-01-30

Application number

TW85101037A

Other languages

English (en)

Chinese (zh)

Inventor

Akira Kadowaki

Yoshio Makita

Katunosuke Ozawa

Hiroshi Ueki

Satoshi Yoshikata

Original Assignee

Futaba Denshi Kogyo Kk

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-01-30

Filing date

1996-01-27

Publication date

2001-02-21

1996-01-27 Application filed by Futaba Denshi Kogyo Kk filed Critical Futaba Denshi Kogyo Kk

2001-02-21 Application granted granted Critical

2001-02-21 Publication of TW422821B publication Critical patent/TW422821B/zh

Links

239000011521 glass Substances 0.000 title abstract description 127
230000007246 mechanism Effects 0.000 abstract description 61
239000005357 flat glass Substances 0.000 abstract description 34
239000000758 substrate Substances 0.000 abstract description 4
238000005336 cracking Methods 0.000 abstract 1
238000003825 pressing Methods 0.000 description 32
239000000843 powder Substances 0.000 description 8
238000011084 recovery Methods 0.000 description 7
235000015170 shellfish Nutrition 0.000 description 7
230000002079 cooperative effect Effects 0.000 description 5
238000010586 diagram Methods 0.000 description 5
239000007787 solid Substances 0.000 description 5
230000015572 biosynthetic process Effects 0.000 description 4
238000009434 installation Methods 0.000 description 4
230000001788 irregular Effects 0.000 description 4
238000004898 kneading Methods 0.000 description 4
230000002093 peripheral effect Effects 0.000 description 4
230000009471 action Effects 0.000 description 3
238000005452 bending Methods 0.000 description 3
230000008859 change Effects 0.000 description 3
230000000875 corresponding effect Effects 0.000 description 3
238000000034 method Methods 0.000 description 3
230000008901 benefit Effects 0.000 description 2
230000000694 effects Effects 0.000 description 2
239000012634 fragment Substances 0.000 description 2
230000003779 hair growth Effects 0.000 description 2
230000008569 process Effects 0.000 description 2
WSNMPAVSZJSIMT-UHFFFAOYSA-N COc1c(C)c2COC(=O)c2c(O)c1CC(O)C1(C)CCC(=O)O1 Chemical compound COc1c(C)c2COC(=O)c2c(O)c1CC(O)C1(C)CCC(=O)O1 WSNMPAVSZJSIMT-UHFFFAOYSA-N 0.000 description 1
101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 1
101100291267 Drosophila melanogaster Miga gene Proteins 0.000 description 1
206010041349 Somnolence Diseases 0.000 description 1
229910052770 Uranium Inorganic materials 0.000 description 1
230000037237 body shape Effects 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
SBUXRMKDJWEXRL-ROUUACIJSA-N cis-body Chemical compound O=C([C@H]1N(C2=O)[C@H](C3=C(C4=CC=CC=C4N3)C1)CC)N2C1=CC=C(F)C=C1 SBUXRMKDJWEXRL-ROUUACIJSA-N 0.000 description 1
238000003776 cleavage reaction Methods 0.000 description 1
239000000428 dust Substances 0.000 description 1
235000013399 edible fruits Nutrition 0.000 description 1
239000010408 film Substances 0.000 description 1
239000003292 glue Substances 0.000 description 1
238000002347 injection Methods 0.000 description 1
239000007924 injection Substances 0.000 description 1
238000003754 machining Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
239000002245 particle Substances 0.000 description 1
238000005192 partition Methods 0.000 description 1
235000021110 pickles Nutrition 0.000 description 1
230000001012 protector Effects 0.000 description 1
230000008439 repair process Effects 0.000 description 1
230000004044 response Effects 0.000 description 1
230000002441 reversible effect Effects 0.000 description 1
230000007017 scission Effects 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
239000010409 thin film Substances 0.000 description 1
JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
238000005406 washing Methods 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Mechanical Engineering (AREA)
Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)
Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

TW85101037A 1995-01-30 1996-01-27 Glass plate cutting device TW422821B (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP1278695		1995-01-30
JP8000920A JP2904089B2 (ja)	1995-01-30	1996-01-08	基板切断装置

Publications (1)

Publication Number	Publication Date
TW422821B true TW422821B (en)	2001-02-21

Family

ID=26334034

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW85101037A TW422821B (en)	1995-01-30	1996-01-27	Glass plate cutting device

Country Status (3)

Country	Link
JP (1)	JP2904089B2 (fr)
FR (1)	FR2729885B1 (fr)
TW (1)	TW422821B (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI488230B (zh) *	2011-08-26	2015-06-11	三星鑽石工業股份有限公司	Brittle material substrate breaking device
CN109421181A (zh) *	2017-08-29	2019-03-05	三星钻石工业股份有限公司	断裂装置
CN109760144A (zh) *	2019-01-31	2019-05-17	东莞市九思自动化科技有限公司	一种折板机构及具有该折板机构的自动化分板机
CN109794420A (zh) *	2019-01-31	2019-05-24	东莞市九思自动化科技有限公司	一种pcb板测试及分板自动化生产线
TWI784555B (zh) *	2021-06-04	2022-11-21	晶巧股份有限公司	段差式折斷分板裝置

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3630465B2 (ja) *	1995-04-13	2005-03-16	株式会社東芝	ガラス基板カット方法およびその装置
JPH11147216A (ja) *	1997-11-18	1999-06-02	Sumitomo Metal Smi Electron Devices Inc	分割装置およびその組付方法
JPH11160664A (ja) *	1997-11-27	1999-06-18	Seiko Epson Corp	基板の切断方法、基板の切断装置及び液晶表示装置の製造方法
EP0987226A1 (fr) *	1998-08-28	2000-03-22	Fabricom S.A.	Procédé et dispositif de rompage d'une feuille de verre
KR100835622B1 (ko) *	2001-06-28	2008-06-09	미쓰보시 다이야몬도 고교 가부시키가이샤	취성재료기판의 브레이크 장치 및 그 브레이크 방법
JP4566472B2 (ja) *	2001-07-23	2010-10-20	カワサキプラントシステムズ株式会社	板ガラスの割断機構およびトリミング装置
DE10136181B4 (de) *	2001-07-25	2005-02-10	Schott Ag	Verfahren zum Brechen eines eingeschnittenen Werkstückes aus Glas mit einer Wandstärke von 6mm oder mehr
JP3611122B2 (ja) *	2002-11-20	2005-01-19	川重プラント株式会社	板材のスクライブユニットおよび分断設備
WO2004082911A1 (fr) *	2003-03-17	2004-09-30	Baumann Gmbh	Dispositif de rupture servant a separer des cartes de circuits imprimes en ceramique
JP5076589B2 (ja) *	2007-03-28	2012-11-21	三星ダイヤモンド工業株式会社	板材分割装置及び板材分割方法
JP4960405B2 (ja) *	2009-04-28	2012-06-27	川崎重工業株式会社	板材の分断ユニット
WO2011004490A1 (fr) *	2009-07-10	2011-01-13	トヨタ自動車株式会社	Dispositif et procédé pour débiter un aimant
JP5517695B2 (ja) *	2010-03-29	2014-06-11	株式会社シライテック	折割装置
JP5862156B2 (ja) *	2011-09-26	2016-02-16	日産自動車株式会社	界磁極用磁石体の製造装置およびその製造方法
KR101968792B1 (ko) *	2011-11-16	2019-04-12	니폰 덴키 가라스 가부시키가이샤	판유리 할단장치, 판유리 할단방법, 판유리 제작방법 및 판유리 할단시스템
JP5849120B2 (ja) *	2014-03-25	2016-01-27	三星ダイヤモンド工業株式会社	脆性材料基板ブレイク装置
JP2019069605A (ja) *	2014-05-29	2019-05-09	三星ダイヤモンド工業株式会社	溝加工ヘッドの集塵機構及び溝加工装置
JP6507600B2 (ja) *	2014-12-02	2019-05-08	三星ダイヤモンド工業株式会社	脆性材料基板の分断方法及び加工装置
CN106587586A (zh) *	2016-12-22	2017-04-26	重庆天和玻璃有限公司	玻璃切断装置
CN116653146A (zh) *	2023-07-19	2023-08-29	阜宁协鑫光伏科技有限公司	切割机导轮结构及其生产方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE114293C (fr) *
US4018372A (en) *	1975-12-05	1977-04-19	The Fletcher-Terry Company	Glass cutting method and apparatus
DE2657757C2 (de) *	1976-12-20	1984-08-02	Bottero S.P.A., Cuneo-Spinetta	Vorrichtung zum Zuschneiden von Verbundglasplatten
AT382360B (de) *	1983-07-07	1987-02-25	Lisec Peter Glastech Ind	Verfahren und vorrichtung zum schneiden von verbundglas
NL8701191A (nl) *	1987-05-18	1988-12-16	Pallmac Belgium N V	Scheidingsinrichting voor vlakke elementen.

1996
- 1996-01-08 JP JP8000920A patent/JP2904089B2/ja not_active Expired - Fee Related
- 1996-01-27 TW TW85101037A patent/TW422821B/zh not_active IP Right Cessation
- 1996-01-30 FR FR9601049A patent/FR2729885B1/fr not_active Expired - Fee Related

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI488230B (zh) *	2011-08-26	2015-06-11	三星鑽石工業股份有限公司	Brittle material substrate breaking device
CN109421181A (zh) *	2017-08-29	2019-03-05	三星钻石工业股份有限公司	断裂装置
CN109760144A (zh) *	2019-01-31	2019-05-17	东莞市九思自动化科技有限公司	一种折板机构及具有该折板机构的自动化分板机
CN109794420A (zh) *	2019-01-31	2019-05-24	东莞市九思自动化科技有限公司	一种pcb板测试及分板自动化生产线
CN109794420B (zh) *	2019-01-31	2024-08-02	东莞市九思自动化科技有限公司	一种pcb板测试及分板自动化生产线
TWI784555B (zh) *	2021-06-04	2022-11-21	晶巧股份有限公司	段差式折斷分板裝置

Also Published As

Publication number	Publication date
JP2904089B2 (ja)	1999-06-14
FR2729885B1 (fr)	1998-09-25
JPH08268728A (ja)	1996-10-15
FR2729885A1 (fr)	1996-08-02

Legal Events

Date	Code	Title	Description
2001-08-09	GD4A	Issue of patent certificate for granted invention patent
2006-03-21	MM4A	Annulment or lapse of patent due to non-payment of fees

Publication	Publication Date	Title
TW422821B (en)	2001-02-21	Glass plate cutting device
TW509614B (en)	2002-11-11	Cutting apparatus
TW476737B (en)	2002-02-21	Method for cutting planar glass preform
TW461875B (en)	2001-11-01	Glass cutter wheel
CN106865972B (zh)	2023-06-16	玻璃划线机
TW201206853A (en)	2012-02-16	Cutter wheel for scribing fragile material substrate and method of manufacturing the same
ES2151733T3 (es)	2001-01-01	Metodo para la produccion de vidrios curvados.
TW200303296A (en)	2003-09-01	Method and apparatus for cutting apart a glass substrate, liquid crystal panel, and apparatus for fabricating a liquid crystal panel
DE602004008323D1 (de)	2007-09-27	Aufnahme- und absetzgreifer
CN100358694C (zh)	2008-01-02	脆性材料基板的切断方法,其装置及加工装置
KR20140011469A (ko)	2014-01-28	취성 재료 기판의 브레이크 장치
JP2009102204A (ja)	2009-05-14	耳部切断装置
KR20200013422A (ko)	2020-02-07	강판의 전단 측면 버어 제거장치
JP2018090445A (ja)	2018-06-14	板ガラスの製造方法及び板ガラスの折割装置
WO2018168331A1 (fr)	2018-09-20	Procédé de fabrication de verre à glace et dispositif de découpe de verre à glace
CN206654852U (zh)	2017-11-21	玻璃划线机
JP4379807B2 (ja)	2009-12-09	ガラス板の切断分離方法及びその装置
TW201605748A (zh)	2016-02-16	刻劃方法及刻劃裝置
TWI337984B (en)	2011-03-01	Scribing apparatus and scribing method
AU2003257215A1 (en)	2005-02-25	Glass cutting table
TWI850294B (zh)	2024-08-01	用於刻劃玻璃的方法及設備、藉此以用於切割玻璃元件的方法以及藉此以製造的玻璃元件
ATE449936T1 (de)	2009-12-15	Kerzenhalter zum aufsetzen auf eine unterlage
WO2015137161A1 (fr)	2015-09-17	Dispositif de coupe, procédé de formation d'une ligne de coupe et procédé de coupe d'une feuille cassante
CN104803592B (zh)	2018-10-19	脆性材料基板的刻划装置
JP7800791B2 (ja)	2026-01-16	板ガラスの製造方法、板ガラスの製造装置、及び板ガラス