TW529093B - Device manufacturing method, photomask used for the method, and photomask manufacturing method - Google Patents

Device manufacturing method, photomask used for the method, and photomask manufacturing method Download PDF

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Publication number
TW529093B
TW529093B TW090129998A TW90129998A TW529093B TW 529093 B TW529093 B TW 529093B TW 090129998 A TW090129998 A TW 090129998A TW 90129998 A TW90129998 A TW 90129998A TW 529093 B TW529093 B TW 529093B
Authority
TW
Taiwan
Prior art keywords
photomask
photoresist
pattern
mask
light
Prior art date
Application number
TW090129998A
Other languages
English (en)
Chinese (zh)
Inventor
Norio Hasegawa
Tsuneo Terasawa
Toshihiko Tanaka
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW529093B publication Critical patent/TW529093B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54—Absorbers, e.g. of opaque materials
    • G03F1/56—Organic absorbers, e.g. of photo-resists
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
TW090129998A 2000-12-25 2001-12-04 Device manufacturing method, photomask used for the method, and photomask manufacturing method TW529093B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000393232A JP2002196469A (ja) 2000-12-25 2000-12-25 デバイスの製造方法、それに用いるホトマスク、およびそのホトマスクの製造方法

Publications (1)

Publication Number Publication Date
TW529093B true TW529093B (en) 2003-04-21

Family

ID=18859081

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090129998A TW529093B (en) 2000-12-25 2001-12-04 Device manufacturing method, photomask used for the method, and photomask manufacturing method

Country Status (4)

Country Link
US (1) US20020081501A1 (ko)
JP (1) JP2002196469A (ko)
KR (1) KR20020052933A (ko)
TW (1) TW529093B (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6630988B2 (en) * 2001-06-28 2003-10-07 Intel Corporation Reticle stop block apparatus and method
US7642145B2 (en) * 2002-07-30 2010-01-05 Hitachi, Ltd. Method for producing electronic device
JP2004128227A (ja) * 2002-10-02 2004-04-22 Sanyo Electric Co Ltd 回路装置提供システム及びサーバコンピュータ
US7422828B1 (en) * 2004-02-06 2008-09-09 Advanced Micro Devices, Inc. Mask CD measurement monitor outside of the pellicle area
US7196429B2 (en) * 2004-04-26 2007-03-27 Macronix International Co., Ltd. Method of reducing film stress on overlay mark
JP4979941B2 (ja) * 2005-03-30 2012-07-18 Ｈｏｙａ株式会社 マスクブランクス用ガラス基板の製造方法、マスクブランクスの製造方法
US7378289B1 (en) * 2005-04-05 2008-05-27 Integrated Device Technology, Inc. Method for forming photomask having test patterns in blading areas
KR101267144B1 (ko) * 2005-05-23 2013-05-23 가부시키가이샤 니콘 센서의 교정 방법, 노광 방법, 노광 장치, 디바이스 제조방법, 및 반사형 마스크
JP4989158B2 (ja) * 2005-09-07 2012-08-01 株式会社ニューフレアテクノロジー 荷電粒子線描画データの作成方法及び荷電粒子線描画データの変換方法
US8050793B1 (en) 2006-04-04 2011-11-01 Advanced Micro Devices, Inc. Method and apparatus for linking reticle manufacturing data
US7194328B1 (en) * 2006-04-04 2007-03-20 Advanced Micro Devices, Inc. Method and apparatus for tracking reticle history
US7465597B2 (en) * 2006-06-29 2008-12-16 Home Diagnostics, Inc. Method of manufacturing a diagnostic test strip
JP5320663B2 (ja) * 2006-09-19 2013-10-23 凸版印刷株式会社 基板処理システム
KR100945918B1 (ko) * 2007-02-02 2010-03-05 주식회사 하이닉스반도체 마스크 결함 검사 방법 및 검사 장치
JP5259211B2 (ja) 2008-02-14 2013-08-07 ルネサスエレクトロニクス株式会社 半導体装置
JP2011040460A (ja) * 2009-08-07 2011-02-24 Toshiba Corp 露光装置、及び半導体装置の製造方法
JP5566265B2 (ja) * 2010-11-09 2014-08-06 東京エレクトロン株式会社 基板処理装置、プログラム、コンピュータ記憶媒体及び基板の搬送方法
WO2013130268A1 (en) * 2012-02-14 2013-09-06 Analytical Instrument Systems, Inc. Web-based multi-sensor/instrument control system
JP7245232B2 (ja) * 2017-09-13 2023-03-23 マテリオン コーポレイション マルチスペクトルフィルタアレイ上の不透明開口マスクとしてのフォトレジスト

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410611A (en) * 1981-08-31 1983-10-18 General Motors Corporation Hard and adherent layers from organic resin coatings
US5089361A (en) * 1990-08-17 1992-02-18 Industrial Technology Research Institute Mask making process
JPH08262717A (ja) * 1995-03-27 1996-10-11 Fujitsu Ltd レジスト組成物及びレジストパターンの形成方法
JP2002131883A (ja) * 2000-10-27 2002-05-09 Hitachi Ltd フォトマスクの製造方法およびフォトマスク

Also Published As

Publication number Publication date
KR20020052933A (ko) 2002-07-04
US20020081501A1 (en) 2002-06-27
JP2002196469A (ja) 2002-07-12

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