TW556462B - Method for manufacturing double-sided circuit board - Google Patents

Method for manufacturing double-sided circuit board Download PDF

Info

Publication number: TW556462B
Authority: TW; Taiwan
Prior art keywords: layer; insulating layer; conductor; wiring; thin film
Prior art date: 2002-02-06

Application number

TW092101921A

Other languages

English (en)

Chinese (zh)

Other versions

TW200303158A (en

Inventor

Toshiki Naitou

Yoshifumi Shinogi

Daisuke Uenda

Original Assignee

Nitto Denko Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-02-06

Filing date

2003-01-28

Publication date

2003-10-01

2003-01-28 Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp

2003-08-16 Publication of TW200303158A publication Critical patent/TW200303158A/zh

2003-10-01 Application granted granted Critical

2003-10-01 Publication of TW556462B publication Critical patent/TW556462B/zh

Links

238000000034 method Methods 0.000 title claims abstract description 42
238000004519 manufacturing process Methods 0.000 title claims abstract description 32
239000004020 conductor Substances 0.000 claims abstract description 139
239000010408 film Substances 0.000 claims abstract description 69
239000000463 material Substances 0.000 claims abstract description 53
239000010409 thin film Substances 0.000 claims abstract description 49
239000000126 substance Substances 0.000 claims abstract description 21
238000009713 electroplating Methods 0.000 claims abstract description 19
239000000758 substrate Substances 0.000 claims description 49
239000007788 liquid Substances 0.000 claims description 12
239000003814 drug Substances 0.000 claims description 5
229940079593 drug Drugs 0.000 claims description 3
230000000149 penetrating effect Effects 0.000 claims 1
239000010410 layer Substances 0.000 description 258
239000000243 solution Substances 0.000 description 27
238000009413 insulation Methods 0.000 description 21
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
238000007747 plating Methods 0.000 description 18
239000010949 copper Substances 0.000 description 17
229910052802 copper Inorganic materials 0.000 description 15
229910000365 copper sulfate Inorganic materials 0.000 description 10
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 10
238000005452 bending Methods 0.000 description 9
238000010586 diagram Methods 0.000 description 9
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
239000002344 surface layer Substances 0.000 description 7
229910000990 Ni alloy Inorganic materials 0.000 description 6
239000002253 acid Substances 0.000 description 6
229910000599 Cr alloy Inorganic materials 0.000 description 5
229910000831 Steel Inorganic materials 0.000 description 5
239000011889 copper foil Substances 0.000 description 5
229960002089 ferrous chloride Drugs 0.000 description 5
239000011521 glass Substances 0.000 description 5
NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 5
229920001721 polyimide Polymers 0.000 description 5
239000010959 steel Substances 0.000 description 5
239000012670 alkaline solution Substances 0.000 description 4
230000015572 biosynthetic process Effects 0.000 description 4
238000004090 dissolution Methods 0.000 description 4
229910052742 iron Inorganic materials 0.000 description 4
239000012528 membrane Substances 0.000 description 4
239000009719 polyimide resin Substances 0.000 description 4
210000000078 claw Anatomy 0.000 description 3
238000000576 coating method Methods 0.000 description 3
239000011810 insulating material Substances 0.000 description 3
239000002184 metal Substances 0.000 description 3
229910052751 metal Inorganic materials 0.000 description 3
239000011347 resin Substances 0.000 description 3
229920005989 resin Polymers 0.000 description 3
238000004544 sputter deposition Methods 0.000 description 3
KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
229910021591 Copper(I) chloride Inorganic materials 0.000 description 2
229910000881 Cu alloy Inorganic materials 0.000 description 2
UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
229910045601 alloy Inorganic materials 0.000 description 2
239000000956 alloy Substances 0.000 description 2
229910052801 chlorine Inorganic materials 0.000 description 2
239000000460 chlorine Substances 0.000 description 2
TZFWDZFKRBELIQ-UHFFFAOYSA-N chlorzoxazone Chemical compound ClC1=CC=C2OC(O)=NC2=C1 TZFWDZFKRBELIQ-UHFFFAOYSA-N 0.000 description 2
229910052804 chromium Inorganic materials 0.000 description 2
OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 2
229940045803 cuprous chloride Drugs 0.000 description 2
230000000694 effects Effects 0.000 description 2
239000011148 porous material Substances 0.000 description 2
239000002689 soil Substances 0.000 description 2
238000011410 subtraction method Methods 0.000 description 2
235000017166 Bambusa arundinacea Nutrition 0.000 description 1
235000017491 Bambusa tulda Nutrition 0.000 description 1
CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
235000005206 Hibiscus Nutrition 0.000 description 1
235000007185 Hibiscus lunariifolius Nutrition 0.000 description 1
244000284380 Hibiscus rosa sinensis Species 0.000 description 1
YXLXNENXOJSQEI-UHFFFAOYSA-L Oxine-copper Chemical compound [Cu+2].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 YXLXNENXOJSQEI-UHFFFAOYSA-L 0.000 description 1
240000005373 Panax quinquefolius Species 0.000 description 1
235000003140 Panax quinquefolius Nutrition 0.000 description 1
244000046052 Phaseolus vulgaris Species 0.000 description 1
235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
244000082204 Phyllostachys viridis Species 0.000 description 1
235000015334 Phyllostachys viridis Nutrition 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
241000555745 Sciuridae Species 0.000 description 1
UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
230000002378 acidificating effect Effects 0.000 description 1
239000011425 bamboo Substances 0.000 description 1
230000000903 blocking effect Effects 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
230000032798 delamination Effects 0.000 description 1
239000007933 dermal patch Substances 0.000 description 1
238000009826 distribution Methods 0.000 description 1
230000005611 electricity Effects 0.000 description 1
238000005868 electrolysis reaction Methods 0.000 description 1
230000002349 favourable effect Effects 0.000 description 1
-1 fluorene imide Chemical class 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
239000010931 gold Substances 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000012535 impurity Substances 0.000 description 1
238000007689 inspection Methods 0.000 description 1
238000003475 lamination Methods 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
210000000496 pancreas Anatomy 0.000 description 1
238000004080 punching Methods 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
239000002356 single layer Substances 0.000 description 1
239000007787 solid Substances 0.000 description 1
210000002784 stomach Anatomy 0.000 description 1
238000004381 surface treatment Methods 0.000 description 1
239000012085 test solution Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0574—Stacked resist layers used for different processes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0577—Double layer of resist having the same pattern
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Manufacturing Of Printed Wiring (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Laminated Bodies (AREA)
Manufacturing Of Printed Circuit Boards (AREA)

TW092101921A 2002-02-06 2003-01-28 Method for manufacturing double-sided circuit board TW556462B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2002029643A JP2003234572A (ja)	2002-02-06	2002-02-06	両面配線基板の製造方法

Publications (2)

Publication Number	Publication Date
TW200303158A TW200303158A (en)	2003-08-16
TW556462B true TW556462B (en)	2003-10-01

Family

ID=27606493

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW092101921A TW556462B (en)	2002-02-06	2003-01-28	Method for manufacturing double-sided circuit board

Country Status (6)

Country	Link
US (1)	US6889432B2 (fr)
EP (1)	EP1335643A3 (fr)
JP (1)	JP2003234572A (fr)
KR (1)	KR100590369B1 (fr)
CN (1)	CN1221158C (fr)
TW (1)	TW556462B (fr)

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JP3655915B2 (ja) *	2003-09-08	2005-06-02	Ｆｃｍ株式会社	導電性シートおよびそれを含む製品
JP4330486B2 (ja)	2004-05-07	2009-09-16	日東電工株式会社	両面プリント配線板の製造方法
JP4150401B2 (ja) *	2006-02-28	2008-09-17	日東電工株式会社	両面配線基板
US7992287B2 (en) *	2007-11-06	2011-08-09	Xerox Corporation	System for thinning a transducer with improved thickness uniformity
KR101411717B1 (ko) *	2008-07-16	2014-06-26	삼성전자주식회사	인쇄회로 기판의 제조 방법
US8413324B2 (en) *	2009-06-09	2013-04-09	Ibiden Co., Ltd.	Method of manufacturing double-sided circuit board
US9930789B2 (en)	2010-04-12	2018-03-27	Seagate Technology Llc	Flexible printed circuit cable with multi-layer interconnection and method of forming the same
CN102355794B (zh) *	2011-09-16	2016-04-06	珠海市超赢电子科技有限公司	一种双层柔性线路板
US20150305166A1 (en)	2014-04-22	2015-10-22	Carestream Health, Inc.	Laser patterning of dual sided transparent conductive films
TWI578416B (zh) *	2015-09-18	2017-04-11	旭德科技股份有限公司	封裝載板及其製作方法
DE102017001097A1 (de) *	2017-02-07	2018-08-09	Gentherm Gmbh	Elektrisch leitfähige Folie
CN115568085B (zh) *	2021-07-01	2024-08-09	深南电路股份有限公司	一种线路板制备方法以及线路板

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DE3408630A1 (de) *	1984-03-09	1985-09-12	Hoechst Ag, 6230 Frankfurt	Verfahren und schichtmaterial zur herstellung durchkontaktierter elektrischer leiterplatten
US4804615A (en) *	1985-08-08	1989-02-14	Macdermid, Incorporated	Method for manufacture of printed circuit boards
US4812213A (en) *	1988-05-06	1989-03-14	Rogers Corporation	Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom
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2002
- 2002-02-06 JP JP2002029643A patent/JP2003234572A/ja active Pending
2003
- 2003-01-27 CN CNB031024696A patent/CN1221158C/zh not_active Expired - Fee Related
- 2003-01-28 TW TW092101921A patent/TW556462B/zh not_active IP Right Cessation
- 2003-02-05 EP EP03002532A patent/EP1335643A3/fr not_active Withdrawn
- 2003-02-05 US US10/358,219 patent/US6889432B2/en not_active Expired - Fee Related
- 2003-02-06 KR KR1020030007338A patent/KR100590369B1/ko not_active Expired - Fee Related

Also Published As

Publication number	Publication date
KR20030067535A (ko)	2003-08-14
CN1437438A (zh)	2003-08-20
CN1221158C (zh)	2005-09-28
US6889432B2 (en)	2005-05-10
EP1335643A2 (fr)	2003-08-13
US20030221314A1 (en)	2003-12-04
EP1335643A3 (fr)	2005-01-19
JP2003234572A (ja)	2003-08-22
KR100590369B1 (ko)	2006-06-15
TW200303158A (en)	2003-08-16

Legal Events

Date	Code	Title	Description
2004-02-12	GD4A	Issue of patent certificate for granted invention patent
2019-07-01	MM4A	Annulment or lapse of patent due to non-payment of fees

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