TW565629B - CVD chamber cleaning gas - Google Patents

CVD chamber cleaning gas Download PDF

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Publication number
TW565629B
TW565629B TW086109701A TW86109701A TW565629B TW 565629 B TW565629 B TW 565629B TW 086109701 A TW086109701 A TW 086109701A TW 86109701 A TW86109701 A TW 86109701A TW 565629 B TW565629 B TW 565629B
Authority
TW
Taiwan
Prior art keywords
reaction chamber
cleaning gas
chamber cleaning
gas
cvd reaction
Prior art date
Application number
TW086109701A
Other languages
English (en)
Inventor
Mitsushi Itano
Original Assignee
Daikin Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Ind Ltd filed Critical Daikin Ind Ltd
Application granted granted Critical
Publication of TW565629B publication Critical patent/TW565629B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/12—Cleaning before device manufacture, i.e. Begin-Of-Line process by dry cleaning only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)

Description

565629 A7 __ B7 五、發明説明(1 ) 技術領域 本發明係關於一種適於半導體製造用途的淸潔氣體° 習知技術 CF4、C2F6、C4F8(全氟環丁烷)、SF6等之全氟化合 物,係用做等離子CVD之淸潔氣體而大量用於半導體工程 者,此等淸潔氣體爲一種在大氣中之壽命長且穩定之化合 物,並具有高紅外線吸收率,所以其地球溫暖化係數遠較 二氧化碳氣體爲大,例如,CF4爲6300倍,C2F2爲 12500 倍,C4F8 爲 9100 倍,SF6 爲24900 倍,於是,低 地球溫暖化係數之替代氣體之開發,已成爲緊急課題θ 本發明之目的,係在於提供一種替代氣體,以便作爲 等離子CVD之淸潔氣體,適用於半導體之生產工程,而且 減低地球溫暖化作用。 發明之掲露 本發明係提供以下之淸潔氣體及淸潔方法者。 1 . 一種反應室淸潔氣體,係包含由下述式 CF3CF-CF2 , CFgCF —-CF2 ,及,CF3C=〇 X〇/ k 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 所成之群中選出的至少一種氣體。 2 · —種反應室淸潔方法,係使用從由下述式 CF3CF-CF2 , CFgCF ——CF2 ,及,CF3C= 0 \〆 k ________2 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 565629 A7 B7 五、發明説明(2 ) 所成之群中選出的至少一種氣體,淸潔半導體積體電路製 造裝置之等離子CVD反應室。 作爲反應室淸潔用之氣體者,可使用 CF3CF-CF2 , CFgCF ——CF2 ,及,CF3〇 〇 \〆 k 中之諸氣體,在這些氣體中可使用一種或組合二種以上之 氣體。本發明之反應室淸潔氣體可與He、Ne、Ar、H2、 N2、〇2等氣體並用。 作爲反應室之原料用者,可舉出不銹鋼、A1合金等之 公知材料。本發明之反應室淸潔氣體,不會使反應室所用 之材料蒙受損傷,可迅速除去附著於反應室之反應副生成 物。 由本發明之淸潔方法所除去之反應副生成物者,可舉 出S i、多晶s i、W、T i及它們的氧化物、氮化物、碳化 物。 就反應室之淸潔條件而言,可直接利用該使用全氟化 合物之習知淸潔條件。 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 本發明之三種反應室淸潔氣體,可作爲習用反應室淸 潔氣體CF4、C2F6、SF6之替代品使用而且十分實用。而 且,本發明之反應室淸潔氣體之地球溫暖化係數遠較C F 4、 C2F6'SF6 爲低。 具體言之,如果在公知之反應室淸潔條件下(壓力=0.1 Torr ;輸入高頻電力= 3 0 0 W ;氣體流量= 5 0cc/min)使用 ____3 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)
565629 A7 —_B7 五、發明説明(3 ) 本發明之CF3CF = CF2 30分鐘,可充份且迅速地除去該附 著於反應室之反應副生成物,而且可使反應室不受損傷, 充份實用地使用。 使用 〇 以替代CF3CF = CF2,也可同樣 充份且迅速地除去該附著於反應室之反應副生成物,而且 可使反應室不受損傷,並可在沒有實用上之障礙下使用。
使用 CF3C=0以替代CF3CF = CF2,亦可同樣充份且迅 I cf3 速地除去該附著於反應室之反應副生成物,而且可使反應 室不受損傷,並可在沒有實用上之障礙下使用。 如依本發明,不用地球溫暖化係數遠比二氧化碳氣體 爲大之CF4、C2F6、C4F8、SF6,也可進行良好之反應室 淸潔。 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 修丄匕 年月曰 92年10月13日修正| 申請曰期 案 號 類 别 F Ά (以上各欄由本局填註)
雲蜃專利説明書 565629 經濟部智芡57是^吕(工消費合作社印製 發明 一、H«名稱 新型 中 文 CVD反應室清潔氣體 英 文 CVD chamber cleaning gas 姓 名 阪野充司 — 發明 一、創作 國 籍 曰本 住、居所 曰本大阪府攝津市西一津屋1番1號 姓 名 (名稱) 大新工業股份有限公司 國 籍 曰本 三、申請人 住、居所 (事務所) 曰本大阪府大阪市北區中崎西2 丁目4番12號梅田中心大樓 代表人 姓 名 井上禮之 訂 線 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 裝

Claims (1)

  1. 565629
    六、申著淳利菜圍 1 · 一種CVD反應室清潔氣體,係包含由下述式 CF.CF=CF〇 , CF.CF ——CF9 ,及,CF, Ο CF3 所成之群中選出的至少一種氣體。 2 ·依據申請專利範圍第1項所述之CVD反應室清潔氣 體,其係包含cf3cf = cf2。 3 ·依據申請專利範圍第1項所述之CVD反應室清潔氣 體,其係包含由下述式 CFq CF cf2 (請先閱讀背面之注意事項再填寫本頁) ο 所表示的六氟環氧丙烷。 4 ·依據申請專利範圍第1項所述之CVD反應室清潔氣 體,其係包含CF3COCF3。 5 ·依據申請專利範圍第1項〜第4項之任一項所述之 CVD反應室清潔氣體,其更包含由He、Ne、Αγ、H2、 N2、02所成的群中選出的至少一種氣體。 經濟部中央標準局員工消费合作社印裏 太纸乐尺度逍用中國國家標準(CNS〉A4说格(210X297公釐)
TW086109701A 1996-07-10 1997-07-09 CVD chamber cleaning gas TW565629B (en)

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Application Number Priority Date Filing Date Title
JP8180518A JPH1027781A (ja) 1996-07-10 1996-07-10 エッチングガスおよびクリーニングガス

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TW565629B true TW565629B (en) 2003-12-11

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US (1) US20030127118A1 (zh)
JP (1) JPH1027781A (zh)
KR (1) KR100497884B1 (zh)
TW (1) TW565629B (zh)
WO (1) WO1998001899A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI664317B (zh) * 2017-02-28 2019-07-01 日商中央硝子股份有限公司 乾式蝕刻劑、乾式蝕刻方法及半導體裝置之製造方法

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JP2005142198A (ja) * 2003-11-04 2005-06-02 Taiyo Nippon Sanso Corp クリーニングガス及びクリーニング方法
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CN101479220A (zh) * 2006-06-30 2009-07-08 昭和电工株式会社 高纯度六氟丙烯的制造方法及清洗气
JP2011517328A (ja) * 2008-03-07 2011-06-02 アドバンスド テクノロジー マテリアルズ,インコーポレイテッド 非選択性酸化物エッチング湿式洗浄組成物および使用方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI664317B (zh) * 2017-02-28 2019-07-01 日商中央硝子股份有限公司 乾式蝕刻劑、乾式蝕刻方法及半導體裝置之製造方法

Also Published As

Publication number Publication date
WO1998001899A1 (fr) 1998-01-15
KR100497884B1 (ko) 2005-06-29
JPH1027781A (ja) 1998-01-27
US20030127118A1 (en) 2003-07-10
KR20000023596A (ko) 2000-04-25

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