TWI322834B - - Google Patents

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Publication number: TWI322834B
Authority: TW; Taiwan
Prior art keywords: acid; nickel; copper; mass; chromium
Prior art date: 2002-12-06

Application number

TW092132879A

Other languages

English (en)

Chinese (zh)

Other versions

TW200417304A (en

Original Assignee

Mec Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-12-06

Filing date

2003-11-24

Publication date

2010-04-01

2003-11-24 Application filed by Mec Co Ltd filed Critical Mec Co Ltd

2004-09-01 Publication of TW200417304A publication Critical patent/TW200417304A/zh

2010-04-01 Application granted granted Critical

2010-04-01 Publication of TWI322834B publication Critical patent/TWI322834B/zh

Links

PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 45
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 40
229910052802 copper Inorganic materials 0.000 claims description 37
239000010949 copper Substances 0.000 claims description 37
238000005530 etching Methods 0.000 claims description 34
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 33
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 30
239000007788 liquid Substances 0.000 claims description 20
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 16
229910000599 Cr alloy Inorganic materials 0.000 claims description 16
239000011651 chromium Substances 0.000 claims description 14
229910052759 nickel Inorganic materials 0.000 claims description 13
239000000788 chromium alloy Substances 0.000 claims description 12
238000005260 corrosion Methods 0.000 claims description 11
230000007797 corrosion Effects 0.000 claims description 10
230000002401 inhibitory effect Effects 0.000 claims description 10
239000002253 acid Substances 0.000 claims description 9
-1 thiazole compound Chemical class 0.000 claims description 8
229910052804 chromium Inorganic materials 0.000 claims description 7
229910052717 sulfur Inorganic materials 0.000 claims description 7
125000004434 sulfur atom Chemical group 0.000 claims description 7
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 5
125000004432 carbon atom Chemical group C* 0.000 claims description 5
229910001431 copper ion Inorganic materials 0.000 claims description 5
LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
239000000243 solution Substances 0.000 claims 5
229920000877 Melamine resin Polymers 0.000 claims 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
239000007864 aqueous solution Substances 0.000 claims 1
WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical class NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 claims 1
150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
229910052709 silver Inorganic materials 0.000 claims 1
239000004332 silver Substances 0.000 claims 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 18
229910000623 nickel–chromium alloy Inorganic materials 0.000 description 17
238000005342 ion exchange Methods 0.000 description 16
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
229910000990 Ni alloy Inorganic materials 0.000 description 9
238000004090 dissolution Methods 0.000 description 7
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
238000000034 method Methods 0.000 description 6
239000000758 substrate Substances 0.000 description 6
238000007747 plating Methods 0.000 description 5
229920001721 polyimide Polymers 0.000 description 5
230000000052 comparative effect Effects 0.000 description 4
238000004519 manufacturing process Methods 0.000 description 4
MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 3
XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Substances CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 3
125000001931 aliphatic group Chemical group 0.000 description 3
229910045601 alloy Inorganic materials 0.000 description 3
239000000956 alloy Substances 0.000 description 3
229910052799 carbon Inorganic materials 0.000 description 3
KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
150000001875 compounds Chemical class 0.000 description 3
239000011889 copper foil Substances 0.000 description 3
229910052742 iron Inorganic materials 0.000 description 3
FWFGVMYFCODZRD-UHFFFAOYSA-N oxidanium;hydrogen sulfate Chemical compound O.OS(O)(=O)=O FWFGVMYFCODZRD-UHFFFAOYSA-N 0.000 description 3
125000001424 substituent group Chemical group 0.000 description 3
KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
206010036790 Productive cough Diseases 0.000 description 2
KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
125000003277 amino group Chemical group 0.000 description 2
229960000686 benzalkonium chloride Drugs 0.000 description 2
CADWTSSKOVRVJC-UHFFFAOYSA-N benzyl(dimethyl)azanium;chloride Chemical compound [Cl-].C[NH+](C)CC1=CC=CC=C1 CADWTSSKOVRVJC-UHFFFAOYSA-N 0.000 description 2
125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
238000007598 dipping method Methods 0.000 description 2
POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
XXWXVINLCWROJQ-UHFFFAOYSA-N ethanol octadecanoic acid Chemical compound CCO.CCO.CCCCCCCCCCCCCCCCCC(O)=O XXWXVINLCWROJQ-UHFFFAOYSA-N 0.000 description 2
238000002309 gasification Methods 0.000 description 2
OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
125000000879 imine group Chemical group 0.000 description 2
239000011810 insulating material Substances 0.000 description 2
239000000463 material Substances 0.000 description 2
BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
239000000203 mixture Substances 0.000 description 2
235000006408 oxalic acid Nutrition 0.000 description 2
239000007921 spray Substances 0.000 description 2
238000004544 sputter deposition Methods 0.000 description 2
210000003802 sputum Anatomy 0.000 description 2
208000024794 sputum Diseases 0.000 description 2
UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
LPMBTLLQQJBUOO-KTKRTIGZSA-N (z)-n,n-bis(2-hydroxyethyl)octadec-9-enamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)N(CCO)CCO LPMBTLLQQJBUOO-KTKRTIGZSA-N 0.000 description 1
VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
VJYJBBMMLIDJEF-UHFFFAOYSA-N 1-benzothiophen-2-amine Chemical compound C1=CC=C2SC(N)=CC2=C1 VJYJBBMMLIDJEF-UHFFFAOYSA-N 0.000 description 1
PWKSKIMOESPYIA-UHFFFAOYSA-N 2-acetamido-3-sulfanylpropanoic acid Chemical compound CC(=O)NC(CS)C(O)=O PWKSKIMOESPYIA-UHFFFAOYSA-N 0.000 description 1
RYYXDZDBXNUPOG-UHFFFAOYSA-N 4,5,6,7-tetrahydro-1,3-benzothiazole-2,6-diamine;dihydrochloride Chemical compound Cl.Cl.C1C(N)CCC2=C1SC(N)=N2 RYYXDZDBXNUPOG-UHFFFAOYSA-N 0.000 description 1
OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
CNPURSDMOWDNOQ-UHFFFAOYSA-N 4-methoxy-7h-pyrrolo[2,3-d]pyrimidin-2-amine Chemical compound COC1=NC(N)=NC2=C1C=CN2 CNPURSDMOWDNOQ-UHFFFAOYSA-N 0.000 description 1
QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical group [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
NMEGJXSMTLMBIO-UHFFFAOYSA-N C(CCCCCCCCC)N.C(C)O.C(C)O.C(CCCCCCCCCCC)(=O)O Chemical compound C(CCCCCCCCC)N.C(C)O.C(C)O.C(CCCCCCCCCCC)(=O)O NMEGJXSMTLMBIO-UHFFFAOYSA-N 0.000 description 1
UBUPCKZQZCXDAZ-UHFFFAOYSA-N C(CCCCCCCCC)N.C(C)O.C(CCCCCCCCCCC)(=O)O Chemical compound C(CCCCCCCCC)N.C(C)O.C(CCCCCCCCCCC)(=O)O UBUPCKZQZCXDAZ-UHFFFAOYSA-N 0.000 description 1
JQVSTQIUXONSRM-UHFFFAOYSA-N C(CCCCCCCCC)N.C(C)O.C(CCCCCCCCCCCCCCCCC)(=O)O Chemical compound C(CCCCCCCCC)N.C(C)O.C(CCCCCCCCCCCCCCCCC)(=O)O JQVSTQIUXONSRM-UHFFFAOYSA-N 0.000 description 1
OSYAJGQQYPNMOL-XXAVUKJNSA-N C(CCCCCCCCC)N.C(C)O.C(CCCCCCC\C=C/CCCCCCCC)(=O)O Chemical compound C(CCCCCCCCC)N.C(C)O.C(CCCCCCC\C=C/CCCCCCCC)(=O)O OSYAJGQQYPNMOL-XXAVUKJNSA-N 0.000 description 1
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
229910000531 Co alloy Inorganic materials 0.000 description 1
229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
LEVWYRKDKASIDU-IMJSIDKUSA-N L-cystine Chemical compound [O-]C(=O)[C@@H]([NH3+])CSSC[C@H]([NH3+])C([O-])=O LEVWYRKDKASIDU-IMJSIDKUSA-N 0.000 description 1
239000005639 Lauric acid Substances 0.000 description 1
FLVIGYVXZHLUHP-UHFFFAOYSA-N N,N'-diethylthiourea Chemical compound CCNC(=S)NCC FLVIGYVXZHLUHP-UHFFFAOYSA-N 0.000 description 1
GMEHFXXZSWDEDB-UHFFFAOYSA-N N-ethylthiourea Chemical compound CCNC(N)=S GMEHFXXZSWDEDB-UHFFFAOYSA-N 0.000 description 1
JWQYPZASEXNGGD-UHFFFAOYSA-N SNC(NS)=S Chemical compound SNC(NS)=S JWQYPZASEXNGGD-UHFFFAOYSA-N 0.000 description 1
QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
MWAZVPWTTWPXJF-UHFFFAOYSA-N acetic acid;urea Chemical compound CC(O)=O.NC(N)=O MWAZVPWTTWPXJF-UHFFFAOYSA-N 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
150000001348 alkyl chlorides Chemical class 0.000 description 1
125000005233 alkylalcohol group Chemical group 0.000 description 1
238000005275 alloying Methods 0.000 description 1
150000003863 ammonium salts Chemical class 0.000 description 1
239000002518 antifoaming agent Substances 0.000 description 1
229960001716 benzalkonium Drugs 0.000 description 1
229960002233 benzalkonium bromide Drugs 0.000 description 1
CYDRXTMLKJDRQH-UHFFFAOYSA-N benzododecinium Chemical compound CCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 CYDRXTMLKJDRQH-UHFFFAOYSA-N 0.000 description 1
KHSLHYAUZSPBIU-UHFFFAOYSA-M benzododecinium bromide Chemical compound [Br-].CCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 KHSLHYAUZSPBIU-UHFFFAOYSA-M 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
IAJKKDRUKURXMB-UHFFFAOYSA-N butanedioic acid;1h-indole Chemical compound OC(=O)CCC(O)=O.C1=CC=C2NC=CC2=C1 IAJKKDRUKURXMB-UHFFFAOYSA-N 0.000 description 1
239000004202 carbamide Substances 0.000 description 1
150000001735 carboxylic acids Chemical class 0.000 description 1
VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
239000003245 coal Substances 0.000 description 1
230000003750 conditioning effect Effects 0.000 description 1
APQPRKLAWCIJEK-UHFFFAOYSA-N cystamine Chemical compound NCCSSCCN APQPRKLAWCIJEK-UHFFFAOYSA-N 0.000 description 1
238000002845 discoloration Methods 0.000 description 1
PGRLPHKGHMCNGH-UHFFFAOYSA-N dodecanoic acid ethanol Chemical compound CCO.CCO.CCCCCCCCCCCC(O)=O PGRLPHKGHMCNGH-UHFFFAOYSA-N 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
QOYKUUJBAUMNGT-UHFFFAOYSA-N ethyl carbamate;propan-2-one Chemical compound CC(C)=O.CCOC(N)=O QOYKUUJBAUMNGT-UHFFFAOYSA-N 0.000 description 1
238000005187 foaming Methods 0.000 description 1
235000019253 formic acid Nutrition 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
239000012535 impurity Substances 0.000 description 1
RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
239000004973 liquid crystal related substance Substances 0.000 description 1
150000007522 mineralic acids Chemical class 0.000 description 1
239000003595 mist Substances 0.000 description 1
150000007524 organic acids Chemical class 0.000 description 1
239000005011 phenolic resin Substances 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
230000003449 preventive effect Effects 0.000 description 1
159000000000 sodium salts Chemical class 0.000 description 1
239000007787 solid Substances 0.000 description 1
238000003860 storage Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
239000001384 succinic acid Substances 0.000 description 1
LEHYMIDUFPRGJC-UHFFFAOYSA-N sulfanylthiourea Chemical compound NC(=S)NS LEHYMIDUFPRGJC-UHFFFAOYSA-N 0.000 description 1
239000004094 surface-active agent Substances 0.000 description 1
NJRXVEJTAYWCQJ-UHFFFAOYSA-N thiomalic acid Chemical compound OC(=O)CC(S)C(O)=O NJRXVEJTAYWCQJ-UHFFFAOYSA-N 0.000 description 1
229940103494 thiosalicylic acid Drugs 0.000 description 1
229910021642 ultra pure water Inorganic materials 0.000 description 1
239000012498 ultrapure water Substances 0.000 description 1
DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
ing And Chemical Polishing (AREA)
Manufacturing Of Printed Circuit Boards (AREA)

TW092132879A 2002-12-06 2003-11-24 Etching solution TW200417304A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2002355849A JP4241018B2 (ja)	2002-12-06	2002-12-06	エッチング液

Publications (2)

Publication Number	Publication Date
TW200417304A TW200417304A (en)	2004-09-01
TWI322834B true TWI322834B (ja)	2010-04-01

Family

ID=32756419

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW092132879A TW200417304A (en)	2002-12-06	2003-11-24	Etching solution

Country Status (4)

Country	Link
JP (1)	JP4241018B2 (ja)
KR (1)	KR100693889B1 (ja)
CN (1)	CN1506496A (ja)
TW (1)	TW200417304A (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4580331B2 (ja) *	2005-01-20	2010-11-10	メック株式会社	エッチング液と補給液及びこれを用いた導体パターンの形成方法
KR100601740B1 (ko) *	2005-04-11	2006-07-18	테크노세미켐 주식회사	투명도전막 식각용액
JP5273710B2 (ja) *	2007-11-27	2013-08-28	メック株式会社	エッチング剤
US20090196999A1 (en) *	2007-12-12	2009-08-06	Rohm And Haas Electronic Materials Llc	Adhesion promotion
JP5360703B2 (ja) *	2008-01-11	2013-12-04	メック株式会社	エッチング液
JP4521460B2 (ja) *	2008-02-20	2010-08-11	メック株式会社	エッチング液及びこれを用いた銅配線の形成方法
WO2010039936A2 (en) *	2008-10-02	2010-04-08	Advanced Technology Materials, Inc.	Use of surfactant/defoamer mixtures for enhanced metals loading and surface passivation of silicon substrates
JP5911145B2 (ja) *	2010-12-03	2016-04-27	株式会社Jcu	エッチング液の維持管理方法
KR101298766B1 (ko)	2011-05-20	2013-08-21	주식회사 익스톨	니켈, 크롬, 니켈-크롬 합금의 에칭 용액 조성물 및 이를 이용한 에칭 방법
KR102209687B1 (ko) *	2014-06-27	2021-01-29	동우 화인켐 주식회사	금속막의 식각액 조성물 및 이를 이용한 액정표시장치용 어레이 기판의 제조방법
KR101697595B1 (ko) *	2015-11-19	2017-01-18	이준용	니켈, 크롬 또는 니켈-크롬 합금용 에칭제 조성물 및 이를 포함하는 에칭제 및 이를 이용한 에칭 방법
CN108130535B (zh) *	2016-12-01	2020-04-14	添鸿科技股份有限公司	钛钨合金的蚀刻液
CN107835577A (zh) *	2017-11-24	2018-03-23	无锡南理工新能源电动车科技发展有限公司	一种基于无机盐氯化物的显示器控制电路板用蚀刻液的制备方法
CN109355660A (zh) *	2018-12-12	2019-02-19	东莞市同欣表面处理科技有限公司	一种硫酸型退铬添加剂及其应用方法
KR102752803B1 (ko) *	2019-05-30	2025-01-08	오씨아이 주식회사	실리콘 기판 식각 용액 및 이를 사용한 반도체 소자의 제조 방법
CN111334298B (zh) *	2020-02-26	2021-10-01	江阴润玛电子材料股份有限公司	一种钼铝钼和ITO/Ag/ITO兼容蚀刻液及制备方法
CN112941516A (zh) *	2020-12-29	2021-06-11	苏州运宏电子有限公司	一种精控式蚀刻液及其蚀刻方法
CN114752939B (zh) *	2022-05-24	2024-07-16	光华科学技术研究院(广东)有限公司	蚀刻液及其制备方法与应用
CN116120936B (zh) *	2022-10-27	2024-06-25	上海天承化学有限公司	一种蚀刻药水及其制备方法和应用
JP7833389B2 (ja) *	2022-11-22	2026-03-19	メック株式会社	エッチング液セット、エッチング方法および導体パターンの形成方法
CN117535668A (zh) *	2023-11-18	2024-02-09	苏州杰睿美科技有限公司	一种镍铬蚀刻剂及其制备方法

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JP2004190054A (ja)	2004-07-08
JP4241018B2 (ja)	2009-03-18
KR20040049816A (ko)	2004-06-12
TW200417304A (en)	2004-09-01
CN1506496A (zh)	2004-06-23
KR100693889B1 (ko)	2007-03-12

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