TWI323208B - - Google Patents

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Publication number
TWI323208B
TWI323208B TW96116125A TW96116125A TWI323208B TW I323208 B TWI323208 B TW I323208B TW 96116125 A TW96116125 A TW 96116125A TW 96116125 A TW96116125 A TW 96116125A TW I323208 B TWI323208 B TW I323208B
Authority
TW
Taiwan
Prior art keywords
adhesive layer
flexible
particles
soft substrate
abrasive
Prior art date
Application number
TW96116125A
Other languages
English (en)
Chinese (zh)
Other versions
TW200843902A (en
Inventor
Hsiao Kuo Chang
Juilin Chou
Original Assignee
Kinik Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinik Co filed Critical Kinik Co
Priority to TW96116125A priority Critical patent/TW200843902A/zh
Publication of TW200843902A publication Critical patent/TW200843902A/zh
Application granted granted Critical
Publication of TWI323208B publication Critical patent/TWI323208B/zh

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  • Polishing Bodies And Polishing Tools (AREA)
TW96116125A 2007-05-07 2007-05-07 A flexible lapping tool and its manufacturing method TW200843902A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96116125A TW200843902A (en) 2007-05-07 2007-05-07 A flexible lapping tool and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96116125A TW200843902A (en) 2007-05-07 2007-05-07 A flexible lapping tool and its manufacturing method

Publications (2)

Publication Number Publication Date
TW200843902A TW200843902A (en) 2008-11-16
TWI323208B true TWI323208B (de) 2010-04-11

Family

ID=44822436

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96116125A TW200843902A (en) 2007-05-07 2007-05-07 A flexible lapping tool and its manufacturing method

Country Status (1)

Country Link
TW (1) TW200843902A (de)

Also Published As

Publication number Publication date
TW200843902A (en) 2008-11-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees