TWI379751B - - Google Patents

Download PDF

Info

Publication number
TWI379751B
TWI379751B TW096105422A TW96105422A TWI379751B TW I379751 B TWI379751 B TW I379751B TW 096105422 A TW096105422 A TW 096105422A TW 96105422 A TW96105422 A TW 96105422A TW I379751 B TWI379751 B TW I379751B
Authority
TW
Taiwan
Prior art keywords
axis
spindle
printed circuit
circuit board
guiding
Prior art date
Application number
TW096105422A
Other languages
English (en)
Chinese (zh)
Other versions
TW200808506A (en
Inventor
Kazuo Watanabe
Norishige Kumagai
Katsuhiro Nagasawa
Takahiko Yamashita
Hiroyuki Kamata
Hisahiro Koshizuka
Hiroyuki Sugawara
Toru Miyasaka
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of TW200808506A publication Critical patent/TW200808506A/zh
Application granted granted Critical
Publication of TWI379751B publication Critical patent/TWI379751B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q5/00—Driving or feeding mechanisms; Control arrangements therefor
    • B23Q5/22—Feeding members carrying tools or work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B39/00—General-purpose boring or drilling machines or devices; Sets of boring and/or drilling machines
    • B23B39/16—Drilling machines with a plurality of working-spindles; Drilling automatons
    • B23B39/161—Drilling machines with a plurality of working-spindles; Drilling automatons with parallel work spindles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B39/00—General-purpose boring or drilling machines or devices; Sets of boring and/or drilling machines
    • B23B39/16—Drilling machines with a plurality of working-spindles; Drilling automatons
    • B23B39/18—Setting work or tool carrier along a straight index line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
TW096105422A 2006-02-15 2007-02-14 Printed board machining device and drilling method therefor TW200808506A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006038165 2006-02-15
JP2007032253A JP4787771B2 (ja) 2006-02-15 2007-02-13 プリント基板加工機及びその穴明け加工方法

Publications (2)

Publication Number Publication Date
TW200808506A TW200808506A (en) 2008-02-16
TWI379751B true TWI379751B (ja) 2012-12-21

Family

ID=38375084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105422A TW200808506A (en) 2006-02-15 2007-02-14 Printed board machining device and drilling method therefor

Country Status (5)

Country Link
JP (1) JP4787771B2 (ja)
KR (1) KR101273284B1 (ja)
CN (1) CN101022701B (ja)
DE (1) DE102007007482A1 (ja)
TW (1) TW200808506A (ja)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101960900B (zh) 2008-03-19 2015-01-21 日本电气株式会社 无线通信系统、无线通信的设定方法、基站、移动台站以及程序
CN101537505B (zh) * 2008-12-30 2011-05-25 南京依利安达电子有限公司 印刷电路板的小孔径高密度钻孔方法
CN101642825B (zh) * 2009-08-18 2010-12-01 无锡市华文机电有限公司 线路板雕刻机刀具的自动选择方法
CN101815408B (zh) * 2010-05-10 2011-10-12 无锡市华文机电有限公司 全自动电路板制作机
CN102107290B (zh) * 2010-12-23 2013-07-24 北大方正集团有限公司 钻孔方法以及钻孔设备
CN102069224B (zh) * 2010-12-23 2014-05-07 北大方正集团有限公司 铣切方法
CN102126040B (zh) * 2010-12-23 2013-06-26 北大方正集团有限公司 铣切方法以及铣切设备
CN102114549B (zh) * 2010-12-23 2013-04-10 北大方正集团有限公司 钻孔方法以及钻孔设备
KR101762338B1 (ko) * 2011-02-14 2017-07-28 삼성전자 주식회사 라우터 장치
CN103042568A (zh) * 2012-12-25 2013-04-17 东莞市华星胶辊有限公司 自动钻螺旋排列孔的钻孔装置
CN104942873B (zh) * 2014-03-27 2017-02-01 维嘉数控科技（苏州）有限公司 印制电路板的钻孔方法
CN104858931B (zh) * 2015-06-12 2017-09-19 四川晟大鑫兴电子有限公司 一种全自动电路板打孔机
CN105415432B (zh) * 2015-11-25 2018-09-18 中宁县智才技术服务有限公司 钻孔机
JP6739259B2 (ja) * 2016-07-06 2020-08-12 セイコータイムシステム株式会社 孔開け装置
KR102390758B1 (ko) * 2016-09-29 2022-04-26 아셈블레온 비.브이. 부품 배치 장치 및 부품 배치 장치 구동 방법
CN106735622A (zh) * 2017-02-20 2017-05-31 江苏百泰电子制造有限公司 多轴多面自动攻丝设备
CN106944883A (zh) * 2017-04-07 2017-07-14 深圳市华成利工数控设备有限公司 一种双龙门多主轴数控加工机
CN106863426A (zh) * 2017-04-18 2017-06-20 成都力鑫科技有限公司 一种具有定位作用的手动打孔机
CN107175351A (zh) * 2017-05-22 2017-09-19 广东东箭汽车用品制造有限公司 一种钻孔装置
CN107186806A (zh) * 2017-05-24 2017-09-22 安徽博泰电路科技有限公司 一种pcb冲孔装置
CN107529279A (zh) * 2017-08-03 2017-12-29 东莞市准锐自动化设备有限公司 可在电路板上实现多头精准钻孔的方法及多头钻孔设备
CN107660078B (zh) * 2017-10-30 2023-10-31 惠州市和信达线路板有限公司 印制电路板板边半金属化制作工艺及其钻孔装置
CN107717635A (zh) * 2017-11-10 2018-02-23 深圳市创世纪机械有限公司 一种双工作执行机构的数控机床
CN107876826A (zh) * 2017-12-13 2018-04-06 黄石星河电路有限公司 一种改良型通用测试架两轴钻孔机台
CN108174516B (zh) * 2017-12-26 2020-08-11 大连崇达电路有限公司 一种pcb线路板成孔用定位底板的加工方法
CN108214650A (zh) * 2018-01-22 2018-06-29 吉安市满坤科技有限公司 一种具有防护功能的印制电路板冲孔装置
JP6709869B1 (ja) * 2019-03-25 2020-06-17 株式会社スギノマシン 穴あけ方法及び穴あけ機
CN109940208A (zh) * 2019-04-26 2019-06-28 浙江百信针织机械有限公司 一种数控龙门针槽铣床
CN111571697A (zh) * 2020-05-19 2020-08-25 龙岩市云惠企科技有限公司 一种集成电路板生产用的辅助打孔装置
JP7079812B2 (ja) * 2020-05-21 2022-06-02 株式会社スギノマシン 穴あけ方法及び穴あけ機
CN112296392B (zh) 2020-12-29 2021-04-13 成都金大立科技有限公司 具有自动打拔销钉功能的pcb自动加工工艺
CN113427563B (zh) * 2021-07-01 2022-11-29 深圳市浩创盛科技有限公司 一种双台面龙门高稳定定型钻孔机
CN114126227A (zh) * 2021-10-28 2022-03-01 苏州烁点电子科技有限公司 一种pcb线路板钻孔工艺
CN114980516B (zh) * 2022-05-19 2023-03-24 广东合通建业科技股份有限公司 一种3d打印机双面热床线路板及其制造方法
CN116512432A (zh) * 2023-05-06 2023-08-01 江西衡源智能装备股份有限公司 桌面式多主轴自动化加工机床

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH033398A (ja) * 1989-05-31 1991-01-09 Matsushita Electric Ind Co Ltd 電子部品実装方法
JPH07314395A (ja) * 1994-05-23 1995-12-05 Hitachi Seiko Ltd プリント基板加工機
JP3989147B2 (ja) * 1999-11-19 2007-10-10 日立ビアメカニクス株式会社 プリント基板加工機
CN2444379Y (zh) * 2000-08-14 2001-08-22 联星科技股份有限公司 印刷电路板的全自动钻靶机
JP4638980B2 (ja) * 2000-11-24 2011-02-23 西部電機株式会社 スライダを背中合わせに備えた複列の加工機
JP4167108B2 (ja) * 2003-04-08 2008-10-15 日立ビアメカニクス株式会社 プリント基板加工機
CN1309518C (zh) * 2003-12-03 2007-04-11 联能科技（深圳）有限公司 印刷电路板钻孔机或成型机钻轴的排列方法

Also Published As

Publication number Publication date
CN101022701A (zh) 2007-08-22
TW200808506A (en) 2008-02-16
KR101273284B1 (ko) 2013-06-11
DE102007007482A1 (de) 2007-09-20
KR20070082560A (ko) 2007-08-21
CN101022701B (zh) 2010-07-28
JP2007245331A (ja) 2007-09-27
JP4787771B2 (ja) 2011-10-05

Similar Documents

Publication Publication Date Title
TW200808506A (en) Printed board machining device and drilling method therefor
US9266210B2 (en) Work machining method
KR101676625B1 (ko) 공작 기계
US20140227056A1 (en) Drilling Apparatus With A Decoupled Force Frame And Metrology Frame For Enhanced Positioning
JP2000033600A (ja) プリント回路基板を機械加工するための少なくとも２つの機械加工ヘッドを備えたドリル装置
JP2008112269A (ja) 加工シミュレーションシステム
TW520310B (en) Multiple spindle multiple carriage spindle positioning system
JP2007021606A (ja) ドリル穴明機及びその方法
JP7154310B2 (ja) マシニングセンタ及びワーク加工方法
JP2011158018A (ja) 静圧案内装置およびそれを備えた工作機械
JPH1015702A (ja) 多機能旋盤
JP4474328B2 (ja) 穴明け加工機
CN101579814A (zh) 小型数控钻铣床及控制方法
CN109822126A (zh) 印刷电路板加工设备及其钻孔加工方法
JP5554147B2 (ja) 加工方法及び加工装置
JP4741351B2 (ja) 小型旋盤
CN114786868B (zh) 用于机床的套组、刀具定位装置、旋转刀具驱动装置和机床
CN115335188A (zh) 镗杆的刀具更换装置及利用其的镗杆的刀具更换方法
CN114222645B (zh) 用于对工件进行加工的加工设备和用于加工的方法
JPH07227701A (ja) 自動旋盤
HK1111556A (en) Printed circuit board machining apparatus and drilling method
JP2000246564A (ja) レーザー・パンチ複合機
CN111360555A (zh) 一种适用于大尺寸工件的超精密机床的自动补偿机构
JP4393477B2 (ja) 両面加工旋盤
JP2006323773A (ja) 駆動制御用補正データの取得方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees