TWI386500B - 薄膜沉積裝置及其系統 - Google Patents

薄膜沉積裝置及其系統 Download PDF

Info

Publication number: TWI386500B
Authority: TW; Taiwan
Prior art keywords: substrate; substrate holder; chamber; thin film; chambers
Prior art date: 2009-05-07

Application number

TW099114629A

Other languages

English (en)

Chinese (zh)

Other versions

TW201107507A (en

Inventor

Kyung Bin Bae

Hyung Seok Yoon

Chang Ho Kang

Original Assignee

Snu Precision Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-05-07

Filing date

2010-05-07

Publication date

2013-02-21

2010-05-07 Application filed by Snu Precision Co Ltd filed Critical Snu Precision Co Ltd

2011-03-01 Publication of TW201107507A publication Critical patent/TW201107507A/zh

2013-02-21 Application granted granted Critical

2013-02-21 Publication of TWI386500B publication Critical patent/TWI386500B/zh

Links

238000000151 deposition Methods 0.000 title claims description 44
239000000758 substrate Substances 0.000 claims description 209
238000000034 method Methods 0.000 claims description 129
230000008569 process Effects 0.000 claims description 127
230000008021 deposition Effects 0.000 claims description 40
238000000427 thin-film deposition Methods 0.000 claims description 35
238000009826 distribution Methods 0.000 claims description 23
239000007921 spray Substances 0.000 claims description 11
239000000463 material Substances 0.000 claims description 7
239000010408 film Substances 0.000 description 19
239000010409 thin film Substances 0.000 description 14
238000012545 processing Methods 0.000 description 10
238000004148 unit process Methods 0.000 description 10
239000002994 raw material Substances 0.000 description 8
238000004519 manufacturing process Methods 0.000 description 5
238000007781 pre-processing Methods 0.000 description 4
238000001816 cooling Methods 0.000 description 3
238000010438 heat treatment Methods 0.000 description 3
238000012805 post-processing Methods 0.000 description 3
238000005452 bending Methods 0.000 description 2
230000008901 benefit Effects 0.000 description 2
238000002347 injection Methods 0.000 description 2
239000007924 injection Substances 0.000 description 2
238000000926 separation method Methods 0.000 description 2
229910001111 Fine metal Inorganic materials 0.000 description 1
206010047571 Visual impairment Diseases 0.000 description 1
230000005540 biological transmission Effects 0.000 description 1
238000010276 construction Methods 0.000 description 1
238000010304 firing Methods 0.000 description 1
239000011521 glass Substances 0.000 description 1
230000005525 hole transport Effects 0.000 description 1
239000004973 liquid crystal related substance Substances 0.000 description 1
239000002184 metal Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
230000003287 optical effect Effects 0.000 description 1
230000009257 reactivity Effects 0.000 description 1
230000004044 response Effects 0.000 description 1
238000004904 shortening Methods 0.000 description 1
239000000725 suspension Substances 0.000 description 1
230000008016 vaporization Effects 0.000 description 1
239000011364 vaporized material Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates

Landscapes

Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physical Vapour Deposition (AREA)
Chemical Vapour Deposition (AREA)

TW099114629A 2009-05-07 2010-05-07 薄膜沉積裝置及其系統 TWI386500B (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
KR1020090039826A KR101119853B1 (ko)	2009-05-07	2009-05-07	박막 증착 장치 및 이를 구비하는 박막 증착 시스템

Publications (2)

Publication Number	Publication Date
TW201107507A TW201107507A (en)	2011-03-01
TWI386500B true TWI386500B (zh)	2013-02-21

Family

ID=43050634

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW099114629A TWI386500B (zh)	2009-05-07	2010-05-07	薄膜沉積裝置及其系統

Country Status (5)

Country	Link
JP (1)	JP5506917B2 (fr)
KR (1)	KR101119853B1 (fr)
CN (1)	CN102421933B (fr)
TW (1)	TWI386500B (fr)
WO (1)	WO2010128811A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR101151234B1 (ko) *	2010-03-30	2012-06-14	주식회사 케이씨텍	직립방식 증착장치 및 기판 이송 방법
KR101700608B1 (ko) *	2011-04-15	2017-02-01	이찬용	기판처리장치
JP5846780B2 (ja) *	2011-06-30	2016-01-20	株式会社アルバック	真空処理装置及び真空処理方法、リチウムイオン二次電池の製造方法
KR101467195B1 (ko) *	2013-05-14	2014-12-01	주식회사 아바코	가스 분사기 및 이를 포함하는 박막 증착 장치
KR102426712B1 (ko) *	2015-02-16	2022-07-29	삼성디스플레이 주식회사	표시 장치 제조 장치 및 표시 장치 제조 방법
JP6602457B2 (ja) *	2017-03-17	2019-11-06	アプライドマテリアルズインコーポレイテッド	減圧システム内でマスクデバイスを取り扱う方法、マスクハンドリング装置、及び減圧システム
US11133430B2 (en) *	2017-08-09	2021-09-28	Kaneka Corporation	Photoelectric conversion element production method
JP2019528370A (ja) *	2017-08-17	2019-10-10	アプライドマテリアルズインコーポレイテッドＡｐｐｌｉｅｄＭａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ	いくつかのマスクを取り扱うための方法、基板を処理するための方法、及び基板をコーティングするための装置
KR101921648B1 (ko) *	2017-12-28	2018-11-26	주식회사 올레드온	수직형 면증발원을 이용한 고해상도 ａｍｏｌｅｄ 소자의 클러스터형 양산장비
KR20210081597A (ko) *	2019-12-24	2021-07-02	캐논 톡키 가부시키가이샤	성막 시스템　및 전자 디바이스 제조방법
KR102407505B1 (ko) *	2020-04-29	2022-06-13	주식회사 선익시스템	증착 장치 및 인라인 증착 시스템
CN111663104A (zh) *	2020-06-24	2020-09-15	武汉华星光电半导体显示技术有限公司	蒸镀系统及蒸镀方法
KR102879506B1 (ko)	2021-03-03	2025-11-03	삼성디스플레이 주식회사	진공 처리 장치 및 이를 이용한 진공 처리 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI258516B (en) *	2003-08-28	2006-07-21	Anelva Corp	Thin-film deposition system

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Publication number	Priority date	Publication date	Assignee	Title
JPH0299959U (fr) *	1989-01-24	1990-08-09
JPH051378A (ja) *	1991-03-25	1993-01-08	Shin Meiwa Ind Co Ltd	インライン成膜装置における基板ホルダの搬送装置
JPH0941142A (ja) *	1995-07-26	1997-02-10	Balzers & Leybold Deutsche Holding Ag	真空中で被覆したい基板を交互に位置決めする装置
JP2000277585A (ja) *	1999-03-23	2000-10-06	Hitachi Ltd	基板搬送装置および真空処理装置
JP2004146369A (ja) *	2002-09-20	2004-05-20	Semiconductor Energy Lab Co Ltd	製造装置および発光装置の作製方法
WO2004028214A1 (fr) *	2002-09-20	2004-04-01	Semiconductor Energy Laboratory Co., Ltd.	Systeme de fabrication et procede de production d'un dispositif electroluminescent
KR20040088238A (ko) *	2003-04-09	2004-10-16	(주)네스디스플레이	진공증착 시스템과 방법
DE502005005634D1 (de) *	2005-09-15	2008-11-20	Applied Materials Gmbh & Co Kg	Beschichtungsanlage und Verfahren zum Betrieb einer Beschichtungsanlage
JP2007239071A (ja)	2006-03-10	2007-09-20	Fujifilm Corp	真空蒸着装置
JP2008019477A (ja) *	2006-07-13	2008-01-31	Canon Inc	真空蒸着装置

2009
- 2009-05-07 KR KR1020090039826A patent/KR101119853B1/ko not_active Expired - Fee Related
2010
- 2010-05-06 CN CN201080020337.9A patent/CN102421933B/zh not_active Expired - Fee Related
- 2010-05-06 JP JP2012509732A patent/JP5506917B2/ja active Active
- 2010-05-06 WO PCT/KR2010/002887 patent/WO2010128811A2/fr not_active Ceased
- 2010-05-07 TW TW099114629A patent/TWI386500B/zh not_active IP Right Cessation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI258516B (en) *	2003-08-28	2006-07-21	Anelva Corp	Thin-film deposition system

Also Published As

Publication number	Publication date
CN102421933B (zh)	2014-07-23
TW201107507A (en)	2011-03-01
KR20100120941A (ko)	2010-11-17
WO2010128811A3 (fr)	2011-03-17
JP2012526199A (ja)	2012-10-25
CN102421933A (zh)	2012-04-18
JP5506917B2 (ja)	2014-05-28
WO2010128811A2 (fr)	2010-11-11
KR101119853B1 (ko)	2012-02-28

Legal Events

Date	Code	Title	Description
2021-11-21	MM4A	Annulment or lapse of patent due to non-payment of fees

Publication	Publication Date	Title
TWI427178B (zh)	2014-02-21	用於沉積薄膜之裝置、方法及系統
CN102421933B (zh)	2014-07-23	薄膜沉积装置及其系统
JP5686185B2 (ja)	2015-03-18	薄膜蒸着装置
US8833294B2 (en)	2014-09-16	Thin film deposition apparatus including patterning slit sheet and method of manufacturing organic light-emitting display device with the same
CN102867919B (zh)	2016-09-28	有机层沉积设备
JP5676175B2 (ja)	2015-02-25	薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
JP5611718B2 (ja)	2014-10-22	薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
KR101174883B1 (ko)	2012-08-17	박막 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조 방법
US8883259B2 (en)	2014-11-11	Thin film deposition apparatus
CN101906608B (zh)	2015-09-09	沉积设备及其控制方法
KR101027509B1 (ko)	2011-04-06	막 증착 장치
KR101225312B1 (ko)	2013-01-22	프로세스 장치
JP2004241319A (ja)	2004-08-26	成膜装置
KR101321331B1 (ko)	2013-10-23	태양전지용 박막 증착 시스템
KR20200061751A (ko)	2020-06-03	초대면적 ｑｄ-ｏｌｅｄｔｖ 제조용 수직형 벨트면증발원을 이용한 클러스터형 양산용 증착장치
TWI518828B (zh)	2016-01-21	基板處理系統
JP2013110114A (ja)	2013-06-06	有機ｅｌデバイス製造装置及び角度補正機構
JP2019528370A (ja)	2019-10-10	いくつかのマスクを取り扱うための方法、基板を処理するための方法、及び基板をコーティングするための装置
KR102430349B1 (ko)	2022-08-08	클러스터 증착 시스템