TWI400719B - 鎳粉末、導電糊及使用它之多層電子組件 - Google Patents

鎳粉末、導電糊及使用它之多層電子組件 Download PDF

Info

Publication number: TWI400719B
Authority: TW; Taiwan
Prior art keywords: powder; nickel; nickel powder; carbon; weight
Prior art date: 2005-12-07

Application number

TW095144576A

Other languages

English (en)

Chinese (zh)

Other versions

TW200729235A (en

Inventor

Yuji Akimoto

Kazuro Nagashima

Hidenori Ieda

Original Assignee

Shoei Chemical Ind Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-12-07

Filing date

2006-12-01

Publication date

2013-07-01

2006-12-01 Application filed by Shoei Chemical Ind Co filed Critical Shoei Chemical Ind Co

2007-08-01 Publication of TW200729235A publication Critical patent/TW200729235A/zh

2013-07-01 Application granted granted Critical

2013-07-01 Publication of TWI400719B publication Critical patent/TWI400719B/zh

Links

PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 170
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 76
229910052799 carbon Inorganic materials 0.000 claims abstract description 76
239000000843 powder Substances 0.000 claims abstract description 62
239000000919 ceramic Substances 0.000 claims abstract description 39
239000002245 particle Substances 0.000 claims abstract description 30
229910052759 nickel Inorganic materials 0.000 claims abstract description 29
239000011230 binding agent Substances 0.000 claims abstract description 24
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 21
229910052760 oxygen Inorganic materials 0.000 claims abstract description 21
239000001301 oxygen Substances 0.000 claims abstract description 21
239000010410 layer Substances 0.000 claims description 30
239000011347 resin Substances 0.000 claims description 30
229920005989 resin Polymers 0.000 claims description 30
NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 26
229910052717 sulfur Inorganic materials 0.000 claims description 26
239000011593 sulfur Substances 0.000 claims description 25
125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 16
239000002904 solvent Substances 0.000 claims description 13
239000002344 surface layer Substances 0.000 claims description 12
238000004833 X-ray photoelectron spectroscopy Methods 0.000 claims description 9
238000004458 analytical method Methods 0.000 claims description 4
230000003595 spectral effect Effects 0.000 claims description 4
239000000126 substance Substances 0.000 claims description 4
238000000034 method Methods 0.000 abstract description 42
230000007847 structural defect Effects 0.000 abstract description 10
230000007423 decrease Effects 0.000 abstract description 8
230000003247 decreasing effect Effects 0.000 abstract 1
239000007789 gas Substances 0.000 description 25
238000000354 decomposition reaction Methods 0.000 description 18
230000000694 effects Effects 0.000 description 18
238000010304 firing Methods 0.000 description 14
239000012298 atmosphere Substances 0.000 description 13
238000005245 sintering Methods 0.000 description 12
238000006243 chemical reaction Methods 0.000 description 9
239000007858 starting material Substances 0.000 description 9
239000003990 capacitor Substances 0.000 description 8
230000001590 oxidative effect Effects 0.000 description 7
238000010438 heat treatment Methods 0.000 description 6
238000004519 manufacturing process Methods 0.000 description 6
229910052751 metal Inorganic materials 0.000 description 6
239000012299 nitrogen atmosphere Substances 0.000 description 6
230000003647 oxidation Effects 0.000 description 6
238000007254 oxidation reaction Methods 0.000 description 6
238000005240 physical vapour deposition Methods 0.000 description 6
230000015556 catabolic process Effects 0.000 description 5
230000003197 catalytic effect Effects 0.000 description 5
239000003985 ceramic capacitor Substances 0.000 description 5
238000005229 chemical vapour deposition Methods 0.000 description 5
238000005336 cracking Methods 0.000 description 5
238000006731 degradation reaction Methods 0.000 description 5
230000000977 initiatory effect Effects 0.000 description 5
239000002184 metal Substances 0.000 description 5
150000002736 metal compounds Chemical class 0.000 description 5
238000005118 spray pyrolysis Methods 0.000 description 5
238000010301 surface-oxidation reaction Methods 0.000 description 5
RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 4
238000004220 aggregation Methods 0.000 description 4
230000002776 aggregation Effects 0.000 description 4
238000001816 cooling Methods 0.000 description 4
229910052739 hydrogen Inorganic materials 0.000 description 4
229910000037 hydrogen sulfide Inorganic materials 0.000 description 4
239000012535 impurity Substances 0.000 description 4
239000000203 mixture Substances 0.000 description 4
238000004438 BET method Methods 0.000 description 3
-1 carbon and sulfur Chemical compound 0.000 description 3
238000002485 combustion reaction Methods 0.000 description 3
238000001228 spectrum Methods 0.000 description 3
238000004381 surface treatment Methods 0.000 description 3
ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
239000001856 Ethyl cellulose Substances 0.000 description 2
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 2
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
229910002113 barium titanate Inorganic materials 0.000 description 2
239000010953 base metal Substances 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
150000001875 compounds Chemical class 0.000 description 2
230000032798 delamination Effects 0.000 description 2
239000002270 dispersing agent Substances 0.000 description 2
239000006185 dispersion Substances 0.000 description 2
239000002003 electrode paste Substances 0.000 description 2
229920001249 ethyl cellulose Polymers 0.000 description 2
235000019325 ethyl cellulose Nutrition 0.000 description 2
238000011156 evaluation Methods 0.000 description 2
239000002360 explosive Substances 0.000 description 2
239000001257 hydrogen Substances 0.000 description 2
239000011261 inert gas Substances 0.000 description 2
UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 description 2
YQCIWBXEVYWRCW-UHFFFAOYSA-N methane;sulfane Chemical compound C.S YQCIWBXEVYWRCW-UHFFFAOYSA-N 0.000 description 2
238000002156 mixing Methods 0.000 description 2
229940078487 nickel acetate tetrahydrate Drugs 0.000 description 2
150000002816 nickel compounds Chemical class 0.000 description 2
OINIXPNQKAZCRL-UHFFFAOYSA-L nickel(2+);diacetate;tetrahydrate Chemical compound O.O.O.O.[Ni+2].CC([O-])=O.CC([O-])=O OINIXPNQKAZCRL-UHFFFAOYSA-L 0.000 description 2
238000010405 reoxidation reaction Methods 0.000 description 2
238000011160 research Methods 0.000 description 2
FFQALBCXGPYQGT-UHFFFAOYSA-N 2,4-difluoro-5-(trifluoromethyl)aniline Chemical compound NC1=CC(C(F)(F)F)=C(F)C=C1F FFQALBCXGPYQGT-UHFFFAOYSA-N 0.000 description 1
239000004925 Acrylic resin Substances 0.000 description 1
229920000178 Acrylic resin Polymers 0.000 description 1
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
229920002799 BoPET Polymers 0.000 description 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
239000005751 Copper oxide Substances 0.000 description 1
229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
FQNGWRSKYZLJDK-UHFFFAOYSA-N [Ca].[Ba] Chemical compound [Ca].[Ba] FQNGWRSKYZLJDK-UHFFFAOYSA-N 0.000 description 1
230000001133 acceleration Effects 0.000 description 1
239000000654 additive Substances 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
230000002411 adverse Effects 0.000 description 1
150000001298 alcohols Chemical class 0.000 description 1
230000005540 biological transmission Effects 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
125000004432 carbon atom Chemical group C* 0.000 description 1
CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
239000012159 carrier gas Substances 0.000 description 1
239000003054 catalyst Substances 0.000 description 1
239000012461 cellulose resin Substances 0.000 description 1
238000010344 co-firing Methods 0.000 description 1
238000013329 compounding Methods 0.000 description 1
239000004020 conductor Substances 0.000 description 1
238000011109 contamination Methods 0.000 description 1
230000008602 contraction Effects 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
229910000431 copper oxide Inorganic materials 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
230000003111 delayed effect Effects 0.000 description 1
230000002542 deteriorative effect Effects 0.000 description 1
238000011161 development Methods 0.000 description 1
229910001873 dinitrogen Inorganic materials 0.000 description 1
238000007606 doctor blade method Methods 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
150000002148 esters Chemical class 0.000 description 1
150000002170 ethers Chemical class 0.000 description 1
239000011521 glass Substances 0.000 description 1
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
230000005764 inhibitory process Effects 0.000 description 1
238000009413 insulation Methods 0.000 description 1
NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
229910052622 kaolinite Inorganic materials 0.000 description 1
238000004898 kneading Methods 0.000 description 1
239000007788 liquid Substances 0.000 description 1
239000000395 magnesium oxide Substances 0.000 description 1
CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
238000005259 measurement Methods 0.000 description 1
229910044991 metal oxide Inorganic materials 0.000 description 1
150000004706 metal oxides Chemical class 0.000 description 1
125000005395 methacrylic acid group Chemical group 0.000 description 1
229910000480 nickel oxide Inorganic materials 0.000 description 1
229910000510 noble metal Inorganic materials 0.000 description 1
239000003960 organic solvent Substances 0.000 description 1
150000002898 organic sulfur compounds Chemical class 0.000 description 1
GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
239000003973 paint Substances 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
239000005011 phenolic resin Substances 0.000 description 1
239000004014 plasticizer Substances 0.000 description 1
229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
238000006479 redox reaction Methods 0.000 description 1
238000007650 screen-printing Methods 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
239000012798 spherical particle Substances 0.000 description 1
125000004434 sulfur atom Chemical group 0.000 description 1
150000003464 sulfur compounds Chemical class 0.000 description 1
DHCDFWKWKRSZHF-UHFFFAOYSA-N sulfurothioic S-acid Chemical compound OS(O)(=O)=S DHCDFWKWKRSZHF-UHFFFAOYSA-N 0.000 description 1
239000012756 surface treatment agent Substances 0.000 description 1
239000004094 surface-active agent Substances 0.000 description 1
238000005979 thermal decomposition reaction Methods 0.000 description 1
150000003573 thiols Chemical class 0.000 description 1
OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
229910052902 vermiculite Inorganic materials 0.000 description 1
239000010455 vermiculite Substances 0.000 description 1
235000019354 vermiculite Nutrition 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
238000005303 weighing Methods 0.000 description 1
230000004580 weight loss Effects 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/16—Metallic particles coated with a non-metal
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated

Landscapes

Engineering & Computer Science (AREA)
Power Engineering (AREA)
Chemical & Material Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Spectroscopy & Molecular Physics (AREA)
Physics & Mathematics (AREA)
Dispersion Chemistry (AREA)
Materials Engineering (AREA)
Conductive Materials (AREA)
Ceramic Capacitors (AREA)
Powder Metallurgy (AREA)
Non-Insulated Conductors (AREA)
Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

TW095144576A 2005-12-07 2006-12-01 鎳粉末、導電糊及使用它之多層電子組件 TWI400719B (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2005352925A JP4697539B2 (ja)	2005-12-07	2005-12-07	ニッケル粉末、導体ペーストおよびそれを用いた積層電子部品

Publications (2)

Publication Number	Publication Date
TW200729235A TW200729235A (en)	2007-08-01
TWI400719B true TWI400719B (zh)	2013-07-01

Family

ID=37995796

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW095144576A TWI400719B (zh)	2005-12-07	2006-12-01	鎳粉末、導電糊及使用它之多層電子組件

Country Status (10)

Country	Link
US (1)	US7618474B2 (de)
EP (1)	EP1800773B1 (de)
JP (1)	JP4697539B2 (de)
KR (1)	KR100853599B1 (de)
CN (1)	CN100565713C (de)
AT (1)	ATE448039T1 (de)
CA (1)	CA2568811C (de)
DE (1)	DE602006010310D1 (de)
MY (1)	MY148386A (de)
TW (1)	TWI400719B (de)

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JP5327519B2 (ja)	2006-10-02	2013-10-30	昭栄化学工業株式会社	ニッケル−レニウム合金粉末及びそれを含有する導体ペースト
CA2663572C (en)	2006-10-02	2013-07-30	Shoei Chemical Inc.	Nickel-rhenium alloy powder and conductor paste containing the same
JP4807581B2 (ja)	2007-03-12	2011-11-02	昭栄化学工業株式会社	ニッケル粉末、その製造方法、導体ペーストおよびそれを用いた積層セラミック電子部品
JP2009037974A (ja) *	2007-08-03	2009-02-19	Noritake Co Ltd	ニッケルペースト
US20100038604A1 (en) *	2007-08-03	2010-02-18	Noritake Co., Limited	Nickel Paste
US8178192B2 (en)	2008-03-06	2012-05-15	Ngk Insulators, Ltd.	Ceramic green sheet, ceramic green sheet laminate, production method of ceramic green sheet, and production method of ceramic green sheet laminate
KR101015127B1 (ko) *	2008-08-20	2011-02-16	주식회사 하이닉스반도체	반도체 장치의 전극, 캐패시터 및 그의 제조방법
KR20100031843A (ko) *	2008-09-16	2010-03-25	(주)창성	전도성 금속 전극 형성용 잉크조성물 및 그 제조방법
JP5157799B2 (ja) *	2008-10-02	2013-03-06	住友金属鉱山株式会社	導電性ペースト、並びにこの導電性ペーストを用いた乾燥膜及び積層セラミックコンデンサ
JP5574154B2 (ja) *	2010-01-25	2014-08-20	住友金属鉱山株式会社	ニッケル粉末およびその製造方法
JP6028727B2 (ja)	2011-05-18	2016-11-16	戸田工業株式会社	銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜
KR101565631B1 (ko)	2012-06-04	2015-11-03	삼성전기주식회사	내부 전극용 도전성 페이스트 조성물, 적층 세라믹 커패시터 및 이의 제조방법
KR20140024584A (ko) *	2012-08-20	2014-03-03	삼성전기주식회사	내부전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자부품
KR102248526B1 (ko) *	2013-07-23	2021-05-06	삼성전기주식회사	내부 전극용 니켈 분말, 이를 포함하는 적층 세라믹 커패시터 및 전자부품이 실장된 회로기판
JP2015086465A (ja) *	2013-10-30	2015-05-07	サムソンエレクトロ−メカニックスカンパニーリミテッド．	ニッケルナノ粉末及びその製造方法
JP5668879B1 (ja) *	2014-03-07	2015-02-12	住友金属鉱山株式会社	ニッケル粉末
JP5936091B2 (ja) *	2014-06-20	2016-06-15	昭栄化学工業株式会社	炭素被覆金属粉末、炭素被覆金属粉末を含有する導電性ペースト及びそれを用いた積層電子部品、並びに炭素被覆金属粉末の製造方法
JP2016115448A (ja) *	2014-12-11	2016-06-23	株式会社村田製作所	導電性ペーストおよびセラミック電子部品
KR102193956B1 (ko) *	2015-12-04	2020-12-22	삼성전기주식회사	적층 세라믹 커패시터 및 그 실장 기판
CN108430673B (zh) *	2016-01-12	2021-09-03	东邦钛株式会社	镍粉末
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- 2006-12-01 TW TW095144576A patent/TWI400719B/zh active
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Also Published As

Publication number	Publication date
ATE448039T1 (de)	2009-11-15
TW200729235A (en)	2007-08-01
EP1800773A1 (de)	2007-06-27
DE602006010310D1 (de)	2009-12-24
US7618474B2 (en)	2009-11-17
KR100853599B1 (ko)	2008-08-22
JP4697539B2 (ja)	2011-06-08
CA2568811A1 (en)	2007-06-07
KR20070060036A (ko)	2007-06-12
EP1800773B1 (de)	2009-11-11
CN100565713C (zh)	2009-12-02
CA2568811C (en)	2010-11-09
MY148386A (en)	2013-04-15
CN1979694A (zh)	2007-06-13
US20070125195A1 (en)	2007-06-07
JP2007157563A (ja)	2007-06-21

Publication	Publication Date	Title
US7618474B2 (en)	2009-11-17	Nickel powder, conductive paste, and multilayer electronic component using same
JP4807581B2 (ja)	2011-11-02	ニッケル粉末、その製造方法、導体ペーストおよびそれを用いた積層セラミック電子部品
JP5327442B2 (ja)	2013-10-30	ニッケル−レニウム合金粉末及びそれを含有する導体ペースト
CN101522929B (zh)	2011-04-13	镍-铼合金粉末及含有其的导体糊