ATE448039T1 - Nickelpulver, leitfähige paste und mehrlagigen elektronischen komponenten damit - Google Patents
Nickelpulver, leitfähige paste und mehrlagigen elektronischen komponenten damitInfo
- Publication number
- ATE448039T1 ATE448039T1 AT06024420T AT06024420T ATE448039T1 AT E448039 T1 ATE448039 T1 AT E448039T1 AT 06024420 T AT06024420 T AT 06024420T AT 06024420 T AT06024420 T AT 06024420T AT E448039 T1 ATE448039 T1 AT E448039T1
- Authority
- AT
- Austria
- Prior art keywords
- nickel powder
- powder
- electronic component
- conductive paste
- nickel
- Prior art date
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 3
- 229910052799 carbon Inorganic materials 0.000 abstract 3
- 239000000843 powder Substances 0.000 abstract 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 230000007847 structural defect Effects 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/16—Metallic particles coated with a non-metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Ceramic Capacitors (AREA)
- Powder Metallurgy (AREA)
- Non-Insulated Conductors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005352925A JP4697539B2 (ja) | 2005-12-07 | 2005-12-07 | ニッケル粉末、導体ペーストおよびそれを用いた積層電子部品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE448039T1 true ATE448039T1 (de) | 2009-11-15 |
Family
ID=37995796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06024420T ATE448039T1 (de) | 2005-12-07 | 2006-11-24 | Nickelpulver, leitfähige paste und mehrlagigen elektronischen komponenten damit |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7618474B2 (de) |
| EP (1) | EP1800773B1 (de) |
| JP (1) | JP4697539B2 (de) |
| KR (1) | KR100853599B1 (de) |
| CN (1) | CN100565713C (de) |
| AT (1) | ATE448039T1 (de) |
| CA (1) | CA2568811C (de) |
| DE (1) | DE602006010310D1 (de) |
| MY (1) | MY148386A (de) |
| TW (1) | TWI400719B (de) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5327519B2 (ja) | 2006-10-02 | 2013-10-30 | 昭栄化学工業株式会社 | ニッケル−レニウム合金粉末及びそれを含有する導体ペースト |
| EP2078762B1 (de) | 2006-10-02 | 2011-09-21 | Shoei Chemical Inc. | Nickel-rhenium-legierungspulver und das nickel-rhenium-legierungspulver enthaltende leiterpaste |
| JP4807581B2 (ja) | 2007-03-12 | 2011-11-02 | 昭栄化学工業株式会社 | ニッケル粉末、その製造方法、導体ペーストおよびそれを用いた積層セラミック電子部品 |
| JP2009037974A (ja) * | 2007-08-03 | 2009-02-19 | Noritake Co Ltd | ニッケルペースト |
| US20100038604A1 (en) * | 2007-08-03 | 2010-02-18 | Noritake Co., Limited | Nickel Paste |
| US8178192B2 (en) | 2008-03-06 | 2012-05-15 | Ngk Insulators, Ltd. | Ceramic green sheet, ceramic green sheet laminate, production method of ceramic green sheet, and production method of ceramic green sheet laminate |
| KR101015127B1 (ko) * | 2008-08-20 | 2011-02-16 | 주식회사 하이닉스반도체 | 반도체 장치의 전극, 캐패시터 및 그의 제조방법 |
| KR20100031843A (ko) * | 2008-09-16 | 2010-03-25 | (주)창성 | 전도성 금속 전극 형성용 잉크조성물 및 그 제조방법 |
| JP5157799B2 (ja) * | 2008-10-02 | 2013-03-06 | 住友金属鉱山株式会社 | 導電性ペースト、並びにこの導電性ペーストを用いた乾燥膜及び積層セラミックコンデンサ |
| JP5574154B2 (ja) * | 2010-01-25 | 2014-08-20 | 住友金属鉱山株式会社 | ニッケル粉末およびその製造方法 |
| JP6028727B2 (ja) * | 2011-05-18 | 2016-11-16 | 戸田工業株式会社 | 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜 |
| KR101565631B1 (ko) | 2012-06-04 | 2015-11-03 | 삼성전기주식회사 | 내부 전극용 도전성 페이스트 조성물, 적층 세라믹 커패시터 및 이의 제조방법 |
| KR20140024584A (ko) * | 2012-08-20 | 2014-03-03 | 삼성전기주식회사 | 내부전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자부품 |
| KR102248526B1 (ko) * | 2013-07-23 | 2021-05-06 | 삼성전기주식회사 | 내부 전극용 니켈 분말, 이를 포함하는 적층 세라믹 커패시터 및 전자부품이 실장된 회로기판 |
| JP2015086465A (ja) * | 2013-10-30 | 2015-05-07 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | ニッケルナノ粉末及びその製造方法 |
| JP5668879B1 (ja) * | 2014-03-07 | 2015-02-12 | 住友金属鉱山株式会社 | ニッケル粉末 |
| JP5936091B2 (ja) * | 2014-06-20 | 2016-06-15 | 昭栄化学工業株式会社 | 炭素被覆金属粉末、炭素被覆金属粉末を含有する導電性ペースト及びそれを用いた積層電子部品、並びに炭素被覆金属粉末の製造方法 |
| JP2016115448A (ja) * | 2014-12-11 | 2016-06-23 | 株式会社村田製作所 | 導電性ペーストおよびセラミック電子部品 |
| KR102193956B1 (ko) * | 2015-12-04 | 2020-12-22 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
| WO2017122689A1 (ja) * | 2016-01-12 | 2017-07-20 | 東邦チタニウム株式会社 | ニッケル粉末 |
| CN111247101B (zh) | 2017-10-26 | 2023-03-07 | 住友金属矿山株式会社 | 镍复合氧化物和锂镍复合氧化物的制造方法 |
| WO2019148277A1 (en) * | 2018-01-30 | 2019-08-08 | Tekna Plasma Systems Inc. | Metallic powders for use as electrode material in multilayer ceramic capacitors and method of manufacturing and of using same |
| KR102140622B1 (ko) * | 2018-08-23 | 2020-08-03 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조방법 |
| CN113285012A (zh) * | 2020-02-20 | 2021-08-20 | 丰田自动车株式会社 | 致动器以及致动器的制造方法 |
| US12073996B2 (en) * | 2021-03-01 | 2024-08-27 | Taiyo Yuden Co., Ltd. | Ceramic electronic device, powder material, paste material, and manufacturing method of ceramic electronic device |
| KR20230008405A (ko) * | 2021-07-07 | 2023-01-16 | 삼성전기주식회사 | 커패시터 부품 및 커패시터 부품의 제조 방법 |
| CN115240896B (zh) * | 2022-07-11 | 2024-11-12 | 宁波广新纳米材料有限公司 | 一种镍合金粉、导电浆及多层陶瓷电容器 |
| CN116004079A (zh) * | 2022-12-15 | 2023-04-25 | 洛阳科博思新材料科技有限公司 | 一种钢轨涂层用耐磨高阻抗涂料及钢轨和喷涂方法 |
| WO2025023165A1 (ja) * | 2023-07-26 | 2025-01-30 | 太陽誘電株式会社 | 積層セラミック電子部品及びその製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10106351A (ja) | 1996-09-30 | 1998-04-24 | Kyocera Corp | 導電性ペースト |
| JPH1180816A (ja) * | 1997-09-10 | 1999-03-26 | Sumitomo Metal Mining Co Ltd | 導電ペースト用ニッケル粉末とその製造方法 |
| JP3984712B2 (ja) | 1998-07-27 | 2007-10-03 | 東邦チタニウム株式会社 | 導電ペースト用ニッケル粉末 |
| AU3768701A (en) * | 2000-02-18 | 2001-08-27 | Canadian Electronics Powders Corporation | Nickel powder for use as electrodes in base metal electrode multilayered ceramiccapacitors |
| JP4552260B2 (ja) | 2000-03-30 | 2010-09-29 | Ｔｄｋ株式会社 | ニッケル粉末、電極用ペーストおよび電子部品の製造方法 |
| JP4168773B2 (ja) * | 2003-02-12 | 2008-10-22 | 住友金属鉱山株式会社 | 焼結性に優れたニッケル粉末の製造方法 |
| KR100682884B1 (ko) | 2003-04-08 | 2007-02-15 | 삼성전자주식회사 | 니켈금속분말 및 그 제조 방법 |
| JP2005154904A (ja) | 2003-11-25 | 2005-06-16 | Samsung Electronics Co Ltd | 炭素含有ニッケル粒子粉末およびその製造方法 |
| KR101085265B1 (ko) * | 2004-06-16 | 2011-11-22 | 도호 티타늄 가부시키가이샤 | 니켈 분말 및 그 제조 방법 |
-
2005
- 2005-12-07 JP JP2005352925A patent/JP4697539B2/ja not_active Expired - Lifetime
-
2006
- 2006-11-20 US US11/602,062 patent/US7618474B2/en active Active
- 2006-11-23 CA CA2568811A patent/CA2568811C/en active Active
- 2006-11-24 AT AT06024420T patent/ATE448039T1/de active
- 2006-11-24 DE DE602006010310T patent/DE602006010310D1/de active Active
- 2006-11-24 EP EP06024420A patent/EP1800773B1/de not_active Not-in-force
- 2006-12-01 TW TW095144576A patent/TWI400719B/zh active
- 2006-12-05 MY MYPI20064625A patent/MY148386A/en unknown
- 2006-12-07 CN CNB2006101640922A patent/CN100565713C/zh active Active
- 2006-12-07 KR KR1020060123672A patent/KR100853599B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI400719B (zh) | 2013-07-01 |
| JP4697539B2 (ja) | 2011-06-08 |
| EP1800773B1 (de) | 2009-11-11 |
| KR20070060036A (ko) | 2007-06-12 |
| US20070125195A1 (en) | 2007-06-07 |
| CA2568811A1 (en) | 2007-06-07 |
| EP1800773A1 (de) | 2007-06-27 |
| KR100853599B1 (ko) | 2008-08-22 |
| TW200729235A (en) | 2007-08-01 |
| CN1979694A (zh) | 2007-06-13 |
| JP2007157563A (ja) | 2007-06-21 |
| DE602006010310D1 (de) | 2009-12-24 |
| CN100565713C (zh) | 2009-12-02 |
| CA2568811C (en) | 2010-11-09 |
| MY148386A (en) | 2013-04-15 |
| US7618474B2 (en) | 2009-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE448039T1 (de) | Nickelpulver, leitfähige paste und mehrlagigen elektronischen komponenten damit | |
| CN102105954B (zh) | 层叠型电子零件 | |
| EP1972397A3 (de) | Nickelpulver, Herstellungsverfahren dafür, leitfähige Paste und mehrschichtige keramische elektronische Komponente damit | |
| KR20180066851A (ko) | 적층 세라믹 콘덴서 | |
| JP2016092404A (ja) | チップ電子部品及びその製造方法 | |
| EP1045410A3 (de) | Elektrode für Elektrolytkondensator und Herstellungsverfahren | |
| JPWO2008035727A1 (ja) | 積層セラミックコンデンサ | |
| JP2015128130A (ja) | 積層セラミック電子部品及びその製造方法並びに積層セラミック電子部品の実装基板 | |
| WO2006091463A3 (en) | Method of making multilayered construction for use in resistors and capacitors | |
| TW200520661A (en) | Multi-layered ceramic substrate and its production method, and electronic device comprising same | |
| JPWO2017154692A1 (ja) | 複合基板及び複合基板の製造方法 | |
| CN111096090B (zh) | 陶瓷基板的制造方法、陶瓷基板以及模块 | |
| JPH11102614A (ja) | バイアホール用導電性ペースト、およびそれを用いた積層セラミック基板の製造方法 | |
| MY145770A (en) | Nickel-rhenium alloy powder and conductor paste containing the same | |
| JPWO2005036571A1 (ja) | 電極ペースト、セラミック電子部品及びその製造方法 | |
| JPWO2007007518A1 (ja) | 導電性粉末、導電性ペースト、および積層型セラミック電子部品の製造方法 | |
| JP2008270750A (ja) | 導電性ペースト、積層セラミック電子部品および多層セラミック基板 | |
| ATE310598T1 (de) | Nickelpulver und leitfähige paste | |
| JP4211783B2 (ja) | 導電性ペーストおよび積層セラミック電子部品 | |
| JP5780035B2 (ja) | セラミック電子部品 | |
| JP4796809B2 (ja) | 積層電子部品 | |
| JP2005276513A (ja) | サージアブソーバの製造方法 | |
| JP2011077158A (ja) | 積層体およびこれを用いた電子部品の製造方法 | |
| JP2005268204A (ja) | 導電性ペースト及びセラミック電子部品 | |
| JP4844317B2 (ja) | セラミック電子部品およびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification |
Ref document number: 1800773 Country of ref document: EP |