TWI421911B - An exposure method, an exposure apparatus, and an element manufacturing method - Google Patents

An exposure method, an exposure apparatus, and an element manufacturing method Download PDF

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Publication number
TWI421911B
TWI421911B TW100126336A TW100126336A TWI421911B TW I421911 B TWI421911 B TW I421911B TW 100126336 A TW100126336 A TW 100126336A TW 100126336 A TW100126336 A TW 100126336A TW I421911 B TWI421911 B TW I421911B
Authority
TW
Taiwan
Prior art keywords
liquid
substrate
exposure
supply
recovery
Prior art date
Application number
TW100126336A
Other languages
English (en)
Chinese (zh)
Other versions
TW201203318A (en
Inventor
長坂博之
Original Assignee
尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 尼康股份有限公司 filed Critical 尼康股份有限公司
Publication of TW201203318A publication Critical patent/TW201203318A/zh
Application granted granted Critical
Publication of TWI421911B publication Critical patent/TWI421911B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/42—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70325—Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lenses or solid immersion lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Optics & Photonics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW100126336A 2003-05-23 2004-05-21 An exposure method, an exposure apparatus, and an element manufacturing method TWI421911B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003146424 2003-05-23

Publications (2)

Publication Number Publication Date
TW201203318A TW201203318A (en) 2012-01-16
TWI421911B true TWI421911B (zh) 2014-01-01

Family

ID=33475300

Family Applications (9)

Application Number Title Priority Date Filing Date
TW100126336A TWI421911B (zh) 2003-05-23 2004-05-21 An exposure method, an exposure apparatus, and an element manufacturing method
TW102142613A TW201415536A (zh) 2003-05-23 2004-05-21 曝光方法及曝光裝置以及元件製造方法
TW104112367A TWI612557B (zh) 2003-05-23 2004-05-21 曝光方法及曝光裝置以及元件製造方法
TW102136490A TWI511181B (zh) 2003-05-23 2004-05-21 Exposure method and exposure apparatus, and device manufacturing method
TW103146232A TW201515064A (zh) 2003-05-23 2004-05-21 曝光方法及曝光裝置以及元件製造方法
TW102126874A TWI463533B (zh) 2003-05-23 2004-05-21 An exposure method, an exposure apparatus, and an element manufacturing method
TW104112370A TWI614794B (zh) 2003-05-23 2004-05-21 曝光方法及曝光裝置以及元件製造方法
TW093114402A TWI421906B (zh) 2003-05-23 2004-05-21 An exposure method, an exposure apparatus, and an element manufacturing method
TW102126875A TWI470671B (zh) 2003-05-23 2004-05-21 Exposure method and exposure apparatus, and device manufacturing method

Family Applications After (8)

Application Number Title Priority Date Filing Date
TW102142613A TW201415536A (zh) 2003-05-23 2004-05-21 曝光方法及曝光裝置以及元件製造方法
TW104112367A TWI612557B (zh) 2003-05-23 2004-05-21 曝光方法及曝光裝置以及元件製造方法
TW102136490A TWI511181B (zh) 2003-05-23 2004-05-21 Exposure method and exposure apparatus, and device manufacturing method
TW103146232A TW201515064A (zh) 2003-05-23 2004-05-21 曝光方法及曝光裝置以及元件製造方法
TW102126874A TWI463533B (zh) 2003-05-23 2004-05-21 An exposure method, an exposure apparatus, and an element manufacturing method
TW104112370A TWI614794B (zh) 2003-05-23 2004-05-21 曝光方法及曝光裝置以及元件製造方法
TW093114402A TWI421906B (zh) 2003-05-23 2004-05-21 An exposure method, an exposure apparatus, and an element manufacturing method
TW102126875A TWI470671B (zh) 2003-05-23 2004-05-21 Exposure method and exposure apparatus, and device manufacturing method

Country Status (7)

Country Link
US (9) US7495744B2 (2)
EP (6) EP3048487B1 (2)
JP (10) JP5353811B2 (2)
KR (12) KR101102286B1 (2)
HK (3) HK1205282A1 (2)
TW (9) TWI421911B (2)
WO (1) WO2004105106A1 (2)

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