TWI443208B - 蒸發裝置 - Google Patents

蒸發裝置 Download PDF

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Publication number
TWI443208B
TWI443208B TW097120463A TW97120463A TWI443208B TW I443208 B TWI443208 B TW I443208B TW 097120463 A TW097120463 A TW 097120463A TW 97120463 A TW97120463 A TW 97120463A TW I443208 B TWI443208 B TW I443208B
Authority
TW
Taiwan
Prior art keywords
moving plate
evaporation
guiding
moving
driving
Prior art date
Application number
TW097120463A
Other languages
English (en)
Chinese (zh)
Other versions
TW200916595A (en
Inventor
權真煥
宋校俊
趙成在
朴基柱
李炫基
睦鎮一
Original Assignee
圓益Ｉｐｓ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 圓益Ｉｐｓ股份有限公司 filed Critical 圓益Ｉｐｓ股份有限公司
Publication of TW200916595A publication Critical patent/TW200916595A/zh
Application granted granted Critical
Publication of TWI443208B publication Critical patent/TWI443208B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Transmission Devices (AREA)
TW097120463A 2007-06-27 2008-06-02 蒸發裝置 TWI443208B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070063711A KR100977971B1 (ko) 2007-06-27 2007-06-27 증착 장치

Publications (2)

Publication Number Publication Date
TW200916595A TW200916595A (en) 2009-04-16
TWI443208B true TWI443208B (zh) 2014-07-01

Family

ID=40186136

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097120463A TWI443208B (zh) 2007-06-27 2008-06-02 蒸發裝置

Country Status (5)

Country Link
JP (1) JP2010531391A (ko)
KR (1) KR100977971B1 (ko)
CN (1) CN101743617B (ko)
TW (1) TWI443208B (ko)
WO (1) WO2009002019A2 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101876058B (zh) * 2010-03-23 2012-07-11 东莞宏威数码机械有限公司 真空蒸镀装置
CN103540898B (zh) 2013-10-30 2015-07-01 京东方科技集团股份有限公司 一种真空蒸镀装置
KR101609185B1 (ko) * 2013-12-13 2016-04-05 주식회사 선익시스템 증발원 이송유닛, 증착 장치 및 증착 방법
CN105695939B (zh) * 2016-04-26 2018-09-14 京东方科技集团股份有限公司 线性蒸发源、蒸镀装置及方法
CN111041441B (zh) * 2019-12-28 2021-04-13 中国科学院长春光学精密机械与物理研究所 一种均匀镀膜方法、镀膜设备及计算机可读存储介质
CN116200709A (zh) * 2022-12-30 2023-06-02 浙江昌丽木作家居有限公司 一种木材表面包覆铝合金装饰膜的设备及其工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742582B2 (ja) * 1993-01-26 1995-05-10 クリーンサアフェイス技術株式会社 スパッター装置
JPH0659464U (ja) * 1993-01-29 1994-08-19 日新電機株式会社 成膜装置
TW490714B (en) * 1999-12-27 2002-06-11 Semiconductor Energy Lab Film formation apparatus and method for forming a film
JP3877613B2 (ja) * 2002-03-05 2007-02-07 三洋電機株式会社 有機エレクトロルミネッセンス表示装置の製造方法
US20030221620A1 (en) * 2002-06-03 2003-12-04 Semiconductor Energy Laboratory Co., Ltd. Vapor deposition device
JP4286496B2 (ja) * 2002-07-04 2009-07-01 株式会社半導体エネルギー研究所 蒸着装置及び薄膜作製方法
US20040040504A1 (en) * 2002-08-01 2004-03-04 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
JP4251857B2 (ja) * 2002-11-27 2009-04-08 株式会社アルバック 真空成膜装置及び真空成膜方法
JP4015064B2 (ja) * 2003-05-28 2007-11-28 トッキ株式会社 蒸着装置

Also Published As

Publication number Publication date
JP2010531391A (ja) 2010-09-24
KR100977971B1 (ko) 2010-08-24
CN101743617A (zh) 2010-06-16
TW200916595A (en) 2009-04-16
CN101743617B (zh) 2012-05-23
KR20080114299A (ko) 2008-12-31
WO2009002019A2 (en) 2008-12-31
WO2009002019A3 (en) 2009-02-19

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