TWI446426B - 紫外線照射方法及使用該方法之裝置 - Google Patents

紫外線照射方法及使用該方法之裝置 Download PDF

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Publication number
TWI446426B
TWI446426B TW097138487A TW97138487A TWI446426B TW I446426 B TWI446426 B TW I446426B TW 097138487 A TW097138487 A TW 097138487A TW 97138487 A TW97138487 A TW 97138487A TW I446426 B TWI446426 B TW I446426B
Authority
TW
Taiwan
Prior art keywords
ultraviolet
wafer
protective tape
edge
ultraviolet rays
Prior art date
Application number
TW097138487A
Other languages
English (en)
Chinese (zh)
Other versions
TW200933720A (en
Inventor
山本雅之
長谷幸敏
松下孝夫
金島安治
Original Assignee
日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工股份有限公司 filed Critical 日東電工股份有限公司
Publication of TW200933720A publication Critical patent/TW200933720A/zh
Application granted granted Critical
Publication of TWI446426B publication Critical patent/TWI446426B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW097138487A 2007-10-10 2008-10-07 紫外線照射方法及使用該方法之裝置 TWI446426B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007264675A JP4851415B2 (ja) 2007-10-10 2007-10-10 紫外線照射方法およびこれを用いた装置

Publications (2)

Publication Number Publication Date
TW200933720A TW200933720A (en) 2009-08-01
TWI446426B true TWI446426B (zh) 2014-07-21

Family

ID=40533038

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097138487A TWI446426B (zh) 2007-10-10 2008-10-07 紫外線照射方法及使用該方法之裝置

Country Status (5)

Country Link
US (1) US20090095418A1 (ja)
JP (1) JP4851415B2 (ja)
KR (1) KR101441692B1 (ja)
CN (1) CN101409225B (ja)
TW (1) TWI446426B (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010274429A (ja) * 2009-05-26 2010-12-09 Ihi Corp アライメントステージ
JP5412214B2 (ja) * 2009-08-31 2014-02-12 日東電工株式会社 保護テープ剥離方法およびその装置
JP5052582B2 (ja) * 2009-10-20 2012-10-17 志聖工業股▲ふん▼有限公司 ウエハラミネーターリリースフィルム保護機構
JP2011108978A (ja) * 2009-11-20 2011-06-02 Ushio Inc 光照射装置
JP5723612B2 (ja) * 2011-01-28 2015-05-27 リンテック株式会社 板状部材の支持装置
KR102017086B1 (ko) * 2012-07-27 2019-09-03 삼성디스플레이 주식회사 도너 기판 및 도너 기판을 이용한 유기 발광 표시 장치의 제조 방법
CN102788322A (zh) * 2012-08-03 2012-11-21 无锡爱沃富光电科技有限公司 Uv灯固定工装
DE102014111744B4 (de) * 2014-08-18 2022-01-05 Infineon Technologies Ag Baugruppe zum handhaben eines halbleiterchips und verfahren zum handhaben eines halbleiterchips
SG11201704977WA (en) * 2015-01-14 2017-07-28 Ev Group E Thallner Gmbh Method and device for detaching a substrate from a substrate stack
KR101827479B1 (ko) * 2016-08-09 2018-02-12 삼일테크(주) 칩 분리장치
US10693070B2 (en) * 2017-08-08 2020-06-23 Sharp Kabushiki Kaisha Manufacturing method for electroluminescence device
CN107576681A (zh) * 2017-09-11 2018-01-12 江苏天瑞仪器股份有限公司 一种用于具有多准直器设备的遮光部件
KR102516339B1 (ko) * 2018-04-06 2023-03-31 삼성전자주식회사 광 조사기용 덮개 구조물과 이를 구비하는 광 조사장치 및 이를 이용한 다이 접착 방법
CN111380331A (zh) * 2018-12-29 2020-07-07 中国科学院微电子研究所 一种微波干燥装置
JP7618158B2 (ja) 2020-08-07 2025-01-21 株式会社荏原製作所 テープ貼り付けシステム、テープ貼り付け方法、テープ剥がしシステム、およびテープ剥がし方法
JP7584259B2 (ja) * 2020-09-07 2024-11-15 株式会社ディスコ 紫外線照射装置
KR102258149B1 (ko) * 2020-11-06 2021-05-28 (주) 신신사 자외선 조사기에 의한 보호비닐 탈착시스템
CN113960888A (zh) * 2021-09-16 2022-01-21 江苏星浪光学仪器有限公司 一种用于滤波片的镀膜光刻方法
JP7700072B2 (ja) 2022-03-21 2025-06-30 株式会社東芝 半導体製造装置及び半導体装置の製造方法
JP2023170500A (ja) * 2022-05-19 2023-12-01 リンテック株式会社 電磁波照射装置および電磁波照射方法
JP2024136709A (ja) * 2023-03-24 2024-10-04 株式会社東芝 ヒートスタンプ及びヒートスタンプを用いた保護テープの剥離方法

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Publication number Priority date Publication date Assignee Title
JPH0562950A (ja) * 1991-08-29 1993-03-12 Nitto Denko Corp 半導体ウエハへの保護テープ貼り付けおよび剥離方法
JPH05136248A (ja) * 1991-11-15 1993-06-01 Hitachi Ltd 粘着テープの粘着力制御方法および装置
KR100267155B1 (ko) * 1996-09-13 2000-10-16 아끼구사 나오유끼 반도체 장치의 제조 방법 및 제조 장치
JPH10233372A (ja) * 1997-02-19 1998-09-02 Nitto Denko Corp 紫外線照射装置
KR101121495B1 (ko) * 2003-05-12 2012-03-15 가부시키가이샤 토쿄 세이미쯔 판상부재의 분할방법 및 분할장치
JP4592270B2 (ja) * 2003-10-06 2010-12-01 日東電工株式会社 半導体ウエハの支持材からの剥離方法およびこれを用いた装置
JP2005322683A (ja) * 2004-05-06 2005-11-17 Dainippon Printing Co Ltd シート付ウエハの製造方法および製造装置
JP4566195B2 (ja) * 2004-07-22 2010-10-20 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2006237504A (ja) * 2005-02-28 2006-09-07 Sanyo Electric Co Ltd 半導体チップ剥離装置およびそれを用いた半導体装置の製造方法
JP2009275060A (ja) * 2008-05-12 2009-11-26 Nitto Denko Corp 粘着シート、その粘着シートを使用した被着体の加工方法、及び粘着シート剥離装置

Also Published As

Publication number Publication date
KR20090037323A (ko) 2009-04-15
KR101441692B1 (ko) 2014-09-17
JP4851415B2 (ja) 2012-01-11
CN101409225A (zh) 2009-04-15
CN101409225B (zh) 2011-11-23
TW200933720A (en) 2009-08-01
US20090095418A1 (en) 2009-04-16
JP2009094355A (ja) 2009-04-30

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