TWI688672B - 無氰基無電解鍍金浴及無電解鍍金方法 - Google Patents

無氰基無電解鍍金浴及無電解鍍金方法 Download PDF

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Publication number
TWI688672B
TWI688672B TW105119314A TW105119314A TWI688672B TW I688672 B TWI688672 B TW I688672B TW 105119314 A TW105119314 A TW 105119314A TW 105119314 A TW105119314 A TW 105119314A TW I688672 B TWI688672 B TW I688672B
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TW
Taiwan
Prior art keywords
gold plating
electroless gold
electroless
plating
acid
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Application number
TW105119314A
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English (en)
Chinese (zh)
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TW201715081A (zh
Inventor
柴田利明
田中小百合
小田幸典
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日商上村工業股份有限公司
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Publication of TW201715081A publication Critical patent/TW201715081A/zh
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Publication of TWI688672B publication Critical patent/TWI688672B/zh

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1637Composition of the substrate metallic substrate

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
TW105119314A 2015-07-28 2016-06-20 無氰基無電解鍍金浴及無電解鍍金方法 TWI688672B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-148523 2015-07-28
JP2015148523A JP6594077B2 (ja) 2015-07-28 2015-07-28 ノンシアン無電解金めっき浴および無電解金めっき方法

Publications (2)

Publication Number Publication Date
TW201715081A TW201715081A (zh) 2017-05-01
TWI688672B true TWI688672B (zh) 2020-03-21

Family

ID=57945556

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105119314A TWI688672B (zh) 2015-07-28 2016-06-20 無氰基無電解鍍金浴及無電解鍍金方法

Country Status (4)

Country Link
JP (1) JP6594077B2 (ja)
KR (1) KR102502530B1 (ja)
CN (1) CN106399983B (ja)
TW (1) TWI688672B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2834877T3 (es) * 2018-01-26 2021-06-21 Atotech Deutschland Gmbh Baño de enchapado en oro electrolítico
US11492706B2 (en) 2018-02-20 2022-11-08 C. Uyemura & Co., Ltd. Electroless palladium plating solution and palladium film
JP7219120B2 (ja) * 2019-03-04 2023-02-07 Eeja株式会社 電解金めっき液及びその製造方法、並びに金めっき方法及び金錯体
JP7228411B2 (ja) * 2019-03-06 2023-02-24 上村工業株式会社 無電解金めっき浴
CN111763934A (zh) * 2020-06-01 2020-10-13 东莞市斯坦得电子材料有限公司 一种用于印制线路板的无氰化学镀厚金工艺
JP6945050B1 (ja) * 2020-12-01 2021-10-06 日本エレクトロプレイテイング・エンジニヤース株式会社 非シアン系の置換金めっき液及び置換金めっき方法
JP7685416B2 (ja) * 2021-10-13 2025-05-29 上村工業株式会社 無電解金めっき浴
CN114737060B (zh) * 2022-05-02 2024-01-12 湖南金瑞新能源科技有限公司 一种废弃锂电池正极材料的回收方法
CN115558912A (zh) * 2022-11-08 2023-01-03 深圳创智芯联科技股份有限公司 环保化学还原金液及其工艺
KR20260019128A (ko) 2024-08-01 2026-02-10 남가영 자동 지문 지우개가 달린 디지털도어락

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101634021A (zh) * 2008-07-24 2010-01-27 罗门哈斯电子材料有限公司 无电镀金液
TW201418519A (zh) * 2012-07-13 2014-05-16 Kanto Gakuin School Corp 非氰鍍金浴及非氰鍍金浴之製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE793128A (fr) 1971-12-24 1973-04-16 Kraftwerk Union Ag Procede et dispositif de detente, degazage et desactivation de condensats dans les centrales a vapeur, notamment dans les centrales nucleaire
JPH02232378A (ja) * 1989-03-06 1990-09-14 Hitachi Ltd 金めっき液
JP3146757B2 (ja) * 1993-05-26 2001-03-19 日立化成工業株式会社 置換金めっき液
JP5526440B2 (ja) * 2007-01-17 2014-06-18 奥野製薬工業株式会社 パラジウム皮膜用還元析出型無電解金めっき液を用いて形成されたプリント配線板
JP4932542B2 (ja) * 2007-03-05 2012-05-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 無電解金めっき液
JP5013077B2 (ja) * 2007-04-16 2012-08-29 上村工業株式会社 無電解金めっき方法及び電子部品
JP5371465B2 (ja) 2009-02-09 2013-12-18 メタローテクノロジーズジャパン株式会社 非シアン無電解金めっき液及び導体パターンのめっき方法
JP4873196B2 (ja) * 2009-04-21 2012-02-08 上村工業株式会社 無電解金めっき浴
JP5526272B1 (ja) * 2013-09-24 2014-06-18 小島化学薬品株式会社 有機金化合物、その製造方法及び導電性ペースト

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101634021A (zh) * 2008-07-24 2010-01-27 罗门哈斯电子材料有限公司 无电镀金液
TW201418519A (zh) * 2012-07-13 2014-05-16 Kanto Gakuin School Corp 非氰鍍金浴及非氰鍍金浴之製造方法

Also Published As

Publication number Publication date
KR102502530B1 (ko) 2023-02-21
CN106399983A (zh) 2017-02-15
KR20170013814A (ko) 2017-02-07
JP2017025399A (ja) 2017-02-02
JP6594077B2 (ja) 2019-10-23
TW201715081A (zh) 2017-05-01
CN106399983B (zh) 2020-07-21

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