TWI720190B - 電子零件的加工方法 - Google Patents

電子零件的加工方法 Download PDF

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Publication number
TWI720190B
TWI720190B TW106114301A TW106114301A TWI720190B TW I720190 B TWI720190 B TW I720190B TW 106114301 A TW106114301 A TW 106114301A TW 106114301 A TW106114301 A TW 106114301A TW I720190 B TWI720190 B TW I720190B
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TW
Taiwan
Prior art keywords
layer
resin film
resin
parts
item
Prior art date
Application number
TW106114301A
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English (en)
Chinese (zh)
Other versions
TW201806768A (zh
Inventor
上野恵子
徳安孝寛
大山恭之
山口雄志
池谷卓二
松永昌大
Original Assignee
日商昭和電工材料股份有限公司
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Publication of TW201806768A publication Critical patent/TW201806768A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW106114301A 2016-05-02 2017-04-28 電子零件的加工方法 TWI720190B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016092662 2016-05-02
JP2016-092662 2016-05-02

Publications (2)

Publication Number Publication Date
TW201806768A TW201806768A (zh) 2018-03-01
TWI720190B true TWI720190B (zh) 2021-03-01

Family

ID=60202972

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106114301A TWI720190B (zh) 2016-05-02 2017-04-28 電子零件的加工方法

Country Status (4)

Country Link
JP (2) JP6926070B2 (ja)
KR (1) KR102239644B1 (ja)
TW (1) TWI720190B (ja)
WO (1) WO2017191815A1 (ja)

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JP6927866B2 (ja) * 2017-11-30 2021-09-01 日本カーバイド工業株式会社 保護フィルム用粘着剤組成物及び保護フィルム
JP7147163B2 (ja) * 2017-12-21 2022-10-05 昭和電工マテリアルズ株式会社 仮固定用樹脂フィルム、仮固定用樹脂フィルムシート、及び半導体装置の製造方法
CN113195668B (zh) * 2018-12-20 2023-01-13 昭和电工材料株式会社 临时固定用树脂组合物、临时固定用树脂膜及临时固定用片、以及半导体装置的制造方法
JP7221046B2 (ja) * 2018-12-26 2023-02-13 東京応化工業株式会社 接着剤組成物、積層体、積層体の製造方法、及び電子部品の製造方法
US11767453B2 (en) 2018-12-31 2023-09-26 Samsung Sdi Co., Ltd. Silicone-based adhesive protective film and optical member comprising the same
JP7454922B2 (ja) * 2019-07-11 2024-03-25 信越化学工業株式会社 基板加工用仮接着材料及び積層体の製造方法
KR102662018B1 (ko) * 2019-10-31 2024-04-30 가부시끼가이샤 레조낙 가고정용 수지 조성물, 기판 반송용 서포트 테이프 및 전자 기기 장치의 제조 방법
JP7409029B2 (ja) 2019-11-15 2024-01-09 株式会社レゾナック 半導体装置の製造方法、並びにダイシング・ダイボンディング一体型フィルム及びその製造方法
CN114868232A (zh) * 2019-12-02 2022-08-05 信越化学工业株式会社 晶片加工用临时粘接剂、晶片层叠体及薄型晶片的制造方法
JP2021129061A (ja) * 2020-02-17 2021-09-02 力成科技股▲分▼有限公司 半導体製造装置および製造方法
KR20230005219A (ko) * 2020-04-30 2023-01-09 신에쓰 가가꾸 고교 가부시끼가이샤 웨이퍼 가공용 가접착제, 웨이퍼 적층체 및 박형 웨이퍼의 제조 방법
JP7771556B2 (ja) * 2021-08-05 2025-11-18 三菱ケミカル株式会社 フィルム、離型フィルム付きフィルム、振動板、積層体、成形品及び音響変換器
JP7746741B2 (ja) * 2021-08-30 2025-10-01 日本ゼオン株式会社 複合ガラスシート及びその製造方法、並びに複合保護フィルム積層体
JP2023101236A (ja) * 2022-01-07 2023-07-20 株式会社レゾナック 仮固定材形成用樹脂組成物、仮固定材、基板搬送用サポートテープ及び電子機器装置の製造方法
EP4535403A4 (en) * 2022-06-02 2026-05-06 Nissan Chemical Corp Photoradiation-releasable adhesive composition, laminate, and method for producing processed semiconductor substrate
WO2026058939A1 (ja) * 2024-09-13 2026-03-19 株式会社レゾナック フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法

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JP2015135898A (ja) * 2014-01-17 2015-07-27 日立化成株式会社 研削された基材の製造方法、並びにこれに用いられるフィルム状粘着剤及び積層体

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JP2005019759A (ja) * 2003-06-27 2005-01-20 Mitsui Chemicals Inc 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウェハ保護方法
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CN105849215B (zh) * 2013-12-26 2019-09-03 日立化成株式会社 临时固定用膜、临时固定用膜片材及半导体装置
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JP2015135898A (ja) * 2014-01-17 2015-07-27 日立化成株式会社 研削された基材の製造方法、並びにこれに用いられるフィルム状粘着剤及び積層体

Also Published As

Publication number Publication date
JP6926070B2 (ja) 2021-08-25
JP6958674B2 (ja) 2021-11-02
JP2020161823A (ja) 2020-10-01
JPWO2017191815A1 (ja) 2018-11-08
TW201806768A (zh) 2018-03-01
KR102239644B1 (ko) 2021-04-12
WO2017191815A1 (ja) 2017-11-09
KR20180122460A (ko) 2018-11-12

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