TWI841705B - 黏著薄片及半導體裝置之製造方法 - Google Patents

黏著薄片及半導體裝置之製造方法 Download PDF

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Publication number
TWI841705B
TWI841705B TW109108485A TW109108485A TWI841705B TW I841705 B TWI841705 B TW I841705B TW 109108485 A TW109108485 A TW 109108485A TW 109108485 A TW109108485 A TW 109108485A TW I841705 B TWI841705 B TW I841705B
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TW
Taiwan
Prior art keywords
adhesive
adhesive layer
layer
adhesive sheet
mass
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TW109108485A
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English (en)
Chinese (zh)
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TW202045657A (zh
Inventor
垣內康彦
阿久津高志
高岡慎弥
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日商琳得科股份有限公司
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Publication of TW202045657A publication Critical patent/TW202045657A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
TW109108485A 2019-03-15 2020-03-13 黏著薄片及半導體裝置之製造方法 TWI841705B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-048674 2019-03-15
JP2019048674 2019-03-15

Publications (2)

Publication Number Publication Date
TW202045657A TW202045657A (zh) 2020-12-16
TWI841705B true TWI841705B (zh) 2024-05-11

Family

ID=72519350

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109108485A TWI841705B (zh) 2019-03-15 2020-03-13 黏著薄片及半導體裝置之製造方法

Country Status (5)

Country Link
JP (1) JP7530347B2 (ja)
KR (1) KR102825411B1 (ja)
CN (1) CN113613893B (ja)
TW (1) TWI841705B (ja)
WO (1) WO2020189568A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI864183B (zh) * 2019-12-11 2024-12-01 日商琳得科股份有限公司 黏著薄片及半導體裝置之製造方法
WO2022069164A1 (en) * 2020-09-30 2022-04-07 Basf Se De-bondable polyurethane adhesives based on thermally expandable microspheres
WO2022186158A1 (ja) * 2021-03-04 2022-09-09 デンカ株式会社 粘着テープ、半導体ウエハ加工用テープ
KR20240057380A (ko) * 2021-09-06 2024-05-02 세키스이가가쿠 고교가부시키가이샤 반도체 장치 제조용 점착 테이프
CN114561166A (zh) * 2022-03-31 2022-05-31 杭州福斯特应用材料股份有限公司 一种封装胶膜

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1930262A (zh) * 2004-03-11 2007-03-14 日东电工株式会社 加热剥离型粘合片和利用该加热剥离型粘合片的粘附体的加工方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3594853B2 (ja) * 1999-11-08 2004-12-02 日東電工株式会社 加熱剥離型粘着シート
JP4877689B2 (ja) * 2001-08-30 2012-02-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP2003077940A (ja) * 2001-09-06 2003-03-14 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
CN100377182C (zh) * 2002-06-03 2008-03-26 株式会社理光 热可逆记录介质、热可逆记录标签、热可逆记录构件、图像处理装置及图像处理方法
JP2009035635A (ja) * 2007-08-01 2009-02-19 Nitto Denko Corp 非汚染性熱剥離型粘着シート
JP2010053346A (ja) * 2008-07-31 2010-03-11 Nitto Denko Corp 再剥離型粘着剤及び再剥離型粘着シート
EP2733728A1 (en) * 2011-07-15 2014-05-21 Nitto Denko Corporation Method for manufacturing electronic component and adhesive sheet used in method for manufacturing electronic component
JP6000595B2 (ja) * 2012-03-27 2016-09-28 日東電工株式会社 電子部品切断用加熱剥離型粘着シート及び電子部品加工方法
JP6106332B2 (ja) * 2014-03-31 2017-03-29 三井化学東セロ株式会社 保護フィルム、及び、該保護フィルムを用いる半導体装置の製造方法
TW201704395A (zh) * 2015-02-24 2017-02-01 琳得科股份有限公司 薄膜狀接著劑、接著板片以及半導體裝置之製造方法
SG11201707264VA (en) * 2015-03-12 2017-10-30 Lintec Corp Film for forming protection film
TWI717381B (zh) 2015-09-01 2021-02-01 日商琳得科股份有限公司 黏著劑組成物及黏著薄片
KR102543780B1 (ko) * 2016-03-03 2023-06-14 린텍 가부시키가이샤 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법
CN110461974B (zh) * 2017-03-31 2022-01-18 琳得科株式会社 粘合片
JP6764526B2 (ja) 2017-03-31 2020-09-30 リンテック株式会社 粘着シート
JP6887313B2 (ja) * 2017-05-31 2021-06-16 株式会社ディスコ ウェーハの加工方法
WO2019031533A1 (ja) 2017-08-09 2019-02-14 リンテック株式会社 加工検査対象物の加熱剥離方法
WO2019112033A1 (ja) 2017-12-07 2019-06-13 リンテック株式会社 粘着性積層体、粘着性積層体の使用方法、及び半導体装置の製造方法
JP7273792B2 (ja) 2018-03-20 2023-05-15 リンテック株式会社 加工品の製造方法及び粘着性積層体
WO2019187247A1 (ja) 2018-03-30 2019-10-03 リンテック株式会社 硬化封止体の反り防止用積層体、及び、硬化封止体の製造方法
JP7129110B2 (ja) 2018-10-02 2022-09-01 リンテック株式会社 積層体及び硬化封止体の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1930262A (zh) * 2004-03-11 2007-03-14 日东电工株式会社 加热剥离型粘合片和利用该加热剥离型粘合片的粘附体的加工方法

Also Published As

Publication number Publication date
JP7530347B2 (ja) 2024-08-07
KR20210141929A (ko) 2021-11-23
WO2020189568A1 (ja) 2020-09-24
JPWO2020189568A1 (ja) 2020-09-24
KR102825411B1 (ko) 2025-06-27
CN113613893A (zh) 2021-11-05
TW202045657A (zh) 2020-12-16
CN113613893B (zh) 2023-11-21

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