TWI902881B - 薄膜 - Google Patents

薄膜

Info

Publication number
TWI902881B
TWI902881B TW110132189A TW110132189A TWI902881B TW I902881 B TWI902881 B TW I902881B TW 110132189 A TW110132189 A TW 110132189A TW 110132189 A TW110132189 A TW 110132189A TW I902881 B TWI902881 B TW I902881B
Authority
TW
Taiwan
Prior art keywords
film
polymer
less
polyimide resin
mass
Prior art date
Application number
TW110132189A
Other languages
English (en)
Chinese (zh)
Other versions
TW202219176A (zh
Inventor
小沼勇輔
西岡宏司
Original Assignee
日商住友化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友化學股份有限公司 filed Critical 日商住友化學股份有限公司
Publication of TW202219176A publication Critical patent/TW202219176A/zh
Application granted granted Critical
Publication of TWI902881B publication Critical patent/TWI902881B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F32/00Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F32/08Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having two condensed rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/02Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/09Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/12Powdering or granulating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/20Compounding polymers with additives, e.g. colouring
    • C08J3/205Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase
    • C08J3/21Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • C08L101/12Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW110132189A 2020-08-31 2021-08-31 薄膜 TWI902881B (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2020146415 2020-08-31
JP2020-146414 2020-08-31
JP2020-146413 2020-08-31
JP2020-146415 2020-08-31
JP2020146414 2020-08-31
JP2020146413 2020-08-31
JP2020196125 2020-11-26
JP2020-196125 2020-11-26

Publications (2)

Publication Number Publication Date
TW202219176A TW202219176A (zh) 2022-05-16
TWI902881B true TWI902881B (zh) 2025-11-01

Family

ID=80353556

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110132189A TWI902881B (zh) 2020-08-31 2021-08-31 薄膜

Country Status (5)

Country Link
JP (1) JP7732807B2 (ja)
KR (1) KR20230059170A (ja)
CN (1) CN115884996B (ja)
TW (1) TWI902881B (ja)
WO (1) WO2022045359A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012185393A (ja) * 2011-03-07 2012-09-27 Fuji Xerox Co Ltd 円筒状成形体及びその製造方法、円筒状成形体ユニット、画像形成装置用部材、並びに画像形成装置
JP2016183333A (ja) * 2015-03-26 2016-10-20 富士ゼロックス株式会社 樹脂粒子分散ポリイミド前駆体溶液の製造方法、樹脂粒子分散ポリイミド前駆体溶液、樹脂粒子含有ポリイミドフィルム、多孔質ポリイミドフィルムの製造方法、及び多孔質ポリイミドフィルム

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3498750B2 (ja) * 1992-11-20 2004-02-16 日本ゼオン株式会社 熱硬化性樹脂成形材料、成形品、及び熱可塑性ノルボルネン系樹脂粒子
JP3499974B2 (ja) * 1995-06-07 2004-02-23 富士写真フイルム株式会社 偏光膜保護フイルム
JP3470578B2 (ja) * 1997-01-14 2003-11-25 住友化学工業株式会社 オレフィン(共)重合体の製造方法
JPH10279630A (ja) * 1997-04-04 1998-10-20 Sumitomo Chem Co Ltd オレフィン系重合体の製造方法
JP2001049126A (ja) 1999-05-28 2001-02-20 Hitachi Chem Co Ltd 樹脂組成物
JP3940119B2 (ja) * 2002-12-27 2007-07-04 株式会社アイ.エス.テイ ポリイミド前駆体液組成物及びポリイミド被膜
JP2008248067A (ja) * 2007-03-30 2008-10-16 Du Pont Toray Co Ltd ポリイミドフィルムおよびフレキシブル回路基板
TWI354807B (en) 2007-06-12 2011-12-21 Eternal Chemical Co Ltd Optical film
JP2010195891A (ja) 2009-02-24 2010-09-09 Sanyo Chem Ind Ltd 多層構造球状粒子
JP5936437B2 (ja) * 2011-06-13 2016-06-22 ポリプラスチックス株式会社 環状オレフィン系樹脂
EP2551865A3 (en) * 2011-07-29 2016-05-25 Konica Minolta Business Technologies, Inc. Photoelectric conversion element and solar cell
JP5860240B2 (ja) * 2011-08-02 2016-02-16 日東電工株式会社 樹脂部材の接合方法
JP5985940B2 (ja) 2012-09-18 2016-09-06 東レ・デュポン株式会社 タブレット端末向けcof用基板
JP6404028B2 (ja) 2013-08-08 2018-10-10 東京応化工業株式会社 多孔質ポリイミド膜の製造方法、セパレータの製造方法、及びワニス
JP6829029B2 (ja) * 2016-08-31 2021-02-10 三井化学株式会社 硬化性樹脂組成物、硬化物、ドライフィルム、フィルム、プリプレグ、金属張積層板、プリント配線基板および電子機器
JP6899636B2 (ja) 2016-08-31 2021-07-07 三井化学株式会社 低誘電性樹脂組成物、硬化物、ドライフィルム、フィルム、プリプレグ、金属張積層板、プリント配線基板および電子機器
JP2018041074A (ja) 2016-09-02 2018-03-15 住友ベークライト株式会社 感光性樹脂組成物、感光性樹脂膜、および電子装置
JP2018185471A (ja) * 2017-04-27 2018-11-22 キヤノン株式会社 トナー
JP7717438B2 (ja) 2019-01-16 2025-08-04 旭化成株式会社 ポリイミドワニス及びポリイミドフィルム、並びにこれらの製造方法
JP7439534B2 (ja) * 2020-01-28 2024-02-28 富士フイルムビジネスイノベーション株式会社 ポリイミド前駆体溶液及び多孔質ポリイミドフィルムの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012185393A (ja) * 2011-03-07 2012-09-27 Fuji Xerox Co Ltd 円筒状成形体及びその製造方法、円筒状成形体ユニット、画像形成装置用部材、並びに画像形成装置
JP2016183333A (ja) * 2015-03-26 2016-10-20 富士ゼロックス株式会社 樹脂粒子分散ポリイミド前駆体溶液の製造方法、樹脂粒子分散ポリイミド前駆体溶液、樹脂粒子含有ポリイミドフィルム、多孔質ポリイミドフィルムの製造方法、及び多孔質ポリイミドフィルム

Also Published As

Publication number Publication date
CN115884996B (zh) 2024-08-23
WO2022045359A1 (ja) 2022-03-03
JP2022041944A (ja) 2022-03-11
JP7732807B2 (ja) 2025-09-02
CN115884996A (zh) 2023-03-31
KR20230059170A (ko) 2023-05-03
TW202219176A (zh) 2022-05-16

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