US20040007252A1 - Label sheet for cleaning and conveying member having cleaning function - Google Patents

Label sheet for cleaning and conveying member having cleaning function Download PDF

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Publication number
US20040007252A1
US20040007252A1 US10/297,184 US29718402A US2004007252A1 US 20040007252 A1 US20040007252 A1 US 20040007252A1 US 29718402 A US29718402 A US 29718402A US 2004007252 A1 US2004007252 A1 US 2004007252A1
Authority
US
United States
Prior art keywords
cleaning
label
sheet
layer
conveying member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/297,184
Other languages
English (en)
Inventor
Makoto Namikawa
Yoshio Terada
Jirou Nukaga
Eiji Toyoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001109405A external-priority patent/JP3981243B2/ja
Priority claimed from JP2001111791A external-priority patent/JP4173649B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Assigned to NITTO DENKO CORPORATION reassignment NITTO DENKO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAMIKAWA, MAKOTO, NUKAGA, JIROU, TERADA, YOSHIO, TOYODA, EIJI
Publication of US20040007252A1 publication Critical patent/US20040007252A1/en
Priority to US13/117,842 priority Critical patent/US20110229675A1/en
Priority to US13/117,707 priority patent/US20110229697A1/en
Priority to US14/319,416 priority patent/US20140311525A1/en
Priority to US14/319,411 priority patent/US9131829B2/en
Abandoned legal-status Critical Current

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Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
    • A47L25/00—Domestic cleaning devices not provided for in other groups of this subclass 
    • A47L25/005—Domestic cleaning devices not provided for in other groups of this subclass  using adhesive or tacky surfaces to remove dirt, e.g. lint removers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/40—Specific cleaning or washing processes
    • C11D2111/42—Application of foam or a temporary coating on the surface to be cleaned
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1471—Protective layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/149—Sectional layer removable
    • Y10T428/1495—Adhesive is on removable layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24752—Laterally noncoextensive components

Definitions

  • the present invention relates to a label sheet for cleaning various equipments, and a label sheet for cleaning and a conveying member having a cleaning function for a substrate processing equipment which hates foreign matters, for example, a manufacturing equipment or a checking equipment for a semiconductor, a flat panel display or a printed board.
  • the method of removing foreign matters by conveying a plate-shaped member can carry out the conveyance without a hindrance but has a deterioration in a dust cleaning property which is important.
  • a cutting step is further required and a cut refuse generated by the cutting might stick to the substrate or an equipment.
  • a method of manufacturing the conveying member having a cleaning function moreover, there has been known a method of bonding a larger cleaning sheet than the conveying member and then cutting the cleaning sheet along the shape of the member when bonding a cleaning sheet to a conveying member such as a substrate to manufacture the conveying member for cleaning, for example (which will be hereinafter referred to as a direct cutting method).
  • a cut refuse might be generated from a cleaning layer and might stick to the cleaning member or an equipment during sheet cutting.
  • a method of bonding a label sheet for cleaning previously punched to have the shape of the conveying member to the conveying member, thereby manufacturing the conveying member for cleaning (which will be hereinafter referred to as a precutting method)
  • the generation of the cut refuse during the sheet punching is more reduced than that in the direct cutting method.
  • an adhesive of the cleaning layer might leak out of a punched surface during the sheet punching and might stick to an end of the label so that appearance is deteriorated due to defective punching or conveyance troubles are made.
  • the adhesive on the end of the label causes defective curing by polymerization inhibition due to oxygen inhibition if the curing is to be carried out after the sheet punching. Therefore, the contact portion of the substrate processing equipment might be contaminated by the adhesive.
  • the inventors made investigations earnestly. As a result, they found that when the cleaning sheet or the substrate having the sheet fastened thereto is conveyed to remove foreign matters sticking into the substrate processing equipment through cleaning, an adhesion is set to have a specific value or less with an active energy source as the cleaning layer and the cleaning sheet is set to have the label shape, resulting in removal in the foreign matters more easily and reliably without making the troubles described above. Thus, they have completed the invention.
  • a label sheet for cleaning which can reliably convey a substrate into a substrate processing equipment, can remove foreign matters sticking into the equipment easily and reliably, and furthermore, can enhance a working efficiency and can generate no cut refuse because sheet cutting is not required after bonding to the substrate.
  • the invention relates to a label sheet for cleaning wherein a label for cleaning including an ordinary adhesive layer on one of surfaces of a cleaning layer having a 180° peeling adhesion to a silicon wafer (mirror surface) of 0.20 N/10 mm or less after receiving an active energy is removably provided on a separator through the ordinary adhesive layer.
  • the label sheet also may be constituted such that the cleaning layer is provided on one of surfaces of a base material and an ordinary adhesive layer is provided on the other surface and the lable sheet is removably provided on a separator through the ordinary adhesive layer.
  • a plurality of labels for cleaning may be continuously provided on an elongated separator at regular intervals.
  • the invention also relates to a conveying member having a cleaning function comprising a label sheet for cleaning on the conveying member, wherein the label sheet for cleaning has a smaller shape than that of the conveying member and is not protruded from an end of the conveying member.
  • the label sheet for cleaning preferably has a cleaning layer provided on one of surfaces of a base material and an ordinary adhesive layer provided on the other surface.
  • the invention also relates to a method of manufacturing a label sheet for cleaning in which a cleaning layer formed of an adhesive is provided on one of surfaces of a base material with a surface thereof protected by a removing film and the other surface is removably provided on a separator through an ordinary adhesive layer, wherein the cleaning layer is a curing type adhesive which is polymerized and cured upon receipt of an active energy and the step of punching a sheet to have a shape of the label is carried out after a polymerization and curing reaction of the adhesive of the cleaning layer.
  • FIG. 1 is a partial plan view showing an example of a label sheet for cleaning according to the invention
  • FIG. 2 is a sectional view taken along a line II-II in FIG. 1;
  • FIG. 3 is a partial plan view showing anther example of the label sheet for cleaning according to the invention.
  • FIG. 4 is a partial plan view showing yet another example of the label sheet for cleaning according to the invention.
  • FIG. 5 is a partial plan view showing a further example of the label sheet for cleaning according to the invention.
  • FIG. 6 is a sectional view showing an example of a conveying member having a cleaning function according to the invention.
  • FIG. 7 is a partial plan view showing an example of the label sheet for cleaning according to the invention.
  • FIG. 8 is a sectional view taken along a line VIII-VIII in FIG. 7.
  • a cleaning layer (which will hereinafter include such a configuration as a single cleaning sheet, a laminated sheet or a laminated sheet with a base material) is cured by an active energy source, resulting in a reduction in an adhesion.
  • a 180° peeling adhesion to a silicon wafer (mirror surface) is 0.20 N/10 mm or less, and preferably approximately 0.010 to 0.10 N/10 mm.
  • the active energy source includes ultraviolet rays and heat to be used for the curing and the ultraviolet rays are preferable.
  • the thickness of the cleaning layer is not particularly restricted, it is usually set to be approximately 5 to 100 ⁇ m.
  • the cleaning layer should have a modulus of tensile elasticity (in accordance with a test method JIS K7127) of 0.98 N/mm 2 or more and preferably 9.8 to 980 N/mm 2 . If the modulus of tensile elasticity is set to have such a specific value or more, a substrate in a substrate processing equipment can be conveyed more reliably.
  • the cleaning layer should have a surface resistivity of 1 ⁇ 10 13 ⁇ / ⁇ or more and particularly 1 ⁇ 10 14 ⁇ / ⁇ or more. If the surface resistivity of the cleaning layer is set to such a specific value or more to maintain the cleaning layer to be an insulator as much as possible, it is possible to obtain the effect that foreign matters can be captured and adsorbed through static electricity in addition to the adhesion thereof. Accordingly, it is preferable that the cleaning layer should not include a conductive substance such as an additive having a conducting function.
  • a curing type adhesive which is polymerized and cured upon receipt of an active energy is preferably used. Consequently, tackiness of the cleaning layer is substantially eliminated so that the cleaning layer is not strongly bonded to the equipment contact portion when a conveying member having a cleaning function is to be conveyed. Thus, it is possible to provide the conveying member having a cleaning function which can be conveyed reliably.
  • the active energy source includes ultraviolet rays and heat and the ultraviolet rays are preferable.
  • the cleaning layer has such a property that it is cured by the active energy source to cause a molecular structure to have a three-dimensional network
  • a material thereof is not particularly restricted.
  • the cleaning layer should be formed of an adhesive layer obtained by a pressure-sensitive adhesive polymer containing a compound having one or more unsaturated double bonds in a molecule.
  • the pressure-sensitive adhesive polymer include an acryl based polymer containing, as a principal monomer, (metha)acrylic acid and/or (metha)acrylic ester selected from acrylic acid, acrylic ester, methacrylic acid and ester methacrylate.
  • a compound having two or more unsaturated double bonds in a molecule is used as a copolymerized monomer in the synthesis of the acryl based polymer or a compound having an unsaturated double bond in a molecule is chemically bonded to the acryl based polymer with a reaction between functional groups after the synthesis so that the unsaturated double bond is introduced into the molecule of the acryl based polymer. Consequently, a polymer itself can also be related to a polymerization and curing reaction with an active energy.
  • a compound having one or more unsaturated double bonds in a molecule (which will be hereinafter referred to as a polymerized and unsaturated compound) should be a low molecular weight compound which is nonvolatile and has a weight average molecular weight of 10000 or less, and particularly, should have a molecular weight of 5000 or less such that the three-dimensional network of an adhesive layer can be obtained efficiently during curing.
  • the polymerized and unsaturated compound should be a low molecular weight compound which is nonvolatile and has a weight average molecular weight of 10000 or less, and particularly, should have a molecular weight of 5000 or less such that the three-dimensional network of the cleaning layer can be obtained efficiently during curing.
  • Examples of such a polymerized compound include phenoxypolyethyleneglycol (metha)acrylate, ⁇ -caprolacton (metha) acrylate, polyethyleneglycol di(metha)acrylate, polypropyleneglycol di(metha)acrylate, trimethylolpropane tri(metha)acrylate, dipentaerythritolhexa (metha)acrylate, urethane (metha)acrylate, epoxy (metha) acrylate and oligoester (metha) acrylate, and one or more of them are used.
  • a polymerization initiator to be added to the adhesive layer is not particularly restricted and a well-known polymerization initiator can be used.
  • a thermal polymerization initiator such as benzoyl peroxide or azobisisobutylonitoryl is applied.
  • a photopolymerization initiator such as benzoyl, benzoyl ethylether, dibenzyl, isopropylbenzoyl ether, benzophenone, Michler's ketone chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, acetophenone diethylketal, benzyldimethylketal, ⁇ -hydroxycyclohyxyl phenylketone, 2-hydroxydimethyl phenylpropane or 2,2-dimethoxy-2-phenylacetophenone.
  • the base material is not particularly restricted, examples thereof include a plastic film such as polyethylene, polyethylene terephthalate, acetyl cellulose, polycarbonate, polypropylene or polyamide.
  • a thickness of the base material is usually set to approximately 10 to 100 ⁇ m.
  • the label sheet for cleaning according to the invention comprises a label for cleaning including the specific cleaning layer on one of surfaces of a base material and an ordinary adhesive layer on the other surface which is removably provided on a separator through the ordinary adhesive layer.
  • a material thereof is not particularly restricted and an ordinary adhesive (for example, an acryl based adhesive or a rubber based adhesive) can be used.
  • the label for cleaning is removed from a separator which will be described below, is bonded to a conveying member such as various substrates through the ordinary adhesive layer and is conveyed as a conveying member having a cleaning function into the equipment to come in contact with a portion to be washed.
  • the cleaning can be carried out.
  • conveying member to which the label for cleaning is to be bonded is not particularly restricted, examples of the conveying member include a substrate for a flat panel display such as a semiconductor wafer, an LCD or a PDP and a substrate such as a compact disk or an MR head.
  • the ordinary adhesive layer should have a 180° peeling adhesion for a silicon wafer (mirror surface) of approximately 0.01 to 0.98 N/10 mm, and particularly, approximately 0.01 to 0.5 N/10 mm, the substrate is not removed during the conveyance but can be easily removed again after the cleaning.
  • the separator according to the invention is not particularly restricted and examples thereof include polyolefin such as polyester, polypropylene, polybutene, polybutadiene or polymethyl pentene which is removed with a silicone based, long chain alkyl based, fluorine based, fatty acid amide based or silica based remover, and a plastic film formed of polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene terephthalate, polyurethane, ethylene-vinylacetate copolymer, ionomer resin, ethylene-(metha)acrylate copolymer, ethylene-(metha)acrylic ester compolyer, polystyrene or polycarbonate.
  • polyolefin such as polyester, polypropylene, polybutene, polybutadiene or polymethyl pentene which is removed with a silicone based, long chain alkyl based, fluorine based, fatty acid amide based or
  • FIG. 1 is a plan view showing an example of a label sheet for cleaning according to the invention in which a plurality of labels A for cleaning are continuously provided on an elongated separator 1 at regular intervals.
  • the label A includes a cleaning layer 3 on one of surfaces of a base material 2 and an ordinary adhesive layer 4 on the other surface as shown in FIG. 2 (a sectional view taken along a line II-II in FIG. 1) and is removaly provided on the separator 1 through the adhesive layer 4 .
  • the label for cleaning is removed from the separator 1 , is bonded to a conveying member such as a semiconductor wafer and is conveyed into an equipment. Consequently, a portion to be washed can be cleaned.
  • FIG. 3 is a plan view showing another example of the label sheet for cleaning according to the invention in which a reinforcing portion B is formed through a trench-shaped concave portion C over the whole periphery of the label A for cleaning. Since the reinforcing portion B is provided through the concave portion C, an excellent handling property can be obtained when the label sheet for cleaning is a roll-shaped substance or a sheet laminator and the label for cleaning can be smoothly removed from a separator during use so that an excellent labeling reliability can also be obtained.
  • the concave portions C are continuously provided each other because the unnecessary parts can be consecutively removed.
  • a part of the periphery of the label A is not the concave portion but may be only a nick portion such that the label A and the reinforcing portion B are provided partially in contact with each other.
  • the band-shaped reinforcing portion B can be continuously provided on both ends of the separator 1 , that is, both ends in a transverse direction.
  • the reinforcing portion B is formed linearly in parallel with the end of the separator. It is preferable that the reinforcing portion B and the label A on both sides or either side should be provided at regular intervals in a non-contact with each other because the unnecessary parts can be consecutively removed during the manufacture of the sheet. However, the reinforcing portion B and the label A on both sides can also be provided in contact with each other.
  • the reinforcing portion B on either side is formed to have a great width such that the reinforcing portion B comes in contact with a part of the outer periphery of the label A. Consequently, it is possible to further enhance the effect of reinforcing the end of the label sheet without damaging the continuous removal of the unnecessary part.
  • the shape of the reinforcing portion B is not particularly restricted but can be properly provided continuously or discontinuously, it is preferable that the reinforcing portion B should be provided continuously in respect of prevention of a refuse from entering through the end.
  • the thickness of the reinforcing portion B is not particularly restricted, it is preferable that the thickness should be almost equal to that of the label A in consideration of the roll-shaped or laminated label sheet.
  • the width of the reinforcing portion B is not particularly restricted and can be properly set in consideration of the width of the separator and the diameter of the label. If the width is set to be as great as possible, the reinforcing effect can be increased.
  • the shape of the label A is not particularly restricted and a circular shape, a wafer shape, a frame shape, and furthermore, a shape having a protruded part for a chuck portion can be taken depending on the shape of the conveying member such as a substrate to be bonded, for example.
  • a method of manufacturing the label sheet for cleaning according to the invention is not particularly restricted, for example, a laminator including a separator and an adhesive film is formed by a method of bonding an adhesive film constituting the label and the reinforcing portion (in which a cleaning layer is provided on one of surfaces of a base material and an ordinary adhesive layer is provided on the other surface) onto the separator.
  • the adhesive film of the laminator is punched to have the shape(s) of the label and/or the reinforcing portion simultaneously or separately so that an unnecessary adhesive film can be separated and removed from the separator.
  • the concave portion should be provided continuously because the unnecessary adhesive film can be removed consecutively.
  • the unnecessary adhesive film is usually wound onto an optional core to be roll-shaped.
  • the shape of a cleaning sheet should be smaller than that of the conveying member and the cleaning sheet is not protruded from the end of the conveying member. If the shape of the cleaning sheet is larger than that of the conveying member and is protruded from the conveying member, the cleaning sheet is caught in a conveying member accommodating cassette or a conveyance path so that it is turned over and shifted. In the worst case, there is a possibility that the conveyance might not be carried out. The label sheet might be caught in the conveying member accommodating cassette even if the shape of the cleaning sheet is the same as that of the conveying member.
  • the conveying member having a cleaning function can be conveyed reliably. While the degree of smallness is not particularly restricted, an effective area required for removing foreign matters is reduced if the cleaning sheet is too small. Therefore, a size of approximately 5 mm is practically required at a minimum.
  • a cleaning layer is provided on one of the surfaces of the base material and the surface of the cleaning layer is protected by a removing film if necessary, and an ordinary adhesive layer is provided on the other surface.
  • the cleaning sheet is provided on the conveying member through the ordinary adhesive layer.
  • the invention also provides a label sheet for cleaning which is to be used for the conveying member.
  • a label sheet for cleaning should have such a structure that a cleaning layer is provided on one of surfaces of a base material with a surface thereof protected by a removing film and the other surface is removably provided on a separator through an ordinary adhesive layer. Also in this case, a shape of the label is smaller than that of the conveying member. Moreover, it is preferable that a plurality of labels for cleaning should be continuously provided on an elongated separator at regular intervals.
  • a curing type adhesive for polymerizing and curing a cleaning layer upon receipt of an active energy should be used and the step of cutting the sheet to have the shape of the label should be carried out after the polymerization and curing reaction of the adhesive of the cleaning layer.
  • the adhesive constituting the cleaning layer is neither polymerized nor cured during the sheet cutting, an adhesive layer constituting the cleaning layer is protruded from a cut end and is bonded to a cut surface, the adhesive ropes, a cutting depth become nonuniform or a cut surface is roughened. In the worst case, defective cutting might be caused.
  • the adhesive facing a cut portion is inhibited from being polymerized due to oxygen inhibition. In some cases, consequently, the substrate processing equipment is contaminated by the adhesive.
  • the cleaning layer should have a modulus of tensile elasticity (in accordance with a test method JIS K7127) of 10 N/mm 2 or more and preferably 10 to 2000 N/mm 2 such that troubles are not made during the sheet cutting. If the modulus of tensile elasticity is set to have such a specific value or more, it is possible to more prevent the adhesive from leaking out of the cleaning layer or defective cutting from being caused during the sheet cutting. Thus, it is possible to manufacture a label sheet for cleaning which is not contaminated by the adhesive in the precutting method.
  • the cleaning layer is cured by an active energy source, resulting in a reduction in an adhesion.
  • a 180° peeling adhesion to a silicon wafer (mirror surface) is 0.20 N/10 mm or less, and preferably approximately 0.010 to 0.10 N/10 mm.
  • the cleaning layer might be bonded to a portion to be cleaned in the equipment during conveyance to make conveyance troubles.
  • the thickness of the cleaning layer is not particularly restricted, it is usually set to be approximately 5 to 100 ⁇ m.
  • a cleaning sheet comprising the cleaning layer including the specific adhesive on one of the surfaces of the base material with the surface thereof protected by a removing film and the other surface provided removably on a separator through an ordinary adhesive layer is caused to have the shape of a label through a processing of cutting the sheet other than the separator after a curing type adhesive acting as the cleaning layer is cured.
  • the cutting method or the processing configuration is not particularly restricted. After punching is carried out in conformity with the shape of a conveying member which will be described below, an unnecessary sheet may be separated and removed to form a label.
  • a cleaning sheet is used in which the specific cleaning layer is provided on one of surfaces of a base material and the other surface side is removably provided on a separator through an ordinary adhesive layer.
  • an ordinary adhesive for example, an acryl based adhesive or a rubber based adhesive
  • the label sheet for cleaning is removed from a separator which will be described below, is bonded to a conveying member such as various substrates through the ordinary adhesive layer and is conveyed as a conveying member having a cleaning function into the equipment to come in contact with a portion to be washed.
  • a conveying member such as various substrates
  • the cleaning can be carried out.
  • the ordinary adhesive layer should have a 180° peeling adhesion to a silicon wafer (mirror surface) of approximately 0.01 to 0.98 N/10 mm, and particularly, approximately 0.01 to 0.5 N/10 mm because the substrate is not removed during the conveyance but can be easily removed again after the cleaning.
  • the base material supporting the cleaning layer is not particularly restricted, examples of the base material include a plastic film such as polyethylene, polyethylene terephthalate, acetylcellulose polycarbonate, polypropylene, polyimide, polyamide or polycarbodiimide.
  • the thickness of the base material is usually set to approximately 10 to 100 ⁇ m.
  • the separator according to the invention is not particularly restricted and examples thereof include polyolefin such as polyester, polypropylene, polybutene, polybutadiene or polymethyl pentene which is removed with a silicone based, long chain alkyl based, fluorine based, fatty acid amide based or silica based remover, and a plastic film formed of polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene terephthalate, polyurethane, ethylene-vinylacetate copolymer, ionomer resin, ethylene-(metha)acrylate copolymer, ethylene-(metha)acrylic ester compolyer, polystyrene or polycarbonate.
  • polyolefin such as polyester, polypropylene, polybutene, polybutadiene or polymethyl pentene which is removed with a silicone based, long chain alkyl based, fluorine based, fatty acid amide based or
  • conveying member to which the label sheet for cleaning is to be bonded is not particularly restricted, examples of the conveying member include a semiconductor wafer, a substrate for a flat panel display such as an LCD or a PDP and a substrate such as a compact disk or an MR head.
  • FIG. 6 is a plan view showing an example of a conveying member having a cleaning function according to the invention in which a label A for cleaning is provided on a conveying member W such as a wafer so that the shape of the label A is smaller than that of the conveying member W and is not protruded from the end of the conveying member W.
  • the label A includes a cleaning layer 3 on one of surfaces of a base material 2 and an ordinary adhesive layer 4 on the other surface, and is provided on the conveying member W through the adhesive layer 4 .
  • FIG. 7 shows an example of a label sheet for cleaning which is to be used for the conveying member having a cleaning function according to the invention wherein a plurality of labels A for cleaning are continuously provided on an elongated separator 1 at regular intervals.
  • the shape of the label A is smaller than that of the conveying member W of FIG. 6.
  • the label A includes a cleaning layer 3 on one of surfaces of a base material 2 , a separating film 5 on a surface thereof, and an ordinary adhesive layer 4 on the other surface as shown in FIG. 8 (a sectional view taken along a line VIII-VIII in FIG. 7) and is removaly provided on the separator 1 through the adhesive layer 4 .
  • the label A for cleaning is removed from the separator 1 and is bonded to the conveying member W such as a semiconductor wafer, and furthermore, the separating film 5 is removed and the label A for cleaning is thus conveyed into an equipment. Consequently, a portion to be washed can be cleaned.
  • the shape of the label A is not particularly restricted if it is smaller than the shape of the conveying member W, and a circular shape, a wafer shape and a frame shape can be taken depending on the shape of the conveying member such as a substrate to be bonded, for example.
  • the ordinary adhesive solution was coated to have a thickness of 10 ⁇ m after drying over the removed surface of a separator formed of an elongated polyester film (a thickness of 38 ⁇ m, a width of 250 mm) having one of surfaces treated with a silicone based remover, an elongated polyolefin film (a thickness of 25 ⁇ m, a width of 250 mm) was provided on an adhesive layer, and furthermore, an adhesive solution of an ultraviolet curing type was coated over the film to have a thickness of 40 ⁇ m after drying. Thus, a sheet was obtained.
  • a cleaning layer of the cleaning sheet was bonded to the mirror surface of a silicon wafer with a width of 10 mm and a 180° peeling adhesion to the silicon wafer was measured in accordance with JIS Z0237. As a result, a 180° peeling adhesion of 0.078 N/10 mm was obtained.
  • the cleaning layer of the cleaning sheet had a modulus of tensile elasticity of 49 N/mm 2 .
  • the modulus of tensile elasticity was measured in accordance with a test method JIS K7127.
  • a surface resistivity was measured over the cleaning layer with a surface resistivity measuring equipment (produced by Mitsubishi Chemical Corporation, Type of MCP-UP450) at a temperature of 23° C. and a humidity of 60% RH. As a result, 9.99 ⁇ 10 13 ⁇ / ⁇ or more was obtained and the measurement could not be carried out.
  • the label for cleaning was removed from the separator of the label sheet for cleaning thus obtained and was bonded to the back face (mirror surface) of the silicon wafer having a size of 8 inches with a hand roller.
  • a cleaning wafer for conveyance having a cleaning function was fabricated.
  • a cleaning sheet was fabricated in the same manner as that in the first embodiment except that ultraviolet rays having a central wavelength of 365 nm were irradiated with an integral light quantity of 150 mJ/cm 2 .
  • An adhesion to a silicon wafer was measured. As a result, an adhesion of 0.33 N/10 mm was obtained.
  • a cleaning wafer for conveyance which was fabricated from the cleaning sheet in the same method as that in the embodiment was conveyed into a substrate processing equipment having a wafer stage to which 18000 foreign matters stuck. As a result, the cleaning wafer was fastened to the wafer stage and could not be conveyed.
  • the ordinary adhesive solution was coated to have a thickness of 10 ⁇ m after drying over the removed surface of a separator formed of an elongated polyester film (a thickness of 38 ⁇ m, a width of 250 mm) having one of surfaces treated with a silicone based remover, an elongated polyester film (a thickness of 25 ⁇ m, a width of 250 mm) was provided on the adhesive layer, and furthermore, an adhesive solution of an ultraviolet curing type was coated over the film to have a thickness of 40 ⁇ m after drying.
  • an adhesive layer was provided as a cleaning layer, and the removed surface of a removing film formed of the elongated polyester film (a thickness of 38 ⁇ m, a width of 250 mm) having one of surfaces treated with a silicone based remover was bonded to the surface of the adhesive layer.
  • a removing film formed of the elongated polyester film (a thickness of 38 ⁇ m, a width of 250 mm) having one of surfaces treated with a silicone based remover was bonded to the surface of the adhesive layer.
  • a sheet was obtained.
  • the label for cleaning was removed from the separator of the label sheet for cleaning thus obtained and was bonded to the back face (mirror surface) of a silicon wafer having a size of 8 inches (200 mm) with a hand roller.
  • a cleaning wafer for conveyance having a cleaning function was fabricated.
  • the label sheet for cleaning was bonded to the back face (mirror surface) of the silicon wafer having a size of 8 inches through a label tape bonding machine (produced by NITTO SEIKI INC.: trade name of NEL-GR3000). This operation was carried out continuously for 25 sheets. As a result, the sheet could be bonded to the wafer without a problem. Thus, a cleaning wafer for conveyance having a cleaning function could be fabricated. Moreover, the cleaning wafer for conveyance having a cleaning function thus obtained was confirmed, and it was found that all the label sheets are bonded to the inside of the silicon wafer and were not protruded from the end of the wafer.
  • the cleaning layer was bonded to the mirror surface of the silicon wafer with a width of 10 mm and a 180° peeling adhesion to the silicon wafer was measured in accordance with JIS Z0237. As a result, the 180° peeling adhesion to the silicon wafer was 0.078 N/10 mm.
  • a cleaning wafer for conveyance having a cleaning function was fabricated in the same manner as that in the second embodiment except that a label sheet for cleaning obtained through punching into a circular shape having a diameter of 202 mm was used. The wafer was confirmed through a microscope and it was found that the label sheet for cleaning was protruded from the outer peripheral portion of the silicon wafer.
  • a separating film on the cleaning layer side of the cleaning wafer for conveyance was removed and was set onto a wafer cassette to be conveyed into a substrate processing equipment. Consequently, the protruded label sheet came in contact with the internal wall of the cassette and the cleaning wafer itself for conveyance was shifted from a regular position in the wafer cassette. Therefore, the conveyance could not be carried out. Accordingly, the conveyance using the cleaning wafer for conveyance was stopped.
  • the ordinary adhesive solution was coated to have a thickness of 10 ⁇ m after drying over the removed surface of a separator formed of an elongated polyester film (a thickness of 38 ⁇ m, a width of 250 mm) having one of surfaces treated with a silicone based remover, an elongated polyester film (a thickness of 25 ⁇ m, a width of 250 mm) was provided on the adhesive layer, and furthermore, an adhesive solution of an ultraviolet curing type was coated over the film to have a thickness of 40 ⁇ m after drying.
  • an adhesive layer was provided as a cleaning layer, and the removed surface of a removing film formed of the elongated polyester film (a thickness of 38 ⁇ m, a width of 250 mm) having one of surfaces treated with a silicone based remover was bonded to the surface of the adhesive layer.
  • a removing film formed of the elongated polyester film (a thickness of 38 ⁇ m, a width of 250 mm) having one of surfaces treated with a silicone based remover was bonded to the surface of the adhesive layer.
  • a sheet was obtained.
  • the cleaning layer of the sheet for cleaning had a modulus of tensile elasticity of 49 N/mm 2 after the curing through the irradiation of the ultraviolet rays, that is, the sheet punching.
  • the modulus of tensile elasticity was measured in accordance with a test method JIS K7127.
  • the label for cleaning was removed from the separator of the label sheet having a cleaning function thus obtained and was bonded to the back face (mirror surface) of a silicon wafer having a size of 8 inches with a hand roller. Thus, a cleaning wafer for conveyance having a cleaning function was fabricated.
  • the label sheet having a cleaning function By using the label sheet having a cleaning function, the label was bonded to the back face (mirror surface) of the silicon wafer having a size of 8 inches through a label tape bonding machine (produced by NITTO SEIKI INC.: trade name of NEL-GR3000). This operation was carried out continuously for 25 sheets. As a result, the sheet could be bonded to the wafer without a problem. Thus, a cleaning wafer for conveyance having a cleaning function could be fabricated. Moreover, the cleaning layer was bonded to the mirror surface of the silicon wafer with a width of 10 mm and a 180° peeling adhesion to the silicon wafer was measured in accordance with JIS Z0237. As a result, the 180° peeling adhesion to the silicon wafer was 0.078 N/10 mm.
  • a cleaning sheet was fabricated in the same manner as that in the third embodiment except that ultraviolet rays having a central wavelength of 365 nm were not irradiated on the cleaning sheet with an integral light quantity of 1000 mJ/cm 2 .
  • the sheet was cut through punching into a circular shape having a diameter of 200 mm in the same manner as that in the embodiment.
  • a label sheet having a cleaning function was fabricated.
  • the cleaning layer was not cured, it served as a cushioning material. Consequently, a punching depth was not uniform so that a large number of punching defects of the label were generated.
  • the label thus fabricated was observed and it was found that an adhesive leaked out of the end of the label.
  • the adhesive stuck onto a removing film around the cleaning layer side at the end of the label.
  • the ultraviolet rays having a central wavelength of 365 nm were irradiated with an integral light quantity of 1000 mJ/cm 2 .
  • the adhesive on the end of the label was not cured due to oxygen inhibition but had tackiness. Accordingly, the fabrication of a cleaning wafer for conveyance using the label sheet was stopped.
  • conveyance in a substrate processing equipment can be carried out reliably and foreign matters sticking into the equipment can be removed easily and reliably. Furthermore, since sheet cutting is not required after bonding to a substrate, a working efficiency can be enhanced and a cut refuse is not generated.

Landscapes

  • Cleaning In General (AREA)
  • Adhesive Tapes (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
US10/297,184 2001-04-09 2001-05-08 Label sheet for cleaning and conveying member having cleaning function Abandoned US20040007252A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US13/117,842 US20110229675A1 (en) 2001-04-09 2011-05-27 Label sheet for cleaning and conveying member having cleaning function
US13/117,707 US20110229697A1 (en) 2001-04-09 2011-05-27 Label sheet for cleaning and conveying member having cleaning function
US14/319,416 US20140311525A1 (en) 2001-04-09 2014-06-30 Label sheet for cleaning and conveying member having cleaning function
US14/319,411 US9131829B2 (en) 2001-04-09 2014-06-30 Label sheet for cleaning and conveying member having cleaning function

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2001-109405 2001-04-09
JP2001109405A JP3981243B2 (ja) 2001-04-09 2001-04-09 クリーニング機能付き搬送部材、及びこれに用いるクリーニング用ラベルシ―ト
JP2001-111791 2001-04-10
JP2001111791A JP4173649B2 (ja) 2001-04-10 2001-04-10 クリーニング機能付きラベルシ―トの製造方法
PCT/JP2001/003850 WO2002083332A1 (fr) 2001-04-09 2001-05-08 Feuille d'etiquettes pour nettoyer et acheminer un element ayant une fonction de nettoyage

Related Parent Applications (1)

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PCT/JP2001/003850 A-371-Of-International WO2002083332A1 (fr) 2001-04-09 2001-05-08 Feuille d'etiquettes pour nettoyer et acheminer un element ayant une fonction de nettoyage

Related Child Applications (2)

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US13/117,707 Division US20110229697A1 (en) 2001-04-09 2011-05-27 Label sheet for cleaning and conveying member having cleaning function
US13/117,842 Continuation US20110229675A1 (en) 2001-04-09 2011-05-27 Label sheet for cleaning and conveying member having cleaning function

Publications (1)

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US20040007252A1 true US20040007252A1 (en) 2004-01-15

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US10/297,184 Abandoned US20040007252A1 (en) 2001-04-09 2001-05-08 Label sheet for cleaning and conveying member having cleaning function
US13/117,842 Abandoned US20110229675A1 (en) 2001-04-09 2011-05-27 Label sheet for cleaning and conveying member having cleaning function
US13/117,707 Abandoned US20110229697A1 (en) 2001-04-09 2011-05-27 Label sheet for cleaning and conveying member having cleaning function
US14/319,411 Expired - Fee Related US9131829B2 (en) 2001-04-09 2014-06-30 Label sheet for cleaning and conveying member having cleaning function
US14/319,416 Abandoned US20140311525A1 (en) 2001-04-09 2014-06-30 Label sheet for cleaning and conveying member having cleaning function

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US13/117,842 Abandoned US20110229675A1 (en) 2001-04-09 2011-05-27 Label sheet for cleaning and conveying member having cleaning function
US13/117,707 Abandoned US20110229697A1 (en) 2001-04-09 2011-05-27 Label sheet for cleaning and conveying member having cleaning function
US14/319,411 Expired - Fee Related US9131829B2 (en) 2001-04-09 2014-06-30 Label sheet for cleaning and conveying member having cleaning function
US14/319,416 Abandoned US20140311525A1 (en) 2001-04-09 2014-06-30 Label sheet for cleaning and conveying member having cleaning function

Country Status (7)

Country Link
US (5) US20040007252A1 (fr)
EP (1) EP1377394B1 (fr)
KR (1) KR100687995B1 (fr)
CN (1) CN1254317C (fr)
DE (1) DE60132021T2 (fr)
MY (1) MY137666A (fr)
WO (1) WO2002083332A1 (fr)

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Masashi Yamamoto et al., "Adhesive label sheet for semiconductor wafer", English translation of JP 2000-221888, 08/11/2000. *
Yamamoto, Masashi et al., "Adhesive Label Sheet For Semiconductor Wafer", machine translation of Japanese patent application publication No. 2000-221888, publication date of the application 08/11/2000. *

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US20050048241A1 (en) * 2001-12-19 2005-03-03 Yoshio Terada Cleaning sheet and process for cleaning substrate treatment device using same
US7575790B2 (en) * 2001-12-19 2009-08-18 Nitto Denko Corporation Cleaning sheet and process for cleaning substrate treatment device using same
US20040204334A1 (en) * 2003-04-14 2004-10-14 Nitto Denko Corporation Cleaning sheet, carrying member with a cleaning function and method of cleaning substrate processing equipment
US8539631B2 (en) 2004-07-09 2013-09-24 The Procter & Gamble Company Roller for providing benefits to fabric
US7841036B2 (en) 2004-07-09 2010-11-30 The Procter & Gamble Company Hand-held roller device with cover for providing benefits to fabrics
US20080257381A1 (en) * 2004-10-07 2008-10-23 Klaus Winterscheidt Use of Polyvinyl Acetate Dispersions for Cleaning Purposes
USD545065S1 (en) 2005-01-10 2007-06-26 The Procter & Gamble Company Cover for an adhesive roller
USD573798S1 (en) 2005-01-10 2008-07-29 The Procter & Gamble Company Adhesive roller with cover
US20080115681A1 (en) * 2006-11-20 2008-05-22 Shirley Lee Cleaning device for a printing mechanism
US11235611B2 (en) * 2012-03-23 2022-02-01 Documotion Research, Inc. Methods of making paper and labels
US11760118B2 (en) 2012-03-23 2023-09-19 Documotion Research, Inc. Methods of making paper and labels
US10183472B2 (en) 2015-07-07 2019-01-22 Meltec Corporation Producing method of part with adhesive, and part with adhesive
CN111498434A (zh) * 2019-01-30 2020-08-07 日东电工株式会社 清洁片及带清洁功能的输送构件

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EP1377394B1 (fr) 2007-12-19
US9131829B2 (en) 2015-09-15
KR100687995B1 (ko) 2007-02-27
US20140311666A1 (en) 2014-10-23
CN1433342A (zh) 2003-07-30
DE60132021T2 (de) 2008-04-10
KR20030007909A (ko) 2003-01-23
US20110229697A1 (en) 2011-09-22
MY137666A (en) 2009-02-27
US20110229675A1 (en) 2011-09-22
CN1254317C (zh) 2006-05-03
US20140311525A1 (en) 2014-10-23
WO2002083332A1 (fr) 2002-10-24
DE60132021D1 (de) 2008-01-31
EP1377394A1 (fr) 2004-01-07

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