US20070190879A1 - Double glass cloth, and prepreg and substrate for printed wiring board using the glass cloth - Google Patents

Double glass cloth, and prepreg and substrate for printed wiring board using the glass cloth Download PDF

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Publication number
US20070190879A1
US20070190879A1 US10/588,784 US58878405A US2007190879A1 US 20070190879 A1 US20070190879 A1 US 20070190879A1 US 58878405 A US58878405 A US 58878405A US 2007190879 A1 US2007190879 A1 US 2007190879A1
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United States
Prior art keywords
glass cloth
side structure
prepreg
back side
weave
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Abandoned
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US10/588,784
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English (en)
Inventor
Yoshinori Gondoh
Makoto Someya
Yasuyuki Kimura
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Asahi Schwebel Co Ltd
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Asahi Schwebel Co Ltd
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Assigned to ASAHI-SCHWEBEL CO., LTD. reassignment ASAHI-SCHWEBEL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GONDOH, YOSHINORI, KIMURA, YASUYUKI, SOMEYA, MAKOTO
Publication of US20070190879A1 publication Critical patent/US20070190879A1/en
Abandoned legal-status Critical Current

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Classifications

    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
    • D03D15/20—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads
    • D03D15/242—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads inorganic, e.g. basalt
    • D03D15/267—Glass
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D1/00—Woven fabrics designed to make specified articles
    • D03D1/0082—Fabrics for printed circuit boards
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D11/00—Double or multi-ply fabrics not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • D—TEXTILES; PAPER
    • D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B2101/00—Inorganic fibres
    • D10B2101/02—Inorganic fibres based on oxides or oxide ceramics, e.g. silicates
    • D10B2101/06—Glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]

Definitions

  • the present invention relates to a glass cloth used for a printed wiring board.
  • a double sided printed wiring board is normally manufactured following the steps below.
  • a base material such as a glass cloth is impregnated with varnish made of thermo-setting resin such as epoxy resin and a solvent, heated and dried to thereby create a prepreg.
  • varnish made of thermo-setting resin such as epoxy resin and a solvent
  • a circuit pattern formation step a circuit pattern made of copper foil is created on both sides of the coppered laminated sheet through photolithography and etching or plating.
  • a through hole processing step through holes are formed using a drill or laser and electrical connections of both sides are secured through a publicly known step such as electroless copper plating. It is generally known that due to the heat and pressure in the above described stacking step or in the circuit pattern formation step, part of the copper foil is etched out and the dimension of the coppered laminated sheet is thereby changed.
  • a multilayer printed wiring board through a sequential molding method using the above described double sided printed wiring board as a core substrate, by overlaying the above described single prepreg or plurality of prepregs on the surface layer, pasting the copper foil on both sides of the laminated sheet obtained, heating and pressing, and hardening and adhering the laminated sheet.
  • a possible technique therefor may be to increase the number of layers of a build-up multilayer printed wiring board using the above described sequential molding method, but a batch molding method is often used in recent years whereby double sided printed wiring boards are stacked together with an interconnecting body interposed in between, heated and pressed, and cured and adhered all at once.
  • interconnecting prepreg For the prepreg which becomes an interconnecting body (hereinafter referred to as “interconnecting prepreg” when the prepreg used to manufacture a core substrate and the prepreg which becomes the interconnecting body need to be distinguished), it is possible to form a through hole (interstitial via hole or inner via hole, abbreviated as an “IVH”) right below a part land or between arbitrary layers by filling the IVH with a conductor such as conductive paste. For this reason, there are proposals of a multilayer printed wiring board having a total layer IVH structure capable of realizing a size reduction of the substrate and high density mounting.
  • Patent Document 1 defines the above described three-dimensional structured woven fabric as a cloth made up of fiber in the longitudinal direction, fiber in the lateral direction and fiber in the thickness direction, and more specifically describes a structure in which layers of fibers arrayed in parallel in the longitudinal direction and layers of fibers arrayed in parallel in the lateral direction are alternately stacked one atop another and fibers in the thickness direction are passed so as to weave gaps in the vertical direction which exist between the fibers in the longitudinal direction and fibers in the lateral direction.
  • Patent Document 2 does not describe any specific three-dimensional glass structure. According to the description of Patent Document 1, the coefficient of thermal expansion in the Z direction of the printed wiring board using the three-dimensional glass is estimated to be approximately 1 ⁇ 3 of a conventional example using plain weave glass. Though not described in Patent Document 1, the rigidity of a printed wiring board using the three-dimensional glass is expected to be higher than that of the conventional example.
  • the three-dimensional glass also has a problem that the distribution of the amount of glass in the thickness direction drastically varies from one place to another.
  • differences in the distribution of the amount of glass in the thickness direction cause variations in the shape of holes.
  • fiber-opening process is known to have an effect in reducing the above described variations.
  • the above described three-dimensional glass since fibers in the thickness direction are arrayed and constrained on the same line in the vertical direction, even if fiber-opening process is applied, it is difficult to eliminate the variations. Because of these problems, the above described three-dimensional glass is not used as a base material for the printed wiring board.
  • a core substrate it is a general practice to use a technique of creating the substrate by stacking a plurality of prepregs using an available thinnest glass cloth, applying hot/pressure molding thereto to achieve high rigidity.
  • a core substrate of 100 ⁇ m in thickness is created, if the glass content is the same, a core substrate made up of two prepregs of 50 ⁇ m in thickness has higher rigidity than a core substrate made up of a single prepreg of 100 ⁇ m in thickness.
  • a core substrate created of three prepregs of 33 ⁇ m in thickness is more preferable.
  • a prepreg using an extremely thin glass cloth has poor yield of operability in the manufacturing step and causes a cost increase with an increase in the number of glass cloths used, which is not desirable.
  • the core substrate consisting of the above described plurality of stacked prepregs improves rigidity, it has no effect on the reduction of the coefficient of thermal expansion in the Z direction.
  • the “one-sided combination structure” is a weave using two or more types of yarn for any one of warp and weft
  • the weft backed weave is a combination structure created using one type of warp and two types of weft.
  • the face weave is woven with warps and face side wefts
  • the back weave is woven with warps and back side wefts.
  • the warp backed weave is similar to the weft backed weave with only the longitudinal/lateral relationship is inverted.
  • the glass cloth described in Patent Document 4 provides satin weave with fewer crosses between warps and wefts to reduce crimp of woven fabric and also provides a one-sided combination structure to cancel differences between the face and back sides of satin weave.
  • satin weave has a weak binding force between yarns, is liable to bowed filling and not suitable for a thin glass cloth.
  • the present inventors have made every effort to solve the above described problems focusing attention to the woven structure of a glass cloth made up of warps and wefts and consequently have come to complete the present invention by discovering that using a double glass cloth having a double structure with two glass cloths stacked one atop the other and the two bound into a woven structure as a substrate makes it possible to stably obtain a prepreg having rigidity equivalent to that of two prepregs stacked and molded using one glass cloth and also reduce variations in dimensional stability and the coefficient of thermal expansion in the thickness direction.
  • the first aspect of the present invention is a double glass cloth for a printed wiring board, characterized in that it is composed of warps and wefts and has a double structure comprising a face side structure and a back side structure, wherein said face side structure and said back side structure are bound with a woven structure into one piece.
  • the double glass cloth is preferably made up of the face side structure that consists of face side warps which only weave the face side structure, face side wefts which only weave the face side structure and common yarns which weave both the face side structure and the back side structure, and the back side structure that consists of back side warps which only weave the back side structure, back side wefts which only weave the back side structure and the common yarns which weave both the face side structure and the back side structure.
  • the double glass cloth is more preferably made up of the face side structure and back side structure each having a plain weave.
  • the double glass cloth is most preferably made up of the face side structure and back side structure bound together at a rate of at least one location per unit structure.
  • the second aspect of the present invention is a prepreg for a printed wiring board comprising the glass cloth in the first aspect of the invention and a semi-cured matrix resin.
  • the third aspect of the present invention is a substrate for a printed wiring board formed by heating, pressing and curing the prepreg in the second aspect of the invention.
  • the fourth aspect of the present invention is a method of manufacturing a printed wiring board comprising a step of stacking a single prepreg or a plurality of prepregs in the second aspect of the invention, pasting copper foil on both sides of the laminated sheet obtained, heating, pressing and curing the laminated sheet to thereby create a coppered laminated sheet, a step of creating a circuit pattern made of copper foil on both sides of the coppered laminated sheet and a step of forming through holes and securing electrical connections between the circuit patterns on both sides.
  • the printed wiring board molded with the prepregs using the glass cloth of the present invention provides excellent productivity and rigidity and has the effect of being able to reduce variations in the amount of dimensional change and reduce a coefficient of thermal expansion in the thickness direction.
  • FIG. 1 shows three side views showing the woven structure of a glass cloth according to Examples 1 to 3;
  • FIG. 2 is a weave diagram of the glass cloth according to Examples 1 to 3;
  • FIG. 3 is a weave diagram of a glass cloth according to Example 4.
  • FIG. 4 is a weave diagram of a glass cloth according to Example 5.
  • FIG. 5 is a weave diagram of a glass cloth according to Example 6.
  • FIG. 6 is a weave diagram of a glass cloth according to Example 7.
  • the glass cloth of the present invention is a double glass cloth having a double structure with two stacked glass cloths consisting of warps and wefts and with the two cloths bound with a woven structure into one piece.
  • the “cloth having a double structure” is made up of two single structures stacked in the vertical direction and simultaneously woven, and a face side structure which becomes a face side is made up of face side warps and face side wefts, while a back side structure which becomes a back side is made up of back side warps and back side wefts.
  • Such a woven structure has the face side structure and back side structure bound together, and has therefore the effect of being able to reduce a coefficient of thermal expansion in the thickness direction.
  • the cloth having a double structure is different from the cloth having a one-sided combination structure described in aforementioned Patent Document 4 in that at least two types of warps and two types of wefts are used.
  • warps on the face side and back side be of the same type of yarn and wefts on the face side and back side be of the same type of yarn and it is more preferable that warps and wefts be of the same type of yarn, but all these may also be of different types of yarn.
  • a preferred example of the cloth in a double structure is a double glass cloth in which the face side structure consist of face side warps which only weave the face side structure, face side wefts which only weave the face side structure and common yarns which weave both the face side structure and the back side structure, while the back side structure consists of back side warps which only weave the back side structure, back side wefts which only weave the back side structure and the common yarns which weave both the face side structure and the back side structure.
  • the common yarn constitutes a woven structure which binds the face side structure and the back side structure or part thereof and can be composed of only warps or only wefts or both warps and wefts.
  • Adopting such a woven structure considerably reduces the number of overlapping of crossover points of warps and wefts at which the face side structure and back side structure overlay with each other and has an effect of excellent boring workability.
  • two extremely thin plain weave glass cloths are simply overlaid with each other, two types of areas are produced irregularly, areas where the glass cloths overlay with each other in the vertical direction and areas where the glass cloths overlay with each other by being alternately dislocated.
  • neighboring yarns are basically divided into upper and lower parts, and therefore when viewed from the surface, yarns are uniformly arranged, providing excellent uniformity in the plane direction in the drilling and laser work or the like.
  • the double glass cloth of the present invention as two continuous layers of glass cloths having a multilayer structure of triple or higher level of weaving is also preferable from the standpoint of improvement of rigidity.
  • Both the face side structure and back side structure of the double glass cloth of the present invention preferably have a plain weave as a basis with a woven structure for binding both structures added thereto.
  • the plain weave has an excellent force of binding of warps and wefts compared to a twill weave and satin weave having low binding forces and it is possible to maintain a regular woven structure of also a glass cloth made up of thin yarns liable to bowed filling of cloth and suppress variations in dimensional stability.
  • connection it is preferable to continuously or partially bind over the entire width of the cloth at one or more points and more preferable to uniformly arrange binding points over the entire surface of the cloth and make them sink and float in the vertical direction as with the surrounding structure as much as possible.
  • a cloth of hollow weave is well known, but the hollow weave is bound with a woven structure only at an end and cannot be said to be a mode preferable for the purpose of a double glass cloth for a printed wiring board of the present invention.
  • the “case where binding points are uniformly arranged” means that the face side structure and back side structure are bound at a rate of at least one location per unit structure. This makes it possible to increase the cloth binding force, suppress the bowed filling and further reduce variations in dimensional changes.
  • the reinforcement effect in the thickness direction is also increased, and therefore it is also possible to reduce the coefficient of thermal expansion in the thickness direction which is advantageous in improvement of reliability of inter-layer connections of a multilayer printed wiring board.
  • the total thickness of the two layers of the double glass cloth according to the present invention is preferably 10 ⁇ m or more and 400 ⁇ m or less, more preferably 10 ⁇ m or more and 200 ⁇ m or less, and especially when the total thickness is 10 ⁇ m or more and 100 ⁇ m or less, it is possible to effectively improve the workability and quality of an extremely thin glass cloth when the thickness per layer is, for example, 50 ⁇ m or less, which is preferable.
  • the glass yarn preferably has a single fiber having a nominal diameter of 3 (diameter of approximately 3.0 ⁇ m) or more specified by JIS R3413 and nominal diameter of 7 (diameter of approximately 7.0 ⁇ m) or less and more preferably a nominal diameter of 3 (diameter of approximately 3.0 ⁇ m) or more and nominal diameter of 6 (diameter of approximately 6.0 ⁇ m) or less.
  • a glass yarn for composition it is preferable to use a glass yarn subjected to twisting with a twist number per inch of 0 to 1.0 and more preferable to use a low twisted yarn with a twist number of 0 to 0.2 (hereinafter a low twisted yarn with a twist number of 0 will be referred to as “non-twisted yarn”). Or it is also possible to use a glass cloth whose twist number per inch is reduced to 0.2 or less by performing weaving while untwisting normal twisted yarns.
  • Reducing the twist number causes the section of a yarn to approximate to a flat shape, and therefore it is possible to reduce in-plane gaps of a double glass cloth, increase uniformity in the amount of glass distribution in the plane direction and simultaneously suppress the amount of warpage or torsion of the substrate due to a force of restoring twisting of the glass yarn.
  • the fiber-opening processing makes it possible to improve an impregnation characteristic of resin varnish, increase uniformity between glass and matrix resin and improve thermal resistance or the like.
  • the average length of the smaller side of the gap enclosed by warps and wefts (hereinafter referred to as “gap length”) is preferably between 0 ⁇ m and 50 ⁇ m and more preferably between 0 ⁇ m and 30 ⁇ m.
  • the gap length is between 0 ⁇ m and 50 ⁇ m, it is possible to improve quality of holes worked using a drill or laser.
  • Examples of the fiber-opening processing include fiber-opening by a water flow pressure, fiber-opening by vibration of high frequency using a liquid as a medium, working with a pressure of a liquid having a contact pressure and working under a pressure using a roll or the like. Applying the fiber-opening processing causes single fibers in a bundle of yarn to be spread out.
  • opening by a water flow pressure or fiber-opening by vibration of high frequency using a liquid as a medium is preferable in terms of uniformity.
  • a glass cloth with an organic compound displaying a lubricant characteristic stuck to the glass yarn or a binder used to weave a normal glass cloth or glass cloth with a textile size or the like stuck thereto (hereinafter referred to as “greige fabric”), it is possible to further increase the effect of making single fibers in a bundle of yarn spread out by combining fiber-opening processing and twisting reduction.
  • fiber-opening processing is applied to the double glass cloth of the present invention, it is more preferable to prevent the face side and back side from being generated in each layer of the double glass cloth using a method of applying fiber-opening processing from both sides, for example.
  • E glass non-alkali glass
  • low dielectric constant glass such as D glass
  • high-strength glass such as S glass
  • high dielectric constant glass such as H glass or the like.
  • silane coupling agent commonly used as the silane coupling agent and add acid, dye, pigment, surface activating agent or the like as required.
  • the prepreg of the present invention can be manufactured following an established method.
  • the glass cloth of the present invention is impregnated with varnish which is obtained by diluting matrix resin such as epoxy resin with an organic solvent, then an organic solvent is volatilized in a drying furnace, thermo-setting resin is cured to a B stage condition (semi-cured condition) and a resin-impregnated prepreg can be thereby created.
  • varnish which is obtained by diluting matrix resin such as epoxy resin with an organic solvent
  • an organic solvent is volatilized in a drying furnace
  • thermo-setting resin is cured to a B stage condition (semi-cured condition) and a resin-impregnated prepreg can be thereby created.
  • it is preferable to minimize tension which is applied to the glass cloth because in this way it is possible to obtain a prepreg with excellent dimensional stability.
  • examples of matrix resin include thermo-setting resin such as unsaturated polyester resin, polyimide resin, BT resin, cyanate resin or thermoplastic resin such as PPO resin, polyether-imide resin, fluorine resin or resin made of a mixture thereof. Furthermore, it is also possible to use resin mixed with inorganic filler such as aluminum hydroxide.
  • the amount of matrix resin stuck to the glass cloth is preferably determined so that the mass of the varnish solid content is 20% to 80% with respect to the total mass of the varnish solid content and glass cloth.
  • metal foil for the above described prepreg with metal foil copper foil is normally used, but aluminum foil can also be used.
  • Metal foil of 3 ⁇ m to 100 ⁇ m in thickness is preferably used though it depends on the applications.
  • a printed wiring board using the prepreg of the present invention can be manufactured following the method shown in the background art and related publicly known techniques.
  • a double sided printed wiring board through a step of stacking a single or a plurality of prepregs of the present invention, pasting copper foil to both sides of the laminated sheet obtained and heating and pressing it to create a cured coppered laminated sheet, a step of creating a circuit pattern made up of copper foil on both sides of the coppered laminated sheet and a step of forming through holes and securing electrical connections between circuit patterns of both sides.
  • the prepreg of the present invention is subjected to boring using a laser to form IVHs, IVHs are filled with conductive paste, interconnecting prepregs for IVH connection are manufactured, the interconnecting prepregs are overlaid with a double sided printed wiring board or double sided conductive wiring sheet alternately, and molded with heat and pressure into a multilayer printed wiring board.
  • the heating temperature is preferably 100° C. to 230° C.
  • the pressure is preferably 1 MPa to 5 MPa and the multilayer printed wiring board is preferably kept under this condition for 0.5 to 2.0 hours.
  • the method of forming IVHs in the prepreg of the present invention using a laser methods using a carbon dioxide laser, YAG laser or excimer laser or the like can be used as appropriate. Furthermore, before and after heating, pressing and IVH work using a laser, it is also possible to paste an organic film or the like to the prepreg to protect or improve workability of the prepreg.
  • the organic film in this case, a polyethylene terephthalate film, polypropylene film, polyethylene film, fluorinated polyethylene film or the like can be used.
  • conductive paste of various publicly known materials such as copper, silver.
  • the glass cloth was observed using a microscope, pictures of the surface were taken, 20 gaps enclosed by warps and wefts were measured and a mean value of the length of the smaller side of each gap was considered as the gap length of the glass cloth.
  • the glass cloth was impregnated with epoxy resin varnish prepared at the following blending ratio, extra resin varnish was scraped off with slits corresponding to approximately twice the thickness of each glass cloth, dried for three minutes at 170° C. and a prepreg was thereby obtained.
  • One or four prepregs of 340 mm long, 340 mm wide obtained using the above described method of creating a prepreg were stacked one atop another, 12 ⁇ m copper foil was placed on both sides, heated and pressed for an hour at 175° C. and 3.9 MPa, cured and thereby a 1-ply substrate (one prepreg was stacked) for evaluations of dimensional stability and rigidity and a 4-ply substrate (four prepregs were stacked) for evaluation of coefficient of thermal expansion were obtained.
  • the thickness of the glass cloth in Comparative Example 1 which will be described later, is approximately half that of Example 1 and 2 and Comparative Example 2 and the thickness of the glass cloth in Comparative Example 4 is approximately half that of Examples 3 to 7 and Comparative Example 3 and 5, a substrate for evaluations of dimensional stability and rigidity was created using a 2-ply substrate (two prepregs were stacked) and a substrate for evaluation of coefficient of thermal expansion was created using an 8-ply substrate (8 prepregs were stacked).
  • copper foil was removed using etching processing, heated for 30 minutes at 170° C. and then the distances between the bench marks were measured again (measured value b).
  • the ratio (%) of the difference between measured value a and measured value b to measured value a was designated as a rate of dimensional change.
  • a mean value of six measured values (referred to as “average of rate of dimensional change” in Table 1 and Table 2 which will be described later) and absolute values of values obtained by subtracting a minimum value from a maximum value of the six measured values of the rate of dimensional change (referred to as “variation of rate of dimensional change” in Table 1 and Table 2 which will be described later) were calculated in the longitudinal direction and lateral direction respectively.
  • the 4-ply substrate (8-ply substrate in Comparative Examples 1 and 4) obtained using the above described method of creating a substrate was rid of copper foil through etching processing, cut into a substrate of 10 mm per side and the coefficient of thermal expansion between 50° C. to 100° C. was measured using TMA/SS6100 manufactured by Seiko Instruments Inc.
  • FIG. 1 shows three side views showing the woven structure of the glass cloth and FIG. 2 shows a weave diagram.
  • the number of binding points per unit structure is 2 (two) in this structure.
  • the woven structure of the glass cloth is constructed of a plain weave face side structure made up of face side warps and face side wefts, a plain weave back side structure made up of back side warps and back side wefts and common yarns for binding both structures of the face side structure and back side structure, and the face side structure is overlaid on the back side structure with the one dislocated from the other and bound together with two common yarns per unit structure.
  • D450 described above is a symbol which is an abbreviation of ECD450 of JIS R3413, “D” means a nominal diameter 5 (the same applies hereafter).
  • D450 1/0 non-twist yarn (yarn with 0 twists/inch) was used for warps and wefts, two single-piece cloths with one overlaid on the other were woven simultaneously using an air jet loom at a density of 90 warps/25 mm, 90 wefts/25 mm and using double yarns in both the longitudinal and lateral directions, and the upper and lower cloths were basically woven into a plain weave.
  • Example 1 Except in that to bind these upper and lower cloths, two of six warps were twill-woven, with four wefts bound with one warp, two wefts dislocated, four wefts bound with the other warp, and in this way greige fabric of glass cloth with one woven structure was obtained, the same method as that in Example 1 was used to obtain a surface treated glass cloth and this was then used as a prepreg in Example 2 using the above described method of creating a prepreg.
  • the woven structure of the glass cloth and weave diagram are the same as those of the glass cloth in Example 1.
  • Table 1 the variation in the amount of dimensional change, amount of deflection and coefficient of thermal expansion in the Z direction of the substrate obtained using the prepreg were small.
  • D900 1/0 1.0Z was used for warps and wefts
  • two single-piece cloths with one overlaid on the other were woven simultaneously using an air jet loom at a density of 112 warps/25 mm, 112 wefts/25 mm and using double yarns in both the longitudinal and lateral directions
  • the upper and lower cloths were basically woven into a plain weave.
  • Example 2 Except in that to bind these upper and lower cloths, two of six warps were twill-woven, with four wefts bound with one warp, two wefts dislocated, four wefts bound with the other warp, and in this way greige fabric of glass cloth with one woven structure was obtained, the same method as that in Example 1 was used to obtain a surface treated glass cloth and this was then used as a prepreg in Example 3 using the above described method of creating a prepreg.
  • the woven structure of the glass cloth and weave diagram are the same as those of the glass cloth in Example 1.
  • Table 2 the variation in the amount of dimensional change, amount of deflection and coefficient of thermal expansion in the Z direction of the substrate obtained using the prepreg were small.
  • Example 2 As a glass cloth, D900 1/0 1.0Z was used for warps and wefts, two single-piece cloths with one overlaid on the other were woven simultaneously using an air jet loom at a density of 112 warps/25 mm, 112 wefts/25 mm and using double yarns in both the longitudinal and lateral directions, and the upper and lower cloths were basically woven into a plain weave as the glass cloth shown in the weave diagram in FIG. 3 .
  • the same method as that in Example 1 was used to obtain a surface treated glass cloth and this was then used as a prepreg in Example 4 using the above described method of creating a prepreg. As is evident from the evaluation result shown in Table 2, the variation in the amount of dimensional change, amount of deflection and coefficient of thermal expansion in the Z direction of the substrate obtained using the prepreg were small.
  • the present invention can improve productivity in steps of creating a prepreg and a multilayer printed wiring board and reduce variations in the amount of dimensional change and coefficient of thermal expansion in the thickness direction, can thereby be suitably used in the field of printed wiring boards.

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  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Woven Fabrics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
US10/588,784 2004-02-09 2005-02-08 Double glass cloth, and prepreg and substrate for printed wiring board using the glass cloth Abandoned US20070190879A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004032162 2004-02-09
JP2004-032162 2004-10-22
PCT/JP2005/001832 WO2005075724A1 (fr) 2004-02-09 2005-02-08 Double tissu de verre textile, et preimpregne et substrat pour planche de câblage imprimé utilisant le tissu de verre textile

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US20070190879A1 true US20070190879A1 (en) 2007-08-16

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US (1) US20070190879A1 (fr)
EP (1) EP1722018A4 (fr)
JP (1) JP4536010B2 (fr)
KR (1) KR100844233B1 (fr)
CN (1) CN1926270B (fr)
TW (1) TWI292445B (fr)
WO (1) WO2005075724A1 (fr)

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US20080006062A1 (en) * 2006-07-07 2008-01-10 Gerald Thomas Lien Sleeve bearing assembly and method of construction
US20080006061A1 (en) * 2006-07-07 2008-01-10 James Benjamin B Sleeve bearing assembly and method of construction
US20080271806A1 (en) * 2002-09-20 2008-11-06 Asahi-Schwebel Co., Ltd. Glass cloth and film substrate using the same
US20100116530A1 (en) * 2008-11-13 2010-05-13 Toru Okazaki Multilayered wiring board
US20100259910A1 (en) * 2006-03-30 2010-10-14 Kyocera Corporation Circuit Board and Mounting Structure
US20130126219A1 (en) * 2011-11-22 2013-05-23 Samsung Electronics Co., Ltd. Multi-ply circuit board with fiber bundles
US20140099488A1 (en) * 2011-06-24 2014-04-10 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
EP3241417A4 (fr) * 2014-12-31 2018-08-15 Elbit Systems Ltd. Régulation thermique de composants de carte de circuit imprimé
CN114207203A (zh) * 2019-12-16 2022-03-18 旭化成株式会社 玻璃布、预浸料和印刷电路板
US20240179837A1 (en) * 2022-11-30 2024-05-30 Corning Incorporated Continuous silica fiber reinforced composites for high-frequency printed circuit board and methods of making
US20250048549A1 (en) * 2023-08-01 2025-02-06 Dell Products L.P. Fiber weave in a printed circuit board substrate

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100699769B1 (ko) 2006-11-24 2007-03-28 차기철 경사 및 위사의 연결방법으로 재직되는 블라인드
KR101475597B1 (ko) * 2013-04-11 2014-12-22 주식회사 루디아 삼중직 누비 직물 제직방법
WO2016031637A1 (fr) * 2014-08-25 2016-03-03 有限会社ケプラ Objet façonné retardateur de flamme comprenant un matériau tissé en 3d et procédé de production
JP6020764B1 (ja) * 2016-08-03 2016-11-02 日東紡績株式会社 ガラスクロス

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US5175034A (en) * 1989-02-01 1992-12-29 Parabeam Industrie- En Handelsonderneming B.V. Double cloth
US6020049A (en) * 1997-12-02 2000-02-01 Cucinotta; Anthony J Product for producing viaholes in reinforced laminates and the related method for manufacturing viaholes
US6325110B1 (en) * 1999-03-31 2001-12-04 Gividi Italia S.P.A. Woven fabric reinforcement to optimize dimensional stability
US20030104182A1 (en) * 2001-11-30 2003-06-05 Richard Dow Method for manufacturing a printed circuit board substrate

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JPH04135986U (ja) * 1991-06-10 1992-12-17 鐘紡株式会社 複合材料用繊維構造物
JPH07202362A (ja) * 1993-12-28 1995-08-04 Toshiba Corp 熱可塑性樹脂プリント配線基板
JP2001055642A (ja) * 1999-08-12 2001-02-27 Nitto Boseki Co Ltd 樹脂補強用クロス及びそれを用いた積層板
TW532050B (en) * 2000-11-09 2003-05-11 Matsushita Electric Industrial Co Ltd Circuit board and method for manufacturing the same

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US4590539A (en) * 1985-05-15 1986-05-20 Westinghouse Electric Corp. Polyaramid laminate
US5175034A (en) * 1989-02-01 1992-12-29 Parabeam Industrie- En Handelsonderneming B.V. Double cloth
US5102725A (en) * 1991-04-01 1992-04-07 Jps Converter And Industrial Fabric Corp. Dual layer composite fabric
US6020049A (en) * 1997-12-02 2000-02-01 Cucinotta; Anthony J Product for producing viaholes in reinforced laminates and the related method for manufacturing viaholes
US6325110B1 (en) * 1999-03-31 2001-12-04 Gividi Italia S.P.A. Woven fabric reinforcement to optimize dimensional stability
US20030104182A1 (en) * 2001-11-30 2003-06-05 Richard Dow Method for manufacturing a printed circuit board substrate

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080271806A1 (en) * 2002-09-20 2008-11-06 Asahi-Schwebel Co., Ltd. Glass cloth and film substrate using the same
US7640951B2 (en) * 2002-09-20 2010-01-05 Asahi-Schwebel Co., Ltd. Glass cloth and film substrate using the same
US20100259910A1 (en) * 2006-03-30 2010-10-14 Kyocera Corporation Circuit Board and Mounting Structure
US8446734B2 (en) * 2006-03-30 2013-05-21 Kyocera Corporation Circuit board and mounting structure
US8464427B2 (en) 2006-07-07 2013-06-18 Federal-Mogul World Wide, Inc. Sleeve bearing assembly and method of construction
US20110219618A1 (en) * 2006-07-07 2011-09-15 Gerald Thomas Lien Sleeve bearing assembly and method of construction
US8021051B2 (en) * 2006-07-07 2011-09-20 Federal-Mogul World Wide, Inc. Sleeve bearing assembly and method of construction
US8152380B2 (en) 2006-07-07 2012-04-10 Federal-Mogul World Wide, Inc. Sleeve bearing assembly and method of construction
US20080006061A1 (en) * 2006-07-07 2008-01-10 James Benjamin B Sleeve bearing assembly and method of construction
US20080006062A1 (en) * 2006-07-07 2008-01-10 Gerald Thomas Lien Sleeve bearing assembly and method of construction
US8217271B2 (en) * 2008-11-13 2012-07-10 Panasonic Corporation Multilayered wiring board
US20100116530A1 (en) * 2008-11-13 2010-05-13 Toru Okazaki Multilayered wiring board
US20140099488A1 (en) * 2011-06-24 2014-04-10 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
US20130126219A1 (en) * 2011-11-22 2013-05-23 Samsung Electronics Co., Ltd. Multi-ply circuit board with fiber bundles
EP3241417A4 (fr) * 2014-12-31 2018-08-15 Elbit Systems Ltd. Régulation thermique de composants de carte de circuit imprimé
CN114207203A (zh) * 2019-12-16 2022-03-18 旭化成株式会社 玻璃布、预浸料和印刷电路板
US20240179837A1 (en) * 2022-11-30 2024-05-30 Corning Incorporated Continuous silica fiber reinforced composites for high-frequency printed circuit board and methods of making
US20250048549A1 (en) * 2023-08-01 2025-02-06 Dell Products L.P. Fiber weave in a printed circuit board substrate
US12501546B2 (en) * 2023-08-01 2025-12-16 Dell Products L.P. Fiber weave in a printed circuit board substrate

Also Published As

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EP1722018A1 (fr) 2006-11-15
KR100844233B1 (ko) 2008-07-07
JPWO2005075724A1 (ja) 2007-10-11
CN1926270B (zh) 2012-07-04
CN1926270A (zh) 2007-03-07
KR20060123618A (ko) 2006-12-01
TW200528595A (en) 2005-09-01
EP1722018A4 (fr) 2010-03-03
WO2005075724A1 (fr) 2005-08-18
JP4536010B2 (ja) 2010-09-01
TWI292445B (en) 2008-01-11

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