US3849906A - Rotary fluid applicator - Google Patents

Rotary fluid applicator Download PDF

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Publication number
US3849906A
US3849906A US00413753A US41375373A US3849906A US 3849906 A US3849906 A US 3849906A US 00413753 A US00413753 A US 00413753A US 41375373 A US41375373 A US 41375373A US 3849906 A US3849906 A US 3849906A
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US
United States
Prior art keywords
disk
workpiece
fluid
chamber
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00413753A
Other languages
English (en)
Inventor
H Hansen
R Straub
E Tuczynski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Priority to US00413753A priority Critical patent/US3849906A/en
Priority to DE2442309A priority patent/DE2442309A1/de
Priority to IT27459/74A priority patent/IT1022104B/it
Priority to FR7433122A priority patent/FR2249717B1/fr
Priority to JP49113971A priority patent/JPS5074857A/ja
Priority to CA211,477A priority patent/CA1035574A/fr
Priority to GB47076/74A priority patent/GB1482106A/en
Application granted granted Critical
Publication of US3849906A publication Critical patent/US3849906A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements for supplying or controlling air or other gases for drying solid materials or objects
    • F26B21/50—Ducting arrangements from the source of air or other gases to the materials or objects being dried

Definitions

  • ABSTRACT Apparatus for applying a fluid medium to a workpiece comprising a chamber and a pair of rotatably mounted disks in the chamber. A workpiece is suspended in the chamber and the disks are provided with a plurality of apertures therein to create a flow of fluid media from one surface of the disk at an oblique angle to the workpiece. The disks are provided with blade-like scallops or notches along their periphery so that a fluid medium applied thereto will effect rotation thereof to create relative movement between the disk and the workpiece.
  • the present invention relates to apparatus for applying a fluid medium to a workpiece, and more particu larly relates to a rotary drier.
  • Driers for small workpieces to dispel fluid or the like therefrom are old in the art, and range from the simple expedient of the application of heated air or nitrogen, depending upon the surface coating of the workpiece or the composition thereof, to very elaborate schemes for the application of a drying medium to the work piece.
  • Another object of the present invention is to provide a novel drier for drying workpiece in which the flow of drying medium against the workpiece is oblique to the surface thereof.
  • Yet another object of the present invention is to provide a novel drier for semiconductor wafers which more efficiently and in less time is able to dispel liquids from the surface of the wafer by providing a flow of drying medium against the surface thereof oblique to the surface of the wafer.
  • Yet another object of the present invention is to pro vide novel apparatus for applying a fluid medium to a workpiece which apparatus may be oriented in either the vertical or horizontal plane so as to easily accommodate any desired placement of the article.
  • Yet another object of the present invention is to provide a novel apparatus which may be duplicated on the opposite side of the workpiece so as to uniformly dry or apply other fluid media to opposite sides of the workpiece.
  • FIG. 1 is a fragmentary sectional view in side elevation of apparatus constructed in accordance with the present invention.
  • FIG. 2 is a fragmentary sectional view taken along line 2-2 of FIG. 1.
  • the apparatus comprises a chamber 11 having a workpiece entry port 12 at one end thereof and a fluid medium discharge port 13 at the other end thereof.
  • the means comprises a wheel or disk 16 having a first major surface 16A and second major surface 168 coupled to and mounted for rotation on an axle 17.
  • the first major surface 16A of the wheel or disk 16 includes a plurality of angulated slots or apertures 17 therein which are connected through passageways 18 to a conduit 19 centrally located in the axle 17.
  • the axle 17, as shown, is mounted for rotation :in the side wall of a housing 20 as by a sleeve bearing 21.
  • a supply of fluid media, such as air or nitrogen, is applied to the conduit 19 by suitable piping 22 which passes through a conduit extension 23 located in a housing extension 24.
  • the coupling of the conduit extension 23 to the conduit 19 is such as to allow a small amount of the fluid media to escape and pass through and out a media drain 25, located in the housing extension 24.
  • the peripheral edge 16C of the second major surface 168 of the disk 16 is provided with spaced scallops 26 which are aligned for registration with a nozzle 27 through the housing 20, to permit impingement of a second source of fluid media (not shown) against the scallops 26 thereby effecting rotation of the disk 16.
  • the scallops in effect are small blades forming part of a turbine wheel thereby causing the necessary rotation to the disk.
  • This struc ture also permits the wheel or disk 16 to be fitted into the chamber without elaborate labyrinth seals, and permits the discharge of the fluid media, after impingement upon the blade-like scallops, about the periphery of the wheel 16 and into the chamber.
  • an identical structure including a wheel or disk 30 may be mounted on the opposite side of the workpiece, the disk including a rear major surface having scallops 31 thereon to impart rotation to the wheel, while providing a source of fluid media as described above against the rear surface of the workpiece 15.
  • the workpiece holder 14 may take one of several forms, none of which are critical to the proper operation of the apparatus. When operated in horizontal plane the flow of media will aid in suspending the workpiece and thus only means to prevent inadvertent displacement along the axis of the chamber Ill is required.
  • the holder for silicon wafers may comprise a pair of arms 14A and 148 which may be separated and brought together to clamp the wafer 15 along its periphery in the present instance at three points.
  • the rotation of one or more disks or wheels when used as a drier effects rapid and uniform drying of the surface of a workpiece such as a semiconductor wafer inasmuch as the provision of a fluid source to create a flow of fluid against the workpiece oblique to the surface thereof tends to drive off any liquids or fluid on the workpiece surface.
  • the apparatus of the present invention provides for a uniform and quick application of fluids to a workpiece.
  • Apparatus for applying a fluid medium to a workpiece comprising: a chamber; a rotatably mounted disk in said chamber; means for suspending a workpiece in said chamber adjacent said disk, a plurality of angulated slots in the surface of said disk to provide a flow of fluid media from one surface of said disk at an oblique angle to said workpiece, and scallops on said disk, and means to provide a flow of fluid me dium against said scallops to effect a rotation of said disk as said fluid is ejected from said one surface thereof.
  • Apparatus in accordance with claim 1 including internal passageways in said disk and connected to said slots, and conduit means connected to said passageways to provide said fluid medium to said slots.
  • Apparatus in accordance with claim 3 including scallops on said second disk, and means to provide a flow of fluid medium against said scallops to effect rotation of said second disk.
  • Apparatus for applying a fluid to a workpiece comprising: a chamber having a workpiece entry port and a fluid discharge port; means for suspending a workpiece in said chamber; a disk including an axle and mounted for rotation in said chamber; said disk'having a first major surface and a second major surface; a plurality of angulated slots in said first major surface thereof, and means providing a source of fluid medium through said slots directed towards said worpiece, nozzle means, and means on said disk in registry with said nozzle means whereby a flow of fluid through said nozzle means effects rotation of said wheel to thereby create a flow of fluid against said workpiece oblique to the surface thereof.
  • Apparatus in accordance with claim 5 including internal passageways in said disk and connected to said slots, and conduit means connected to said passageways to provide said fluid medium to said slots.
  • Apparatus in accordance with claim 9 including scallops on said second disk, and means to provide a flow of fluid medium against said scallops to effect rotation of said second disk.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Spray Control Apparatus (AREA)
  • Coating Apparatus (AREA)
US00413753A 1973-11-07 1973-11-07 Rotary fluid applicator Expired - Lifetime US3849906A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
US00413753A US3849906A (en) 1973-11-07 1973-11-07 Rotary fluid applicator
DE2442309A DE2442309A1 (de) 1973-11-07 1974-09-04 Vorrichtung zum trocknen von kleinen gegenstaenden
IT27459/74A IT1022104B (it) 1973-11-07 1974-09-19 Apparecchiatura per applicare un agente fluido ad un pezzo in la vorazione
FR7433122A FR2249717B1 (fr) 1973-11-07 1974-09-25
JP49113971A JPS5074857A (fr) 1973-11-07 1974-10-04
CA211,477A CA1035574A (fr) 1973-11-07 1974-10-16 Applicateur rotatif de fluide
GB47076/74A GB1482106A (en) 1973-11-07 1974-10-30 Apparatus for applying fluid to a workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00413753A US3849906A (en) 1973-11-07 1973-11-07 Rotary fluid applicator

Publications (1)

Publication Number Publication Date
US3849906A true US3849906A (en) 1974-11-26

Family

ID=23638474

Family Applications (1)

Application Number Title Priority Date Filing Date
US00413753A Expired - Lifetime US3849906A (en) 1973-11-07 1973-11-07 Rotary fluid applicator

Country Status (7)

Country Link
US (1) US3849906A (fr)
JP (1) JPS5074857A (fr)
CA (1) CA1035574A (fr)
DE (1) DE2442309A1 (fr)
FR (1) FR2249717B1 (fr)
GB (1) GB1482106A (fr)
IT (1) IT1022104B (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4429983A (en) 1982-03-22 1984-02-07 International Business Machines Corporation Developing apparatus for exposed photoresist coated wafers
US4736529A (en) * 1985-01-30 1988-04-12 Carl Kramer Device for the uniform application of gas on a plane surface
US4767317A (en) * 1985-01-26 1988-08-30 Carl Kramer Apparatus for mixing a gas main flow with at least one gas subflow
CN110603629A (zh) * 2017-02-06 2019-12-20 平面半导体公司 亚纳米级光基基板清洁机构
CN110603628A (zh) * 2017-02-06 2019-12-20 平面半导体公司 处理污水的去除
CN110622290A (zh) * 2017-02-06 2019-12-27 平面半导体公司 亚纳米级基板清洁机构
US20210402424A1 (en) * 2020-06-30 2021-12-30 Universal Circuit Board Equipment Co., Ltd. Surface treatment device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5417640A (en) * 1977-07-08 1979-02-09 Mitsubishi Electric Corp Malfunction preventive device for integrated circuit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2532494A (en) * 1946-11-23 1950-12-05 Mcgraw Electric Co Method of making paper tubes
US2602003A (en) * 1946-10-30 1952-07-01 Willard Storage Battery Co Rotating apparatus for blowing loose foreign material from articles

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2602003A (en) * 1946-10-30 1952-07-01 Willard Storage Battery Co Rotating apparatus for blowing loose foreign material from articles
US2532494A (en) * 1946-11-23 1950-12-05 Mcgraw Electric Co Method of making paper tubes

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4429983A (en) 1982-03-22 1984-02-07 International Business Machines Corporation Developing apparatus for exposed photoresist coated wafers
US4767317A (en) * 1985-01-26 1988-08-30 Carl Kramer Apparatus for mixing a gas main flow with at least one gas subflow
US4736529A (en) * 1985-01-30 1988-04-12 Carl Kramer Device for the uniform application of gas on a plane surface
EP0189855A3 (en) * 1985-01-30 1988-09-21 Carl Prof.Dr.-Ing. Kramer Apparatus for evenly directing a gas towards a flat surface
EP3577682A4 (fr) * 2017-02-06 2020-11-25 Planar Semiconductor, Inc. Mécanisme de nettoyage de substrat à base de lumière à niveau sous-nanométrique
US11069521B2 (en) 2017-02-06 2021-07-20 Planar Semiconductor, Inc. Subnanometer-level light-based substrate cleaning mechanism
CN110622290A (zh) * 2017-02-06 2019-12-27 平面半导体公司 亚纳米级基板清洁机构
EP3577681A4 (fr) * 2017-02-06 2020-11-25 Planar Semiconductor, Inc. Élimination d'effluents de traitement
CN110603629A (zh) * 2017-02-06 2019-12-20 平面半导体公司 亚纳米级光基基板清洁机构
US10892172B2 (en) * 2017-02-06 2021-01-12 Planar Semiconductor, Inc. Removal of process effluents
US10985039B2 (en) 2017-02-06 2021-04-20 Planar Semiconductor, Inc. Sub-nanometer-level substrate cleaning mechanism
CN110603628A (zh) * 2017-02-06 2019-12-20 平面半导体公司 处理污水的去除
US20210313173A1 (en) * 2017-02-06 2021-10-07 Planar Semiconductor Corporation Pte. Ltd. Subnanometer-level light-based substrate cleaning mechanism
US11830726B2 (en) * 2017-02-06 2023-11-28 Planar Semiconductor Corporation Pte. Ltd. Subnanometer-level light-based substrate cleaning mechanism
TWI770115B (zh) * 2017-02-06 2022-07-11 新加坡商平面半導體公司 加工汙水之去除
CN110603628B (zh) * 2017-02-06 2023-11-07 平面半导体公司 处理污水的去除
CN110622290B (zh) * 2017-02-06 2023-11-07 平面半导体公司 亚纳米级基板清洁机构
US20210402424A1 (en) * 2020-06-30 2021-12-30 Universal Circuit Board Equipment Co., Ltd. Surface treatment device

Also Published As

Publication number Publication date
DE2442309A1 (de) 1975-05-22
CA1035574A (fr) 1978-08-01
JPS5074857A (fr) 1975-06-19
IT1022104B (it) 1978-03-20
GB1482106A (en) 1977-08-03
FR2249717B1 (fr) 1976-12-31
FR2249717A1 (fr) 1975-05-30

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