USRE41361E1 - Method for connecting microchips to an antenna arranged on a support strip for producing a transponder - Google Patents

Method for connecting microchips to an antenna arranged on a support strip for producing a transponder Download PDF

Info

Publication number
USRE41361E1
USRE41361E1 US11/318,385 US31838503A USRE41361E US RE41361 E1 USRE41361 E1 US RE41361E1 US 31838503 A US31838503 A US 31838503A US RE41361 E USRE41361 E US RE41361E
Authority
US
United States
Prior art keywords
carrier tape
chip module
antennas
chip
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US11/318,385
Other languages
English (en)
Inventor
Volker Brod
Ludger Overmeyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Muehlbauer GmbH and Co KG
Original Assignee
Muehlbauer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7682676&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=USRE41361(E1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Muehlbauer GmbH and Co KG filed Critical Muehlbauer GmbH and Co KG
Application granted granted Critical
Publication of USRE41361E1 publication Critical patent/USRE41361E1/en
Assigned to Muehlbauer GmbH & Co. KG, MUEHLBAUER AG reassignment Muehlbauer GmbH & Co. KG CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: MUEHLBAUER AG
Assigned to Muehlbauer GmbH & Co. KG reassignment Muehlbauer GmbH & Co. KG CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY DATA PREVIOUSLY RECORDED AT REEL: 035524 FRAME: 0563. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Assignors: MUEHLBAUER AG
Adjusted expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna

Definitions

  • the invention relates to a method of connecting micro-chips to antennas arranged on a first carrier tape for the manufacture of a transponder.
  • This type of transponder which, for example, are used for smart labels or smart cards, exhibit a flat antenna coil, which is fitted with two connections.
  • the antennas can be manufactured from various materials, such as, for example, copper, aluminium, silver conducting paste, etc.
  • the size of the antennas can vary depending on the application.
  • the flat antenna coils are applied to a carrier tape which is wound onto a reel.
  • the micro-chips have been connected to the antennas on the carder tape through a complex bonding process. This requires that the carrier tape exhibiting the antennas passes via an indexer and is at standstill during the bonding process. Apart from the fact that the bonding process demands complicated machines and extremely precise operation, the bonding process currently takes up to 15 seconds.
  • transponders This relatively high time requirement is in conflict with the economical manufacture of the transponders.
  • a method of manufacturing transponders is, for example, described in DE-A 199 15 765, in which semiconductor chips and the antenna are applied to the flat side of a thermoplastic foil, whereby the foil is connected to an endless foil tape. It is also known from DE-A 199 16 781 how to apply single chips to sheets of laminate.
  • the object of this invention is to further develop a method of the type mentioned at the beginning which enables transponders to be manufactured more simply, faster and, above all, more economically.
  • micro-chips are packaged in a chip module with electrical connections in a preceding bonding process and applied to a second carrier tape such that the two carrier tapes are unwound from the reel and brought one over the other, whereby the chip modules are taken from the second carrier tape and placed at a predetermined position on the first carrier tape, whereby also the tape speed of the second carrier tape is, at least at the time of placement of the chip module, adapted to the tape speed of the first carrier tape.
  • Shifting the bonding process to a preceding process has the advantage that the chip module produced in this manner can be applied substantially quicker and easier to the first carrier tape fitted with the antennas. It is possible to solder or crimp the chip module to the antenna which, on one hand, is substantially quicker and, on the other hand, demands less precision than a bonding process.
  • the manufacturing speed can be further increased in that both carrier tapes are unwound from the reel and brought one over the other and at the time of placement of the chip module on the first carrier tape, the speeds of both carrier tapes are adjusted. Consequently, it is not necessary that the carrier tapes are at standstill when the chip module is connected to an antenna. The process can therefore run continuously, resulting in a significant increase in the manufacturing speed.
  • the packaging of the micro-chip into a chip module within the framework of a preceding bonding process is substantially easier to implement than the bonding of a micro-chip to an antenna.
  • the packaging of the micro-chip into a chip module can occur at a central point, for example, at the chip manufacturer's premises, so that the procurement by the transponder manufacturer of an expensive bonder requiring highly qualified operating personnel is not needed.
  • the first carrier tape carrying the antennas runs at a continuous speed
  • the second carrier tape runs synchronously with the passing antenna spacing via an index marking which is guided in the first carrier tape.
  • the second carrier tape is briefly accelerated to the tape speed of the first carrier tape for the placement of the chip module on the first carrier tape.
  • the chip module, placed at the correct point in this manner can be electrically connected to the appropriate antennas by soldering or crimping immediately after placement onto the first carrier tape.
  • the transponder manufactured in this manner can be tested using the normal methods.
  • a particularly preferred method is when the chip module, during placement on the first carrier tape, is held on the first carrier tape by an endlessly circulating transponder tape, running at the same speed as the first carrier tape, until the chip module is firmly connected to the appropriate antenna.
  • the transponder tape in effect accepts the chip module supplied by the second carrier tape and ensures that the chip module is held at the correct position in relation to the antenna during the progression of the first carrier tape.
  • soldering of the chip module to the antenna occurs using a laser beam.
  • the transponders manufactured in this way can be rolled up again with the first carrier tape after any necessary testing stage.
  • FIG. 1 shows a first carrier tape carrying antennas
  • FIG. 2 shows a second carrier tape fitted with chip modules
  • FIG. 3 shows a first carrier tape from FIG. 1 with chip modules placed and connected to the antenna terminals
  • FIG. 4 shows a schematic representation of a device for connecting the chip modules of the second carrier tape to the antennas of the first carrier tape.
  • FIG. 1 shows a first carrier tape 1 onto which coils 2 have been applied as antennas.
  • antennas manufactured by electroplated deposition are involved.
  • the coils 2 exhibit two terminals 3 for a chip module.
  • chips modules 4 are shown in FIG. 2 . They are held closely one behind the other on a second carrier tape 5 .
  • the chip modules are packaged by a preceding bonding process into a chip case shown in FIG. 2 .
  • This case exhibits two galvanised terminal pads 6 , the spacing of which corresponds to the terminals of the rectangular coils 2 .
  • FIG. 3 shows a carrier tape 1 with a rectangular coil 2 which has already been complemented with a chip module 4 .
  • the chip module 4 has been soldered to the terminals 3 through its terminal pads 6 .
  • the first carrier tape 1 is rolled onto an input spool 7 and is unrolled from it and wound onto a finish spool 8 after the connection process.
  • the second carrier tape 5 which carries the chip modules 4 is wound from a spool 9 for chip modules, diverted around a diversion roller 10 and wound up onto a residual tape spool 11 .
  • a circulating transport tape 12 begins, or more precisely, the first diversion roller 13 of the transport tape 12 .
  • the transport tape 12 extends above the first carrier tape 1 to a drive roller 14 .
  • a laser solder unit 15 is provided between the diversion roller 13 and the drive roller 14 .
  • a test chip module 16 is provided behind the drive roller 14 .
  • the device functions as follows:
  • the first carrier tape 1 is drawn off with a continuous speed from the input spool 7 and wound onto the finish spool 8 .
  • the second carrier tape 5 carrying the chip modules 4 is drawn off in an indexed manner from the spool 9 in synchronism with the antenna spacing on the first carrier tape 1 and passed around the diversion roller 10 .
  • the chip modules 4 are released, for example, by heating the carrier tape 5 .
  • On the release of the chip module 4 it is taken up both by the first carrier tape 1 and the transport tape 12 which is circulating at the same speed as the first carrier tape 1 .
  • the chip module is here placed with its terminal pads 6 precisely on the terminals 3 of the rectangular coil 2 .
  • the transport tape 12 brings the chip module 4 to this position while it continues to move at the same speed as the first carrier tape 1 . While this is happening, the terminal pads 6 are soldered to the terminals 3 with the aid of the laser solder unit 15 , whereby the laser beam also moves at the tape speed of the carrier tape 1 .
  • the transponders complemented in this manner, are tested with the aid of the test chip module 16 arranged behind the transport tape 12 and thereafter the first carrier tape can be wound up onto the finish spool.
  • the finish spool therefore holds transponders which have already been complemented and testing.
  • RFID Radio Frequency Identification

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Wire Bonding (AREA)
US11/318,385 2001-04-25 2002-03-08 Method for connecting microchips to an antenna arranged on a support strip for producing a transponder Expired - Fee Related USRE41361E1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10120268 2001-04-25
DE10120269A DE10120269C1 (de) 2001-04-25 2001-04-25 Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders
PCT/EP2002/002577 WO2002089051A1 (de) 2001-04-25 2002-03-08 Verfahren zum verbinden von mikrochips mit auf einem trägerband angeordneten antennen zum herstellen eines transponders

Publications (1)

Publication Number Publication Date
USRE41361E1 true USRE41361E1 (en) 2010-06-01

Family

ID=7682676

Family Applications (2)

Application Number Title Priority Date Filing Date
US11/318,385 Expired - Fee Related USRE41361E1 (en) 2001-04-25 2002-03-08 Method for connecting microchips to an antenna arranged on a support strip for producing a transponder
US10/473,697 Ceased US6972394B2 (en) 2001-04-25 2002-03-08 Method for connecting microchips to an antenna arranged on a support strip for producing a transponder

Family Applications After (1)

Application Number Title Priority Date Filing Date
US10/473,697 Ceased US6972394B2 (en) 2001-04-25 2002-03-08 Method for connecting microchips to an antenna arranged on a support strip for producing a transponder

Country Status (7)

Country Link
US (2) USRE41361E1 (de)
EP (1) EP1382010B1 (de)
JP (1) JP2004531887A (de)
KR (1) KR100553412B1 (de)
AT (1) ATE282859T1 (de)
DE (2) DE10120269C1 (de)
WO (1) WO2002089051A1 (de)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468638B2 (en) * 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US7342496B2 (en) 2000-01-24 2008-03-11 Nextreme Llc RF-enabled pallet
US8077040B2 (en) 2000-01-24 2011-12-13 Nextreme, Llc RF-enabled pallet
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
DE10136359C2 (de) * 2001-07-26 2003-06-12 Muehlbauer Ag Verfahren zum Verbinden von Mikrochipmodulen mit auf einem ersten Trägerband angeordneten Antennen zum Herstellen eines Transponders
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
ATE474444T1 (de) * 2002-05-24 2010-07-15 Koninkl Philips Electronics Nv Verfahren zur übertragung von einem an einen träger befestigten bauelement in eine gewünschte lage auf einen träger und einrichtung dafur
WO2004039551A2 (en) 2002-08-02 2004-05-13 Avery Dennison Corporation Process and apparatus for microreplication
DE10235771A1 (de) * 2002-08-05 2004-02-26 Texas Instruments Deutschland Gmbh Gekapselter Chip und Verfahren zu seiner Herstellung
US7224280B2 (en) 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US6940408B2 (en) 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
JP3739752B2 (ja) 2003-02-07 2006-01-25 株式会社 ハリーズ ランダム周期変速可能な小片移載装置
US7225992B2 (en) * 2003-02-13 2007-06-05 Avery Dennison Corporation RFID device tester and method
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US7242996B2 (en) * 2003-03-25 2007-07-10 Id Solutions, Inc. Attachment of RFID modules to antennas
US6857552B2 (en) * 2003-04-17 2005-02-22 Intercard Limited Method and apparatus for making smart card solder contacts
DE10358422B3 (de) * 2003-08-26 2005-04-28 Muehlbauer Ag Verfahren zur Herstellung von Modulbrücken
US20060289979A1 (en) * 2003-08-26 2006-12-28 God Ralf Bridge modules for smart labels
JP2007503635A (ja) * 2003-08-26 2007-02-22 ミュールバウアー アーゲー モジュールブリッジ製造方法
JP4742526B2 (ja) * 2003-12-26 2011-08-10 シンフォニアテクノロジー株式会社 Ｉｃチップ実装体の製造方法及び製造装置
ATE426215T1 (de) * 2004-01-31 2009-04-15 Atlantic Zeiser Gmbh Verfahren zur herstellung von kontaklosen chip- karten
US8640325B2 (en) * 2004-02-04 2014-02-04 Bielomatik Leuze Gmbh & Co.Kg Method of continuously producing electronic film components
DE102004006457A1 (de) * 2004-02-04 2005-08-25 Bielomatik Leuze Gmbh + Co Kg Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile
US7384496B2 (en) * 2004-02-23 2008-06-10 Checkpoint Systems, Inc. Security tag system for fabricating a tag including an integrated surface processing system
DE102004027787A1 (de) * 2004-06-08 2006-01-05 Infineon Technologies Ag Halbleiterbauteile mit Kunststoffgehäuse und Verfahren zur Herstellung derselben
TWI288885B (en) * 2004-06-24 2007-10-21 Checkpoint Systems Inc Die attach area cut-on-fly method and apparatus
US7549591B2 (en) * 2004-06-28 2009-06-23 International Barcode Corporation Combined multi-frequency electromagnetic and optical communication system
US7284704B2 (en) * 2004-06-28 2007-10-23 International Barcode Corporation Combined electromagnetic and optical communication system
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7385284B2 (en) * 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
US20060109130A1 (en) * 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
DE602005024861D1 (de) 2004-12-03 2010-12-30 Hallys Corp Zwischenglied-bondierungseinrichtung
CN101073297A (zh) * 2004-12-03 2007-11-14 哈里斯股份有限公司 电子部件的制造方法及电子部件的制造装置
JP4810531B2 (ja) 2005-04-06 2011-11-09 株式会社 ハリーズ 電子部品の製造装置
CN101160597A (zh) * 2005-04-18 2008-04-09 哈里斯股份有限公司 电子零件及该电子零件的制造方法
US7623034B2 (en) * 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7842156B2 (en) 2005-04-27 2010-11-30 Avery Dennison Corporation Webs and methods of making same
US7749350B2 (en) 2005-04-27 2010-07-06 Avery Dennison Retail Information Services Webs and methods of making same
DE102006007423A1 (de) * 2005-11-17 2007-05-31 Mühlbauer Ag Vorrichtung und Verfahren zum Testen der Lesezuverlässigkeit von Smart Labels
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
DE102006005909A1 (de) * 2006-02-09 2007-08-23 Karl Knauer Kg Produkt mit integriertem Transponder
US7901533B2 (en) * 2006-06-30 2011-03-08 Tamarack Products, Inc. Method of making an RFID article
DE102006050964A1 (de) * 2006-10-28 2008-04-30 Man Roland Druckmaschinen Ag Applikator für elektrische oder elektronische Bauelemente
TWI328191B (en) * 2007-01-24 2010-08-01 Ind Tech Res Inst Method and apparatus for inspecting radio frequency identification tag
SE542007C2 (en) * 2017-10-13 2020-02-11 Stora Enso Oyj A method and an apparatus for producing a radio-frequency identification transponder
DE102020001439B3 (de) * 2020-02-21 2021-06-10 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger

Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900257A (en) * 1973-05-03 1975-08-19 Amp Inc Registration device for printed circuits
US4414444A (en) * 1980-02-15 1983-11-08 G. Rau Gmbh & Co. Process for producing a contact element
US4893742A (en) * 1988-12-21 1990-01-16 Hughes Aircraft Company Ultrasonic laser soldering
US5055968A (en) * 1988-07-04 1991-10-08 Sony Corporation Thin electronic device having an integrated circuit chip and a power battery and a method for producing same
US5470411A (en) 1991-02-19 1995-11-28 Gemplus Card International Method for continuous assembly of patterned strips and integrated circuit micromodule obtained by said method
WO1997026621A1 (fr) * 1996-01-17 1997-07-24 Gemplus S.C.A. Module electronique sans contact pour carte ou etiquette
WO1998014904A1 (de) 1996-09-30 1998-04-09 Siemens Aktiengesellschaft appTAKTLOSE CHIPKARTE
DE19709985A1 (de) 1997-03-11 1998-09-17 Pav Card Gmbh Chipkarte, Verbindungsanordnung und Verfahren zum Herstellen einer Chipkarte
US5826328A (en) * 1996-03-25 1998-10-27 International Business Machines Method of making a thin radio frequency transponder
US5867102A (en) * 1997-02-27 1999-02-02 Wallace Computer Services, Inc. Electronic article surveillance label assembly and method of manufacture
US5902437A (en) * 1994-03-04 1999-05-11 Flexcon Company Inc. Method of making resonant tag labels
EP0952543A1 (de) 1996-12-17 1999-10-27 Rohm Co., Ltd. Halbleiteranordnung und herstellungsverfahren
US5976391A (en) * 1998-01-13 1999-11-02 Ford Motor Company Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same
DE19912201A1 (de) 1999-01-14 2000-08-17 Pav Card Gmbh Verfahren zur Herstellung einer Ident-Anordnung mit drahtloser Signalübertragung, insbesondere Smart-Label, sowie vorfertigbares streifenförmiges Modul für eine Ident-Anordnung, insbesondere Smart-Label
DE19915765A1 (de) 1999-04-08 2000-10-19 Cubit Electronics Gmbh Kontaktloser Transponder und Verfahren zu seiner Herstellung
DE19916781A1 (de) 1999-04-14 2000-10-26 Austria Card Gmbh Wien Dünn-Transponder-Chip-Karte und Herstellverfahren dazu
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
FR2795203A1 (fr) 1999-06-15 2000-12-22 Gemplus Card Int Module comportant au moins une puce et son interface de communication, objet comportant un module et procede de realisation desdits modules
US6214444B1 (en) * 1993-12-30 2001-04-10 Kabushiki Kaisha Miyake Circuit-like metallic foil sheet and the like and processing for producing them
US6334921B1 (en) * 1998-06-20 2002-01-01 Meto International Gmbh Apparatus and method for manufacturing labels for electronic article surveillance
US6451154B1 (en) * 2000-02-18 2002-09-17 Moore North America, Inc. RFID manufacturing concepts
US20030140487A1 (en) * 2000-03-24 2003-07-31 Andreas Plettner Method for producing a carrier strip comprising a large number of electrical units, each having a chip and contact elements
US6827817B2 (en) * 2001-05-15 2004-12-07 Pittsfield Weaving Co., Inc. Method and apparatus for production of RF labels
US6891110B1 (en) * 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique

Patent Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900257A (en) * 1973-05-03 1975-08-19 Amp Inc Registration device for printed circuits
US4414444A (en) * 1980-02-15 1983-11-08 G. Rau Gmbh & Co. Process for producing a contact element
US5055968A (en) * 1988-07-04 1991-10-08 Sony Corporation Thin electronic device having an integrated circuit chip and a power battery and a method for producing same
US4893742A (en) * 1988-12-21 1990-01-16 Hughes Aircraft Company Ultrasonic laser soldering
US5470411A (en) 1991-02-19 1995-11-28 Gemplus Card International Method for continuous assembly of patterned strips and integrated circuit micromodule obtained by said method
US6214444B1 (en) * 1993-12-30 2001-04-10 Kabushiki Kaisha Miyake Circuit-like metallic foil sheet and the like and processing for producing them
US5902437A (en) * 1994-03-04 1999-05-11 Flexcon Company Inc. Method of making resonant tag labels
WO1997026621A1 (fr) * 1996-01-17 1997-07-24 Gemplus S.C.A. Module electronique sans contact pour carte ou etiquette
US6794727B2 (en) * 1996-01-17 2004-09-21 Gemplus Single receiving side contactless electronic module continuous manufacturing process
US5826328A (en) * 1996-03-25 1998-10-27 International Business Machines Method of making a thin radio frequency transponder
WO1998014904A1 (de) 1996-09-30 1998-04-09 Siemens Aktiengesellschaft appTAKTLOSE CHIPKARTE
EP0952543A1 (de) 1996-12-17 1999-10-27 Rohm Co., Ltd. Halbleiteranordnung und herstellungsverfahren
US5867102A (en) * 1997-02-27 1999-02-02 Wallace Computer Services, Inc. Electronic article surveillance label assembly and method of manufacture
US5867102C1 (en) * 1997-02-27 2002-09-10 Wallace Comp Srvices Inc Electronic article surveillance label assembly and method of manufacture
DE19709985A1 (de) 1997-03-11 1998-09-17 Pav Card Gmbh Chipkarte, Verbindungsanordnung und Verfahren zum Herstellen einer Chipkarte
US5976391A (en) * 1998-01-13 1999-11-02 Ford Motor Company Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same
US6334921B1 (en) * 1998-06-20 2002-01-01 Meto International Gmbh Apparatus and method for manufacturing labels for electronic article surveillance
DE19912201A1 (de) 1999-01-14 2000-08-17 Pav Card Gmbh Verfahren zur Herstellung einer Ident-Anordnung mit drahtloser Signalübertragung, insbesondere Smart-Label, sowie vorfertigbares streifenförmiges Modul für eine Ident-Anordnung, insbesondere Smart-Label
US6891110B1 (en) * 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
DE19915765A1 (de) 1999-04-08 2000-10-19 Cubit Electronics Gmbh Kontaktloser Transponder und Verfahren zu seiner Herstellung
DE19916781A1 (de) 1999-04-14 2000-10-26 Austria Card Gmbh Wien Dünn-Transponder-Chip-Karte und Herstellverfahren dazu
FR2795203A1 (fr) 1999-06-15 2000-12-22 Gemplus Card Int Module comportant au moins une puce et son interface de communication, objet comportant un module et procede de realisation desdits modules
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
US6451154B1 (en) * 2000-02-18 2002-09-17 Moore North America, Inc. RFID manufacturing concepts
US20030140487A1 (en) * 2000-03-24 2003-07-31 Andreas Plettner Method for producing a carrier strip comprising a large number of electrical units, each having a chip and contact elements
US6827817B2 (en) * 2001-05-15 2004-12-07 Pittsfield Weaving Co., Inc. Method and apparatus for production of RF labels
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique

Also Published As

Publication number Publication date
EP1382010B1 (de) 2004-11-17
DE50201574D1 (de) 2004-12-23
US6972394B2 (en) 2005-12-06
JP2004531887A (ja) 2004-10-14
KR20040015054A (ko) 2004-02-18
ATE282859T1 (de) 2004-12-15
WO2002089051A1 (de) 2002-11-07
KR100553412B1 (ko) 2006-02-20
US20040089408A1 (en) 2004-05-13
DE10120269C1 (de) 2002-07-25
EP1382010A1 (de) 2004-01-21

Similar Documents

Publication Publication Date Title
USRE41361E1 (en) Method for connecting microchips to an antenna arranged on a support strip for producing a transponder
US20220164621A1 (en) Method of assembly of articles and intermediate created thereby
JP2681366B2 (ja) 振動回路を形成する回路を含むラベルの製造方法
US20040194876A1 (en) Method for connecting microchip modules to antennas, which are placed on a first supporting strip, in order to produce a transponder
US7141451B2 (en) Wireless communication medium and method of manufacturing the same
EP2788923B1 (de) Verfahren zur herstellung eines antennenelements eines rfid-transponders
EP1755069A1 (de) Dünnes ic-etikett und herstellungsverfahren dafür
US20070132594A1 (en) Electronic device and fabrication method thereof
US7337975B2 (en) Method for producing a contactless ticket comprising a chip
HUT76992A (hu) Eljárás rádiófrekvenciás azonosító toldalék előállítására
US3535780A (en) Continuous process for the production of electrical circuits
JP2008092198A (ja) Ｒｆｉｄラベルタグおよびその製造方法
CN107705976A (zh) 一种线圈的制造方法、线圈、电子设备
US5232463A (en) Apparatus for manufacturing a semiconductor device
JP4809648B2 (ja) 電子装置の製造方法
CN121034965B (zh) Rfid/nfc器件及其制备方法
JPH02212197A (ja) 情報カード製造方法
KR100578688B1 (ko) 내장형 코일안테나의 제조방법
JP2704237B2 (ja) フィルムキャリヤおよびこれを用いたインナリードボンディング方法
JPH0653288A (ja) タブテープ及びタブテープの実装方法

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 8

AS Assignment

Owner name: MUEHLBAUER GMBH & CO. KG, GERMANY

Free format text: CHANGE OF NAME;ASSIGNOR:MUEHLBAUER AG;REEL/FRAME:035524/0563

Effective date: 20140807

Owner name: MUEHLBAUER AG, GERMANY

Free format text: CHANGE OF NAME;ASSIGNOR:MUEHLBAUER AG;REEL/FRAME:035524/0563

Effective date: 20140807

AS Assignment

Owner name: MUEHLBAUER GMBH & CO. KG, GERMANY

Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY DATA PREVIOUSLY RECORDED AT REEL: 035524 FRAME: 0563. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME;ASSIGNOR:MUEHLBAUER AG;REEL/FRAME:036666/0594

Effective date: 20140807

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.)